The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low...The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low-temperature conductive silver paste.Afterwards,the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR,DMA and SEM.The results revealed that the prepared conductive paste has good conductivity,film-forming performance,printing performance,low-temperature curing performance,and anti-aging performance.When the mass percentage of the bonding phase/conductive phase was 40/60,the lowest volume resistivity of the conductive silver paste was 4.9×10^(−6)Ω⋅cm,and the conductivity was the best.展开更多
导电银浆是一种重要的电子材料,可以提高电子器件的连接和传输效率,广泛应用于太阳能和电子工业领域。目前导电银浆的制作流程繁琐,通常使用纳米银等成本较高的填料以保证良好的导电性。本研究采用惰性气体冷凝(inert gas condensation,...导电银浆是一种重要的电子材料,可以提高电子器件的连接和传输效率,广泛应用于太阳能和电子工业领域。目前导电银浆的制作流程繁琐,通常使用纳米银等成本较高的填料以保证良好的导电性。本研究采用惰性气体冷凝(inert gas condensation, IGC)法制备了纳米晶/非晶复合铜锆银(Cu-Zr-Ag)粉,通过X射线衍射(XRD)、场发射扫描电镜(FESEM)、透射电镜(TEM)等方式对其微观结构和形貌进行了表征,并将其作为导电填料制备了导电银浆,测量了含有不同复合Cu-Zr-Ag粉添加量的导电银浆高温烧结后样品的导电性。结果表明:通过IGC法制备的纳米晶/非晶复合Cu-Zr-Ag粉尺寸分布均匀,平均尺寸约为35 nm;纳米晶/非晶复合Cu-Zr-Ag粉添加量为0.5%~1.5%的导电银浆导电性得到优化,其中,纳米粉的添加量为1%时,方阻最低,达到5.63 mΩ/□。展开更多
基金fund for this work was provided by the“Research on Key Technologies of Photosensitive Conductive Silver Paste Based on Domestic Circuit Protection Micro Chip Components”(Project No.BE2020008 and Supporting Author:Chen P).
文摘The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low-temperature conductive silver paste.Afterwards,the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR,DMA and SEM.The results revealed that the prepared conductive paste has good conductivity,film-forming performance,printing performance,low-temperature curing performance,and anti-aging performance.When the mass percentage of the bonding phase/conductive phase was 40/60,the lowest volume resistivity of the conductive silver paste was 4.9×10^(−6)Ω⋅cm,and the conductivity was the best.
