Study on the Relationship of Seedling Density and Line Spacing to Leaf-stem Ratio, DW/FW Ratio and Grass Yield of Forage Sweet Sorghum

[ Objectives ] The aim was to optimize the configuration of seedling density and line spacing of forage sweet sorghum （ Sorghum blcolor （ L. ） Moench） and explore its high-yield cultivation techniques. [ Methods] Effects of such two influencing factors as line spacing and seedling density on the leaf-stem ratio, DW/FW ratio and grass yield of forage sweet sorghum were analyzed by using split-plot experiment design experiment method and LSD method of IBM. SPSS. Statis- tics. v22 stati, stics software. [ Results ~ Seedling density and line spacing had no obvious effect on the leaf-stem ratio and DW/FW ratio of forage sweet sorghum but had obvious influences on the grass yield. Moreover, the optimal combination of seedling density and line spacing for high yield of forage sweet sorghum was A2 B4, that is, seedling density was 225 000 plants/hm2, and line spacing was 40 cm. [ Conclusions] The results provided a theoretical basis and technical support for high-yield cultivation techniques of forage sweet sorghum.

Analytical solutions of ground settlement induced by yaw in a space curved shield tunnel

This paper aims to provide the analytical solutions of the ground settlement for a space curved shield tunnel in the case of yaw construction.Settlement inducements include ground loss and construction loads,and two corresponding analytical models have been proposed in this study.Three-dimensional image theory has been adopted to calculate the ground settlement due to ground loss.Yawrelated parameters are introduced into the calculation model to deduce the relevant laws of the ground settlement.Based on modified Mindlin solutions,analytical models are established to calculate the ground settlement induced by construction loads,such as the frontal additional thrust,axial friction of shield shell,and the grouting pressure.The method of calculating the position of the shield machine in the ground is refined,and the influence area of construction loads from the shield machine is optimized.Subsequently,the obtained solutions are validated by a numerical model and field data.Besides,a comparison reveals that the proposed model is the composition of three classical analytical models,thus it excels them in solving the problem mentioned.Finally,parametric analyses of yaw are conducted to examine yaw angle and pitch angle on ground settlement.The proposed model can effectively predict ground settlement caused by the spatial linear shield tunneling process.

Surface micro-texture on sapphire fabricated by laser ablation trajectory regulation

Fabrication of the surface micro-texture on the C-plane sapphire is undertaken by a355 nm Ultraviolet(UV)pulsed laser.The surface micro-textures of sapphire with different laser scanning line spacing ranging from 10 lm to 100 lm are obtained,where the selection range of scanning line spacing is controlled in the range of the groove width and plasma width to obtain a surface of high Peak-Valley(PV)value.A reasonable processing order is proposed to manufacture different types of surface micro-textures on sapphire by laser ablation trajectory regulation.In the multiple-passes laser ablation of sapphire by the UV nanosecond pulsed laser,the scanning lines in each direction is treated as once scanning.On this basis,the multiple processing can be carried out to avoid the influence of the subsequent scanning on the machined groove.In addition,the effect of different scanning line spacing on the PV value is quantified and different types of surface microtextures on sapphire,including the squares,the rhombuses and the hexagons,are successfully fabricated,which can be applied in the friction reduction or anti-reflection field.

Effects of pattern characteristics on copper CMP

Copper chemical mechanical polishing （CMP） is influenced by geometric characteristics such as line width and pattern density, as well as by the more obvious parameters such as slurry chemistry, pad type, polishing pressure and rotational speed. Variations in the copper thickness across each die and across the wafer can impact the circuit performance and reduce the yield. In this paper, we propose a modeling method to simulate the polishing behavior as a function of layout pattern factors. Under the same process conditions, the pattern density, the line width and the line spacing have a strong influence on copper dishing, dielectric erosion and topography. The test results showed： the wider the copper line or the spacing, the higher the copper dishing; the higher the density, the higher the dielectric erosion; the dishing and erosion increase slowly as a function of increasing density and go into saturation when the density is more than 0.7.