Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermet...Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermetallic compounds(IMCs) in Sn-58Bi-0.7Zn solder sample were both effectively suppressed. With the addition of 0.7% Zn, ultimate tensile strengths(UTSs) of the Sn-58 Bi solder slabs were respectively increased by 6.05% and 5.50% after reflow soldering and liquid-state aging, and those of the Cu/Sn-58Bi/Cu solder joints were also increased by 21.51% and 29.27%, respectively. The increase in strengthening effect of Cu/Sn-58Bi-x Zn/Cu solder joints could be attributed to the fracture surface which was changed from the Cu/IMC interface to the IMC/solder interface due to the finer Bi grain. Nanoindentation results revealed that the creep behavior of Sn-58Bi-0.7Zn solder was significantly improved compared with that of the eutectic Sn-58 Bi solder after reflow soldering and liquid-state aging.展开更多
In order to study the in?uence of the physical state of solder on the interfacial reaction of dip-soldered Sn-3.0 Ag-0.5 Cu/Cu system, two kinds of experiments were designed, including:(1) solid-state aging between th...In order to study the in?uence of the physical state of solder on the interfacial reaction of dip-soldered Sn-3.0 Ag-0.5 Cu/Cu system, two kinds of experiments were designed, including:(1) solid-state aging between the solder and Cu substrate;(2)liquid-state aging between the metastable supercooled liquid-state solder and Cu substrate. The aging times were 30, 60,120 and 180 min, respectively, and the aging temperature was 8 ℃ lower than the melting point of the Sn-3.0 Ag-0.5 Cu(SAC305) alloy(217 ℃). The experimental data revealed that the physical state of the solder obviously affected the formation of the intermetallic compound(IMC), and resulted in the difference in the diffusion of atoms on the interface between the SAC305 solder and Cu substrate. The IMC interface after aging for 30 min presents unique characteristics compared with that of the sample after dip soldering. The IMC interface of solid-state aged SAC305/Cu couple is relatively planar, while the IMC interface under metastable supercooled liquid-state aging conditions presents scallop-like shape.展开更多
We report progress towards a modern scientific description of thermodynamic properties of fluids following the discovery (in 2012) of a coexisting critical density hiatus and a supercritical mesophase defined by perco...We report progress towards a modern scientific description of thermodynamic properties of fluids following the discovery (in 2012) of a coexisting critical density hiatus and a supercritical mesophase defined by percolation transitions. The state functions density ρ(p,T), and Gibbs energy G(p,T), of fluids, e.g. CO<sub>2</sub>, H<sub>2</sub>O and argon exhibit a symmetry characterised by the rigidity, ω = (dp/dρ)<sub>T</sub>, between gaseous and liquid states along any isotherm from critical (T<sub>c</sub>) to Boyle (T<sub>B</sub>) temperatures, on either side of the supercritical mesophase. Here, using experimental data for fluid argon, we investigate the low-density cluster physics description of an ideal dilute gas that obeys Dalton’s partial pressure law. Cluster expansions in powers of density relate to a supercritical liquid-phase rigidity symmetry (RS) line (ω = ρ<sub>rs</sub>(T) = RT) to gas phase virial coefficients. We show that it is continuous in all derivatives, linear within stable fluid phase, and relates analytically to the Boyle-work line (BW) (w = (p/ρ)<sub>T</sub> = RT), and to percolation lines of gas (PB) and liquid (PA) phases by: ρ<sub>BW</sub>(T) = 2ρ<sub>PA</sub>(T) = 3ρ<sub>PB</sub>(T) = 3ρ<sub>RS</sub>(T)/2 for T T<sub>B</sub>. These simple relationships arise, because the higher virial coefficients (b<sub>n</sub>, n ≥ 4) cancel due to clustering equilibria, or become negligible at all temperatures (0 T T<sub>B</sub>)<sub> </sub>within the gas phase. The Boyle-work line (p/ρ<sub>BW</sub>)<sub>T</sub> is related exactly at lower densities as T → T<sub>B</sub>, and accurately for liquid densities, by ρ<sub>BW</sub>(T) = −(b<sub>2</sub>/b<sub>3</sub>)<sub>T</sub>. The RS line, ω(T) = RT, defines a new liquid-density ground-state physical constant (ρ<sub>RS</sub>(0) = (2/3)ρ<sub>BW</sub>(0) for argon). Given the gas-liquid rigidity symmetry, the entire thermodynamic state functions below T<sub>B</sub> are obtainable from b<sub>2</sub>(T). A BW-line ground-state crystal density ρ<sub>BW</sub>(0) can be defined by the pair potential minimum. The Ar<sub>2</sub> pair potential, ∅ij</sub>(r<sub>ij</sub>) determines b<sub>2</sub>(T) analytically for all T. This report, therefore, advances the salient objective of liquid-state theory: an argon p(ρ,T) Equation-of-state is obtained from ∅<sub>ij</sub>(r<sub>ij</sub>) for all fluid states, without any adjustable parameters.展开更多
基金Project(51074112)supported by the National Natural Science Foundation of China
文摘Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermetallic compounds(IMCs) in Sn-58Bi-0.7Zn solder sample were both effectively suppressed. With the addition of 0.7% Zn, ultimate tensile strengths(UTSs) of the Sn-58 Bi solder slabs were respectively increased by 6.05% and 5.50% after reflow soldering and liquid-state aging, and those of the Cu/Sn-58Bi/Cu solder joints were also increased by 21.51% and 29.27%, respectively. The increase in strengthening effect of Cu/Sn-58Bi-x Zn/Cu solder joints could be attributed to the fracture surface which was changed from the Cu/IMC interface to the IMC/solder interface due to the finer Bi grain. Nanoindentation results revealed that the creep behavior of Sn-58Bi-0.7Zn solder was significantly improved compared with that of the eutectic Sn-58 Bi solder after reflow soldering and liquid-state aging.
基金supported financially by the National Natural Science Foundation of China (Nos. 51465039, 51665038 and 51765040)the Natural Science Foundation of Jiangxi Province (No. 20161BAB206122)the Nature Science Basic Research Plan in Shaanxi Province of China (No. 2016JM5085)
文摘In order to study the in?uence of the physical state of solder on the interfacial reaction of dip-soldered Sn-3.0 Ag-0.5 Cu/Cu system, two kinds of experiments were designed, including:(1) solid-state aging between the solder and Cu substrate;(2)liquid-state aging between the metastable supercooled liquid-state solder and Cu substrate. The aging times were 30, 60,120 and 180 min, respectively, and the aging temperature was 8 ℃ lower than the melting point of the Sn-3.0 Ag-0.5 Cu(SAC305) alloy(217 ℃). The experimental data revealed that the physical state of the solder obviously affected the formation of the intermetallic compound(IMC), and resulted in the difference in the diffusion of atoms on the interface between the SAC305 solder and Cu substrate. The IMC interface after aging for 30 min presents unique characteristics compared with that of the sample after dip soldering. The IMC interface of solid-state aged SAC305/Cu couple is relatively planar, while the IMC interface under metastable supercooled liquid-state aging conditions presents scallop-like shape.
文摘We report progress towards a modern scientific description of thermodynamic properties of fluids following the discovery (in 2012) of a coexisting critical density hiatus and a supercritical mesophase defined by percolation transitions. The state functions density ρ(p,T), and Gibbs energy G(p,T), of fluids, e.g. CO<sub>2</sub>, H<sub>2</sub>O and argon exhibit a symmetry characterised by the rigidity, ω = (dp/dρ)<sub>T</sub>, between gaseous and liquid states along any isotherm from critical (T<sub>c</sub>) to Boyle (T<sub>B</sub>) temperatures, on either side of the supercritical mesophase. Here, using experimental data for fluid argon, we investigate the low-density cluster physics description of an ideal dilute gas that obeys Dalton’s partial pressure law. Cluster expansions in powers of density relate to a supercritical liquid-phase rigidity symmetry (RS) line (ω = ρ<sub>rs</sub>(T) = RT) to gas phase virial coefficients. We show that it is continuous in all derivatives, linear within stable fluid phase, and relates analytically to the Boyle-work line (BW) (w = (p/ρ)<sub>T</sub> = RT), and to percolation lines of gas (PB) and liquid (PA) phases by: ρ<sub>BW</sub>(T) = 2ρ<sub>PA</sub>(T) = 3ρ<sub>PB</sub>(T) = 3ρ<sub>RS</sub>(T)/2 for T T<sub>B</sub>. These simple relationships arise, because the higher virial coefficients (b<sub>n</sub>, n ≥ 4) cancel due to clustering equilibria, or become negligible at all temperatures (0 T T<sub>B</sub>)<sub> </sub>within the gas phase. The Boyle-work line (p/ρ<sub>BW</sub>)<sub>T</sub> is related exactly at lower densities as T → T<sub>B</sub>, and accurately for liquid densities, by ρ<sub>BW</sub>(T) = −(b<sub>2</sub>/b<sub>3</sub>)<sub>T</sub>. The RS line, ω(T) = RT, defines a new liquid-density ground-state physical constant (ρ<sub>RS</sub>(0) = (2/3)ρ<sub>BW</sub>(0) for argon). Given the gas-liquid rigidity symmetry, the entire thermodynamic state functions below T<sub>B</sub> are obtainable from b<sub>2</sub>(T). A BW-line ground-state crystal density ρ<sub>BW</sub>(0) can be defined by the pair potential minimum. The Ar<sub>2</sub> pair potential, ∅ij</sub>(r<sub>ij</sub>) determines b<sub>2</sub>(T) analytically for all T. This report, therefore, advances the salient objective of liquid-state theory: an argon p(ρ,T) Equation-of-state is obtained from ∅<sub>ij</sub>(r<sub>ij</sub>) for all fluid states, without any adjustable parameters.
