Surface Metallization of Glass Fiber(GF)/Polyetheretherketone(PEEK) Composite with Cu Coatings Deposited by Magnetron Sputtering and Electroplating

Surface metallization of glass fiber(GF)/polyetheretherketone(PEEK)[GF/PEEK] is conducted by coating copper using electroplating and magnetron sputtering and the properties are determined by X-ray diffraction(XRD), scanning electron microscopy(SEM), and electron backscatter diffraction(EBSD).The coating bonding strength is assessed by pull-out tests and scribing in accordance with GB/T 9286-1998.The results show that the Cu coating with a thickness of 30 μm deposited on GF/PEEK by magnetron sputtering has lower roughness, finer grain size, higher crystallinity, as well as better macroscopic compressive stress,bonding strength, and electrical conductivity than the Cu coating deposited by electroplating.

Effective removal of chromium,copper,and nickel heavy metal ions from industrial electroplating wastewater by in situ oxidative adsorption using sodium hypochlorite as oxidant and sodium trititanate nanorod as adsorbent

Sodium hypochlorite and synthesized sodium trititanate nanorods(Na_(2)Ti_(3)O_(7),186 nm×1270 nm)were used as the oxidant and adsorbents for in situ oxidative adsorption treatment of actual electroplating wastewater containing Cr(Ⅵ)(2.6-5.2 mg·L^(-1)),Cu^(2+)(2.7-5.4 mg·L^(-1)),and Ni^(2+)(0.2705-0.541 mg·L^(-1))ions at pH of 8.8-9.1 and 20-60℃.The as-synthesized sodium trititanate nanorods were characterized by XRD,HRTEM,N2 adsorption/desorption,SEM,EDX,and zeta potential techniques.The concentrations of heavy metal ions in wastewater were analyzed by ICP technique.After in situ oxidative adsorption treatment under the concentrations of 25 g·L^(-1) for sodium hypochlorite and 125 mg·L^(-1) for sodium trititanate nanorods at 60℃ for 5 h,the heavy metal ion concentrations could be reduced from initial value of 2.6 to final value of 1.92 mg·L^(-1) for Cr(Ⅵ),3.6 to 0.17 mg·L^(-1) for Cu^(2+),and from 0.2705 to 0.097 mg·L^(-1) for Ni^(2+),respectively.Cr(Ⅵ),Cu^(2+) and Ni^(2+) ions could be effectively removed by the in situ oxidative adsorption method.The in situ oxidative adsorption processes of Cr(Ⅵ),Cu^(2+) and Ni^(2+) ions are satisfactorily simulated by the pseudo-second order adsorption kinetics and Langmuir adsorption isotherm,respectively.Adsorption thermodynamics analyses reveal that the oxidative adsorption processes of Cr(Ⅵ),Cu^(2+) and Ni^(2+) ions are spontaneous and endothermic.The oxidation degree of metalcontained complexes influences the values of thermodynamics functions.

Lead-free Ce-doped perovskite scintillators with high figure of merit

Lead halide perovskite scintillators have recently received extensive research attention owing to their short fluorescence lifetimes,low detection limits,and ease of fabrication compared to traditional scintillators.The nontoxic cerium-doped lead-free perovskites with intrinsically efficient and short lifetime d–f transitions are a prospective replacement for the toxic Pb^(2+).Here,we demonstrated Ce-doped cesium lanthanide chloride perovskites (Cs_(3)LnCl_(6),Ln=Gd,Y,Lu) synthesized through a facile solution method for the first time.These perovskites exhibit blue-violet emission,which arises from Ce 5d→4f transitions.Among three types of Cs_(3)LnCl_(6) perovskites,Ce:Cs_(3)LuCl_(6) exhibited high photoluminescence quantum yield (PLQY) of 82%and a short excited-state lifetime of approximately 34 ns.When utilized as X-ray scintillators,Ce:Cs_(3)LuCl_(6) crystals display a high light yield of 8120 photons per MeV and a low detection limit of 36.8 n Gy air s^(-1).Importantly,the figure of merit (FoM),representing the ratio of light yield to decay time,reaches 239,which is the highest reported value for lead-free perovskite scintillators up to now.Additionally,the fabrication of perovskite/PMMA films was undertaken for practical demonstrations in X-ray imaging,resulting in the attainment of a resolution of up to 8.38 lp/mm.We anticipate that this work will inspire the utilization of Ce-doped Cs_(3)LnCl_(6) perovskites in ultrafast scintillation applications such as high-energy physics,nuclear reaction monitoring,and dynamic X-ray imaging.

Ligand modulation of active center to promote lead-free Cs_(2)AgInCl_(6)photocatalytic CO_(2)reduction

Metal halide perovskites(MHP)are potential candidates for the photocatalytic reduction of CO_(2)due to their long photogenerated carrier lifetime and charge diffusion length.However,the conventional long-chain ligand impedes the adsorption and activation of CO_(2)molecules in practical applications.Here,a ligand modulation technology is employed to enhance the photocatalytic CO_(2)reduction activity of lead-free Cs_(2)AgInCl_(6)microcrystals(MCs).The Cs_(2)AgInCl_(6)MCs passivated by Oleic acid(OLA)and Octanoic acid(OCA)are used for photocatalytic CO_(2)reduction.The results show that the surface defects and electronic properties of Cs_(2)AgInCl_(6)MCs can be adjusted through ligand modulation.Compared with the OLA-Cs_(2)AgInCl_(6),the OCA-Cs_(2)AgInCl_(6)catalyst demonstrated a significant improvement in the catalytic yield of CO and CH_(4).The CO and CH_(4)catalytic yields of OCA-Cs_(2)AgInCl_(6)reached 171.88 and34.15μmol g^(-1)h^(-1)which were 2.03 and 12.98 times higher than those of OLA-Cs_(2)AgInCl_(6),and the total electron consumption rate of OCA-Cs_(2)AgInCl_(6)was 615.2μmol g^(-1)h^(-1)which was 3.25 times higher than that of OLA-Cs_(2)AgInCl_(6).Furthermore,in situ diffuse reflectance infrared Fourier transform spectra revealed the enhancement of photocatalytic activity in Cs_(2)AgInCl_(6)MCs induced by ligand modulation.This study illustrates the potential of lead-free Cs_(2)AgInCl_(6)MCs for efficient photocatalytic CO_(2)reduction and provides a ligand modulation strategy for the active promotion of MHP photocatalysts.

Mechanical and Electrical Properties of Some Sn-Zn Based Lead-Free Quinary Alloys

Although there are many lead-free soldering alloys on the market, none of them have ideal qualities. The researchers are combining binary alloys with a variety of additional materials to create the soldering alloys’ features. The eutectic Sn-9Zn alloy is among them. This paper investigated the mechanical and electrical properties of Sn-9Zn-x (Ag, Cu, Sb);{x = 0.2, 0.4, and 0.6} lead-free solder alloys. The mechanical properties such as elastic modulus, ultimate tensile strength (UTS), yield strength (YS), and ductility were examined at the strain rates in a range from 4.17 10−3 s−1 to 208.5 10−3 s−1 at room temperature. It is found that increasing the content of the alloying elements and strain rate increases the elastic modulus, ultimate tensile strength, and yield strength while the ductility decreases. The electrical conductivity of the alloys is found to be a little smaller than that of the Sn-9Zn eutectic alloy.

Cyanide-free silver electroplating process in thiosulfate bath and microstructure analysis of Ag coatings

Cyanide-free silver electroplating was conducted in thiosulfate baths containing AgNO3 and AgBr major salts, respectively. The effects of major salt content and current density on surface quality, deposition rate and microhardness of Ag coatings were investigated. The optimized electroplating parameters were established. The adhesion strength of Ag coating on Cu substrate was evaluated and the grain size of Ag coating was measured under optimized electroplating parameters. The optimized AgNO3 content is 40 g/L with current density of 0.25 A/dm2. The deposited bright, smooth, and well adhered Ag coating had nanocrystalline grains with mean size of 35 nm. The optimized AgBr content was 30 g/L with current density of 0.20 A/dm2. The resultant Ag coating had nanocrystalline grains with mean size of 55 nm. Compared with the bath containing AgBr main salt, the bath containing AgNO3 main salt had a wider current density range, and corresponding Ag coating had a higher microhardness and a smaller grain size.

Surface pretreatment of Mg alloys prior to Al electroplating in TMPAC-AlCl_3 ionic liquids

It is difficult to directly electroplate Al on Mg alloys. The effects of pretreatment parameters on the corrosion resistance of films obtained on AZ31 Mg alloy surface were studied by using potentiodynamic polarization curves, to produce a compact interfacial layer as zinc-immersion deposition. After the substrate was pretreated under optimized conditions, aluminum was electrodeposited on AZ31 from TMPAC-AlCl3 room temperature ionic liquids. The depositions were characterized by scanning electron microscope equipped with energy dispersion X-ray. The results show that the traditional pretreatment of Mg alloys was successfully used for the Al-electroplating process from TMPAC-AlCl3 ionic liquids. The entire procedure includes alkaline cleaning, chemical pickling, surface activation （400 mL/L HF acid, 10 min）, zinc-immersion （20 min） and anhydrous treatment. A relatively compact zinc-immersion film was prepared on the substrate surface. A silvery-colored satin aluminum deposition was obtained on AZ31 from TMPAC-AlCl3 using direct current plating.

Preparation of lead-free free-cutting graphite brasses by graphitization of cementite

Graphite brasses were prepared by graphitizing annealing of cast brasses containing cementite particles,which were in-situ formed during the fasting process.The eutectic cast iron as carbon source was added into common brasses by casting.SEM and EDS were used to analyze the microstructure of graphite brasses,and the relationship between the microstructure and machinability was investigated.The results show that graphite particles are formed by the decomposition of cementite particles in cast brasses.The graphite particles are uniformly dispersed in the brass matrix with the average size of 5.0 μm and the volume fraction of ~1.1%.The machinability in the graphite brass is dramatically increased relative to the common brass,because of the lubricating properties of graphite particles and its role in chip breaking.The workpiece surface of the graphite brasses chips is smooth and burr-free,and the chips of graphite brasses are short（C-shape） and discontinuous,which is much better than that of the long spiral chips of common brasses.

Recovery of heavy metals from electroplating sludge and stainless steel pickle waste liquid by ammonia leaching method

A coordinative disposal process for treatment of electroplating sludge and stainless steel pickle waste liquid containing Cu, Ni, Zn, Cr and Fe etc., has been developed to recover valuable metals and to eliminate pollution. The recovery of Cu, Ni, Zn and Cr is 94%, 91%, 90% and 95%, respectively. The ammonia was recycled by the simplified process of CaO caustic distillation. The precipitated product of Cu, Ni and Zn obtained from caustic distillation of ammonia was separated by extraction or high\|pressure hydrogen reduction in an autoclave. The qualified metal salt products were obtained through extraction. The rich chromium residue from coordinative disposal was subjected to recover Cr by hydrothermal oxidation in NaOH medium and Fe\-3O\-4 was synthesized by wet methods from the residue produced by extracting Cr. Cr was a stable chemical fixed in Fe\-3O\-4 and harmless. The recovery process has been used in a pilot plant with sludge production capacity of 2000 t/a.

Electroless Nickel Plating and Electroplating on FBG Temperature Sensor

Metal-coated fiber Bragg grating（FBG）temperature sensors were prepared via electroless nickel（EN）plating and tin electroplating methods on the surface of normal bare FBG.The surface morphologies of the metal-coated layers were observed under a metallographic microscope.The effects of pretreatment sequence,pH value of EN plating solution and current density of electroplating on the performance of the metal-coated layers were analyzed.Meanwhile, the Bragg wavelength shift induced by temperature was monitored by an optical spectrum analyzer.Sensitivity of the metal-coated FBG（MFBG）sensor was almost two times that of normal bare FBG sensor.The measuring temperature of the MFBG sensor could be up to 280℃,which was much better than that of conventional FBG sensor.

Pulse electroplating of Ni-W-P coating and its anti-corrosion performance

Ni-W-P coatings were electrodeposited on copper substrates by pulse electroplating.Effects of electrolyte pH(1-3),temperature(40-80°C),average current density(1-7A/dm2)and pulse frequency(200-1000Hz)on deposition rate,structure and corrosion resistance performance of Ni-W-P coatings were studied by single factor method.Surface morphology,crystallographic structure and composition of Ni-W-P coatings were investigated by means of scanning electron microscopy,X-ray diffractometry and energy dispersive X-ray spectroscopy,respectively.Corrosion resistance performances of Ni-W-P coatings were studied by potentiodynamic polarization and electrochemical impedance spectroscopy in3.5%NaCl solution(mass fraction)and soil-containing solution.It was found that the pulse electroplated Ni-W-P coatings have superior corrosion resistance performance and the electroplating parameters significantly affect the structure and corrosion resistance performance of Ni-W-P coatings.The optimized parameters of pulse electroplating Ni-W-P coatings were as follows:pH2.0,temperature60°C,average current density4A/dm2,and pulse frequency600Hz.The Ni-W-P coating prepared under the optimized parameters has superior corrosion resistance(276.8kΩ)and compact surface without any noticeable defect.

Large Energy Capacitive High-Entropy Lead-Free Ferroelectrics

Advanced lead-free energy storage ceramics play an indispensable role in next-generation pulse power capacitors market.Here,an ultrahigh energy storage density of~13.8 J cm^(-3)and a large efficiency of~82.4%are achieved in high-entropy lead-free relaxor ferroelectrics by increasing configuration entropy,named high-entropy strategy,realizing nearly ten times growth of energy storage density compared with low-entropy material.Evolution of energy storage performance and domain structure with increasing configuration entropy is systematically revealed for the first time.The achievement of excellent energy storage properties should be attributed to the enhanced random field,decreased nanodomain size,strong multiple local distortions,and improved breakdown field.Furthermore,the excellent frequency and fatigue stability as well as charge/discharge properties with superior thermal stability are also realized.The significantly enhanced comprehensive energy storage performance by increasing configuration entropy demonstrates that high entropy is an effective but convenient strategy to design new high-performance dielectrics,promoting the development of advanced capacitors.

Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloy

This article explores tile effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn- 9Zn-xP solder alloys were determined by means of weight gaining, and secondary ion mass spectrometry was used to analyze the oxygen content. The role and mechanism of P in the solder alloys were also discussed. It is found that the addition of P can significantly improve the wettability of the solder alloys. Incorporating P into Sn-9Zn solder alloy obviously decreases the oxygen content and enhances the oxidation and corrosion resistance. Microstructure observations show that an appropriate amount of P can greatly refine coarse rod-like Zn-rich phases in Sn-gZn solder alloy.

Removal of copper ions from electroplating rinse water using electrodeionization

An improved configuration of the membrane stack was adopted in the electrodeionization （EDI） cell to prevent precipitation of bivalent metal hydroxide during the running. The operational parameters that influenced the removal of copper ions from the dilute solution were optimized. The result showed that a moderate decrease in the inlet pH value and a moderate increase in the applied voltage could achieve a better removal effect. The steady process of electroplating wastewater treatment could be achieved with a removal efficiency of more than 99.5% and an enrichment factor of 5-14. The concentration of copper in purified water was less than 0.23 mg/L. This demonstrated the applicability of recovering heavy metal ions and purified water from electroplating effluent for industrial reuse.

Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively.The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn,in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder.With the increases of output power of diode-laser,the shear force and the microstructures change obviously.The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method,so the shear force is also higher than that using IR reflow soldering method.When the output power value of diode-laser is about 41.0 W,the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.

Improvement of stability of trivalent chromium electroplating of Ti based IrO_2+Ta_2O_5 coating anodes

The preparation process and properties of the thermally prepared Ti anodes coated with IrO2+Ta2O5 was studied. The structure and morphologies of the IrO2+Ta2O5 coatings were determined by XRD and SEM. Their electrochemical properties were studied by polarization curve and cyclic voltammetry. Trivalent chromium electroplating using Ti/IrO2+Ta2O5 anodes is carried out and the results were analyzed. Results show that this anode exhibits excellent electrochemical activity and stability in sulfate electrolysis. The electrocatalytic activity is determined not only by the content of IrO2 but also the structure and morphology of the anode coatings. The electroplating results indicats that Ti/IrO2+Ta2O5 anodes have excellent capabilities and merits in improving the stability of trivalent chromium electroplating in sulfate system.

Ultrasensitive and stable X-ray detection using zero-dimensional lead-free perovskites

Sensitive and reliable X-ray detectors are essential for medical radiography,industrial inspection and security screening.Lowering the radiation dose allows reduced health risks and increased frequency and fidelity of diagnostic technologies for earlier detection of disease and its recurrence.Three-dimensional(3 D)organic-inorganic hybrid lead halide perovskites are promising for direct X-ray detection-they show improved sensitivity compared to conventional X-ray detectors.However,their high and unstable dark current,caused by ion migration and high dark carrier concentration in the 3 D hybrid perovskites,limits their performance and long-term operation stability.Here we report ultrasensitive,stable X-ray detectors made using zero-dimensional(0 D)methylammonium bismuth iodide perovskite(MA3Bi2I9)single crystals.The 0 D crystal structure leads to a high activation energy(Ea)for ion migration(0.46 e V)and is also accompanied by a low dark carrier concentration(~10^6 cm^-3).The X-ray detectors exhibit sensitivity of 10,620μC Gy-1 air cm-2,a limit of detection(Lo D)of 0.62 nG yairs-1,and stable operation even under high applied biases;no deterioration in detection performance was observed following sensing of an integrated X-ray irradiation dose of^23,800 m Gyair,equivalent to>200,000 times the dose required for a single commercial X-ray chest radiograph.Regulating the ion migration channels and decreasing the dark carrier concentration in perovskites provide routes for stable and ultrasensitive X-ray detectors.

Electroplating of Ni/Co–pumice multilayer nanocomposite coatings: Effect of current density on crystal texture transformations and corrosion behavior

The present paper aims to investigate the influence of the current density in the electroplating process on the microstructure, crystal texture transformations, and corrosion behavior of Ni/Co pumice multilayer nanocomposite coatings. The Ni/Co pumice composite coatings were prepared by deposition of Ni, followed by the simultaneous deposition of pumice nanoparticles (NPs) in a Co matrix via an electroplating process at various current densities. Afterward, the morphology, size, topography, and crystal texture of the obtained samples were investigated. Furthermore, electrochemical methods were used to investigate the corrosion behavior of the produced coatings in a solution of 3.5wt% NaCl. The results indicated that increasing the plating current density changed the mechanism of coating growth from the cell state to the column state, in- creased the coating thickness, roughness, and texture coefficient (TC) of the Co (203) plane, and reduced the amount of pumice NPs incorporated into the Ni/Co pumice composite. The electrochemical results also indicated that increasing the current density enhanced the corrosion resistance of the Ni/Co pumice composite.

Electrochemical characteristics of electroplating and impregnation Ni-P/SiC/PTFE composite coating on 316L stainless steel

Ni-P/SiC/PTFE coating was obtained on the surface of 316L stainless steel by electrodeposition of Ni-P/SiC coating and immersion of PTFE(polytetrafluoroethylene).The surface morphology and composition were analyzed by scanning electron microscope and energy dispersive spectrometer.The corrosion resistance of the coating in 0.5 mol/L H2SO4+2×10−6 HF solution was studied by electrochemical method.Surface contact angle was used to test the hydrophobic properties of the coating.The results indicated that the Ni-P/SiC/PTFE coating prepared on the surface of stainless steel was uniform and compact,which significantly improved the self-corrosion potential of stainless steel.The self-corrosion current density decreased from 7.62 to 0.008μA/cm2.The durability performance of coating was tested under 0.6 V voltage and the stable corrosion current density value was 0.19μA/cm2,then wetting angle was tested after durability experiment and the value is 134.5°.

Formation of Bulk Intermetallic Compound AgaSn in Slowly-Cooled Lead-Free Sn-4.0 wt pct Ag Solders

Sn-Ag alloy system has been regarded as one of the most promising lead-free solder to substitute conventional Sn- Pb eutectic solder. But the formation of bulk Ag3Sn intermetallic compounds （IMCs） during reflow and post heat treatment significantly influences the performance of the solder joints. With an effort to clarify its microstructural evolution as a function of slow cooling rates, the fraction of bulk IMCs within the slowly solidified Sn-4.0 wt pct Ag solder was investigated by standard metallographic and compared with that detected by thermal analysis. It was found that the bulk IMCs fraction determined by thermal analysis corresponds quite well with the microstructure observation results. In accordance with the conventional solidification theory, the lower the applied cooling rate, the fewer the amount of bulk Ag3Sn IMCs formed in Sn-4.0 wt pct Ag alloy. In addition, Vickers hardness measurement results indicated that the relative coarse eutectic Ag3Sn IMCs distributing in the lamellar eutectic structure favored the improvement of the mechanical performance.