Under the surface peeling of Cu- Fe- P lead frame alloy larger Fe particles were observed by energy dispersive spectroscopy. By using the large strain two-dinension plane strain model and elastic plastic finite elemen...Under the surface peeling of Cu- Fe- P lead frame alloy larger Fe particles were observed by energy dispersive spectroscopy. By using the large strain two-dinension plane strain model and elastic plastic finite element method, the cause for peeling damage of Cu-Fe-P lead frame aUoy was investigated. The results show that when the content of Fe particles is more than 30% at local Fe-rich area the intense stress coacentration in the Fe particle would make the Fe particle broken up. The high equivalent stress mutation and the mismatch of equivalent strain 10% at the two sides of intefrace make it easy to develop the crack and peeling damage on finish rolling. The larger Fe particles in the Cu-Fe-P alloy should be avoided.展开更多
Transmission electron microscopy (TEM) observations were carried out for examining the precipitation behavior in a Cu-Sn-Ni-Zn-P lead frame material. TEM observations revealed that the precipitate is hexagonal Ni5P2 a...Transmission electron microscopy (TEM) observations were carried out for examining the precipitation behavior in a Cu-Sn-Ni-Zn-P lead frame material. TEM observations revealed that the precipitate is hexagonal Ni5P2 and the orientation relationship between the Cu matrix and Ni$Pi precipitate is (111)fcc//(0001)hcp, [101]fcc//[1120]hcp, where the suffix fcc denotes the Cu matrix and hep denotes the hexagonal Ni5P2 precipitate. The Ni5P2 precipitate is ovoidal in shape at the beginning of aging at lower temperature. By prolonging the aging time or increasing the aging temperature, Ni5P2 precipitate grows and shows a rod-like shape. The Ni added Cu based lead frame material has a comparative mechanical properties with that of TAMAC15 which has been developed and used in electrical industry.展开更多
基金Funded by the National "863" Plan of China ( No.2002AA331112) ,the Doctorate Foundation of Northwestern Poly-technical University,andthe Science Research Foundation of HenanUniversity of Science and Technology(No.2006ZY041)
文摘Under the surface peeling of Cu- Fe- P lead frame alloy larger Fe particles were observed by energy dispersive spectroscopy. By using the large strain two-dinension plane strain model and elastic plastic finite element method, the cause for peeling damage of Cu-Fe-P lead frame aUoy was investigated. The results show that when the content of Fe particles is more than 30% at local Fe-rich area the intense stress coacentration in the Fe particle would make the Fe particle broken up. The high equivalent stress mutation and the mismatch of equivalent strain 10% at the two sides of intefrace make it easy to develop the crack and peeling damage on finish rolling. The larger Fe particles in the Cu-Fe-P alloy should be avoided.
基金support of the National Natural Science Foundation of China(Grant No.59971008).
文摘Transmission electron microscopy (TEM) observations were carried out for examining the precipitation behavior in a Cu-Sn-Ni-Zn-P lead frame material. TEM observations revealed that the precipitate is hexagonal Ni5P2 and the orientation relationship between the Cu matrix and Ni$Pi precipitate is (111)fcc//(0001)hcp, [101]fcc//[1120]hcp, where the suffix fcc denotes the Cu matrix and hep denotes the hexagonal Ni5P2 precipitate. The Ni5P2 precipitate is ovoidal in shape at the beginning of aging at lower temperature. By prolonging the aging time or increasing the aging temperature, Ni5P2 precipitate grows and shows a rod-like shape. The Ni added Cu based lead frame material has a comparative mechanical properties with that of TAMAC15 which has been developed and used in electrical industry.
