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INTERACTION BETWEEN Cu AND LIQUID Sn(II)——SEM OBSERVATION OF INTERMETALLIC GROWTH
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作者 ZHANG Qiyun LIU Shuqi XU Yaping Peking University,Beijing,China professor,Department of Chemistry,Peking University,Beijing,100871,China 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 1993年第8期81-86,共6页
The features of Cu_6Sn_5 growing slowly at lower temperature and growing rapidly up over 350℃,and or Cu_3Sn growing at higher temperatures,bave been detailedly observed under SEM.The increase of Pb content seems to i... The features of Cu_6Sn_5 growing slowly at lower temperature and growing rapidly up over 350℃,and or Cu_3Sn growing at higher temperatures,bave been detailedly observed under SEM.The increase of Pb content seems to inhibit sequentially the growth of Cu_6Sn_5 in Pb-Sn alloy. 展开更多
关键词 CU liquid Sn Cu_6Sn_5 Cu_3Sn lead wire solderability
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