Energy Proficient Reliable Rim Routing Technique for Wireless Heterogeneous Sensor Networks Lifespan Fortification

Sensor nodes are mainly shielded in the field with limited power supply. In Wireless Sensor Networks, there must be a requirement of an efficient power management, because sensor nodes are deployed in unman attended area with non-rechargeable batteries. Power management can be done by different methods of routing protocols. The proposed Reliable Rim Routing (3R) technique is based on hybrid routing protocol for homogeneous and heterogeneous system for WSNs to ameliorate the performance of the overall system. In 3R, total node deployment area can be multipart in terms of rim and in each rim, and some of the sensor nodes transmit their sensed data directly to base station, and meanwhile remaining sensor nodes send the data through clustering technique to base station like SEP. Proposed 3R technique implementation proves its enhanced WSNs lifetime of 70% energy consumption and 40% throughput compared with existing protocols. Simulation and evaluation results outperformed in terms of energy consumption with increased throughput and network lifetime.

Improvement of silicon etching resolution using the confined etchant layer technique

WHEN scanning electrochemical microscopy (SECM) with feedback mode is used to etchcertain surface, the etchant molecules generated at a microelectrode diffuse to the surface andreact therein with the surface species, resulting in local etching pattern. It is noted that theetching resolution of SECM is dominantly determined by the size of the microelectrode.However, many experimental results have shown the significant influence of the lateral diffu-sion of etchant on the etching resolution. Therefore, a thin diffusion layer of the

Photomechanical meta-molecule array for real-time terahertz imaging

Real-time terahertz(THz)imaging offers remarkable application possibilities,especially in the security and medical fields.However,most THz detectors work with scanners,and a long image acquisition time is required.Some thermal detectors can achieve realtime imaging by using a focal plane array but have the drawbacks of low sensitivity due to a lack of suitable absorbing materials.In this study,we propose a novel photomechanical meta-molecule array by conveniently assembling THz meta-atom absorbers and bi-material cantilevers together,which can couple THz radiation to a mechanical deflection of the meta-molecules with high efficiency.By optically reading out the mechanical deflections of all of the meta-molecules simultaneously,real-time THz imaging can be achieved.A polyimide sacrificial layer technique was developed to fabricate the device on a glass wafer,which facilitates the transmission of a readout light while the THz wave radiates onto the meta-molecule array directly from the front side.THz images and video of various objects as well as infrared images of the human body were captured successfully with the fabricated metamolecule array.The proposed photomechanical device holds promise in applications in single and broadband THz as well as infrared imaging.

The coupling effect of slow-rate mechanical motion on the confined etching process in electrochemical mechanical micromachining

By introducing the mechanical motion into the confined etchant layer technique(CELT), we have developed a promising ultraprecision machining method, termed as electrochemical mechanical micromachining(ECMM), for producing both regular and irregular three dimensional(3 D) microstructures. It was found that there was a dramatic coupling effect between the confined etching process and the slow-rate mechanical motion because of the concentration distribution of electrogenerated etchant caused by the latter. In this article, the coupling effect was investigated systemically by comparing the etchant diffusion, etching depths and profiles in the non-confined and confined machining modes. A two-dimensional(2 D) numerical simulation model was proposed to analyze the diffusion variations during the ECMM process, which is well verified by the machining experiments. The results showed that, in the confined machining mode, both the machining resolution and the perpendicularity tolerance of side faces were improved effectively. Furthermore, the theoretical modeling and numerical simulations were proved valuable to optimize the technical parameters of the ECMM process.