MODIFIED LAYER REMOVAL METHOD FOR MEASUREMENT OF RESIDUAL STRESS DISTRIBUTION IN THICK PRE-STRETCHED ALUMINUM PLATE

The integrated structure parts are widely used in aircraft. The distortion caused by residual stresses in thick pre-stretched aluminum plates during machining integrated parts is a common and serious problem. To predict and control the machining distortion, the residual stress distribution in the thick plate must be measured firstly. The modified removal method for measuring residual stress in thick pre-stretched aluminum plates is proposed and the stress-strain relation matrix is deduced by elasticity theory. The residual stress distribution in specimen of 7050T7451 plate is measured by using the method, and measurement results are analyzed and compared with data obtained by other methods. The method is effective to measure the residual stress.

Initial residual stress experiment and simulation of thin-walled parts for layer removal method

Thin-walled parts have low stiffness characteristic. Initial residual stress of thin-walled blanks is an important influence factor on machining stability. The present work is to verify the feasibility of an initial residual stress measurement of layer removal method. According to initial residual stress experiment for casting ZL205 A aluminum alloy tapered thin-walled blank by a common method,namely hole-drilling method,three finite element models with initial residual stress are established to simulate the layer removal method in ABAQUS and ANSYS software. By analyzing the results of simulation and experiments,the cutting residual stress inlayer removal process has a significant effect on measurement results. Reducing cutting residual stress is helpful to improve accuracy of layer removal method.

Crystallographic orientation effect on cutting-based single atomic layer removal

The ever-increasing requirements for the scalable manufacturing of atomic-scale devices emphasize the significance of developing atomic-scale manufacturing technology. The mechanism of a single atomic layer removal in cutting is the key basic theoretical foundation for atomic-scale mechanical cutting. Material anisotropy is among the key decisive factors that could not be neglected in cutting at such a scale. In the present study, the crystallographic orientation effect on the cutting-based single atomic layer removal of monocrystalline copper is investigated by molecular dynamics simulation. When undeformed chip thickness is in the atomic scale, two kinds of single atomic layer removal mechanisms exist in cutting-based single atomic layer removal, namely, dislocation motion and extrusion, due to the differing atomic structures on different crystallographic planes. On close-packed crystallographic plane, the material removal is dominated by the shear stress-driven dislocation motion, whereas on non-close packed crystallographic planes, extrusion-dominated material removal dominates. To obtain an atomic, defect-free processed surface, the cutting needs to be conducted on the close-packed crystallographic planes of monocrystalline copper.

A Nickel Coating Removal Process for ITER Superconducting Cables

A new method is developed for removing the nickel coating on ITER superconducting cables by mechanical polishing.The obvious advantage of the mechanical method,which uses a nylon brush,is that there is no chemical residual left in the cable,which would otherwise result in passive effects on the joint resistance.The coating resistance test results of this newly developed method are compared with those of the two other methods that can meet the requirements of ITER.An automatic polishing machine is designed and manufactured for the procedure to provide quality under precise control.This new technique can replace the conventional manual method due to its improved efficiency.

Residual stress with asymmetric spray quenching for thick aluminum alloy plates

Solution and quenching heat treatments are generally carried out in a roller hearth furnace for large-scale thick aluminum alloy plates.However,the asymmetric or uneven spray water flow rate is inevitable under industrial production conditions,which leads to an asymmetric residual stress distribution.The spray quenching treatment was conducted on self-designed spray equipment,and the residual stress along the thickness direction was measured by a layer removal method based on deflections.Under the asymmetric spray quenching condition,the subsurface stress of the high-flow rate surface was lower than that of the low-flow rate surface,and the difference between the two subsurface stresses increased with the increase in the difference in water flow rates.The subsurface stress underneath the surface with a water flow rate of 0.60 m^(3)/h was 15.38 MPa less than that of 0.15 m^(3)/h.The simulated residual stress by finite element(FE)method of the high heat transfer coefficient(HTC)surface was less than that of the low HTC surface,which is consistent with the experimental results.The FE model can be used to analyze the strain and stress evolution and predict the quenched stress magnitude and distribution.

Effect of non-uniform stress characteristics on stress measurement in specimen

There is a remarkable difference in stress distribution between a specimen and a plate removed from the specimen.The plate presents a uniform stress distribution whereas the specimen presents a non-uniform stress distribution.Firstly,the real stress distributions in plates with thickness of 30,40 and 50 mm and then in the specimens were obtained through simulation and X-ray surface stress measurement.Secondly,in order to study the impact of specimens shapes and processing ways on the results accuracy,two irregular shapes (parallelogram and trapezoid) and two processing ways (saw and electron discharge machining (EDM)) were compared and analyzed by simulation and experiment using layer removal method,then the specimen effects on measurement results were evaluated.The results show that:1) the non-uniform stress distribution characteristics of the specimen near the surface of the cut is significant,the range of non-uniform stress distribution is approximately one-thickness distance away from the cut,and it decreases gradually along the depth;2) In order to ensure the stability in the results,it is suitable to take the specimen plane size 2-3 times of its thickness;3) Conventional processing methods have little effect on experimental results and the average deviation is less than 5%.

Bulk Etch Rate of LR 115 Polymeric Radon Detector

In this study, we used strippable LR 115 type 2 which is a Solid State Nuclear Track Detector (SSNTD) widely known for radon gas detection and measurement. The removed thickness of the active layer of samples of this SSNTD, were determined by measuring the average initial thickness (before etching) and residual thickness after 80 to 135 minutes chemical etching in the standard conditions, using an electronic comparator. These results allowed the calculation of the bulk etch rate of this detector in a simple way. The mean value obtained is (3.21 ± 0.21) μm/h. This value is in close agreement with those reported by different authors. It is an important parameter for alpha track counting on the sensitive surface of this polymeric detector after chemical etching because track density depends extremely on its removed layer. This SSNTD was then used for environmental radon gas monitoring in Côte d’Ivoire.