In this study, the mechanical properties of aluminum-5%magnesium doped with rare earth metal neodymium were evaluated. Fuzzy logic (FL) and artificial neural network (ANN) were used to model the mechanical properties ...In this study, the mechanical properties of aluminum-5%magnesium doped with rare earth metal neodymium were evaluated. Fuzzy logic (FL) and artificial neural network (ANN) were used to model the mechanical properties of aluminum-5%magnesium (0-0.9 wt%) neodymium. The single input (SI) to the fuzzy logic and artificial neural network models was the percentage weight of neodymium, while the multiple outputs (MO) were average grain size, ultimate tensile strength, yield strength elongation and hardness. The fuzzy logic-based model showed more accurate prediction than the artificial neutral network-based model in terms of the correlation coefficient values (R).展开更多
Under various deployment circumstances,fifth-generation(5G)telecommunications delivers improved network compound management with fast communication channels.Due to the introduction of the Internet of Things(IoT)in dat...Under various deployment circumstances,fifth-generation(5G)telecommunications delivers improved network compound management with fast communication channels.Due to the introduction of the Internet of Things(IoT)in data management,the majority of the ultra-dense network models in 5G networks frequently have decreased spectral efficiency,weak handover management,and vulnerabilities.The majority of traditional handover authentication models are seriously threatened,making them vulnerable to a variety of security attacks.The authentication of networked devices is the most important issue.Therefore,a model that incorporates the handover mechanism and authentication model must be created.This article uses a fuzzy logic model to create a handover and key management system that focuses on cloud handover management and authentication performance.In order to decrease delays in 5G networks,the fuzzy logic is built with multiple criteria that aim to reduce the number of executed handovers and target cell selection.The simulation is run to evaluate the model’s performance in terms of latency,spatial complexity,and other metrics related to authentication attack validation.展开更多
With the introduction of EUV lithography,the photolithographic process in 5 nm logic process can be simplified to use mostly single exposure method.In a typical 5 nm logic process,the contact-poly pitch(CPP)is 44-50 n...With the introduction of EUV lithography,the photolithographic process in 5 nm logic process can be simplified to use mostly single exposure method.In a typical 5 nm logic process,the contact-poly pitch(CPP)is 44-50 nm,the minimum metal pitch(MPP)is around 30-32 nm.And the overlay budget is estimated to be 2.5 nm(on product overlay).Although the optical resolution of a 0.33NA exposure tool(such as ASML NXE3400)can reach below 32 nm pitch,stochastics in the EUV absorption in photoresists has limited its application to smaller pitches.For the CPP mentioned above,one can use 193 nm immersion lithography with Self-Aligned Double Patterning(SADP)technique to provide good image contrast(or CDU,LWR)as well as good overlay,as for the 10 and 7 nm generations.In the BEOL,however,the 30-32 pitch cannot be realized by a single EUV exposure with enough printing defect process window.If this pitch is to be done by 193 nm immersion lithography,more than 6-8 exposures are needed with very complicated overlay result.For EUV,this can be done through self-aligned LELE with both good CD and overlay control.We have done an optimization of the photolithographic process parameters for the typical metal with a self-developed aerial image simulator based on rigorous coupled wave analysis(RCWA)algorithm and the Abbe imaging routine with an EUV absorption model which describes stochastics.We have calibrated our model with wafer exposure data from several photoresists under collaboration with IMEC.As we have presented last year,to accommodate all pitches under a logic design rule,as well as to provide enough CDU for the logic device performance,in DUV lithography,a typical minimum exposure latitude(EL)for the poly and metal layers can be set at,respectively,18%and 13%.In EUV,due to the existence of stochastics,13%EL,which corresponds to an imaging contrast of 40%,seems not enough for the metal trenches,and to obtain an imaging contrast close to 100%,which yields an EL of 31.4%means that we need to relax minimum pitch to above 41 nm(conventional imaging limit for 0.33NA).This is the best imaging contrast a photolithographic process can provide to reduce LWR and stochastics.In EUV,due to the significantly smaller numerical apertures compared to DUV,the aberration impact can cause much more pronounced image registration error,in order to satisfy 2.5 nm total overlay,the aberration induced shift needs to be kept under 0.2 nm.We have also studied shadowing effect and mask 3D scattering effect and our results will be provided for discussion.展开更多
5 nm logic process is the current leading-edge technology which is under development in world-wide leading foundries.In a typical 5 nm logic process,the Fin pitch is 22~27 nm,the contact-poly pitch(CPP)is 48?55 nm,and...5 nm logic process is the current leading-edge technology which is under development in world-wide leading foundries.In a typical 5 nm logic process,the Fin pitch is 22~27 nm,the contact-poly pitch(CPP)is 48?55 nm,and the minimum metal pitch(MPP)is around 30~36 nm.Due to the fact that these pitches are much smaller than the resolution capability of 193 nm immersion lithography,it is also the first generation which adopts EUV photolithography technology on a large-scale where the process flow can be simplified by single exposure method from more than 10 layers.Relentless scaling brings big challenges to process integration and pushes each process module to the physical and material limit.Therefore,the success of process development will largely depend on careful balance the pros and cons to achieve both performance and yield targets.In the paper,we discussed the advantages and disadvantages of different process approaches for key process loops for 5 nm logic process flow,including dummy poly cut versus metal gate cut approaches in the metal gate loops,self-aligned contact(SAC)versus brutally aligned contact(BAC)approaches,and also introduced the self-aligned double patterning approach in the lower metal processes.Based on the above evaluation,we will provide a recommendation for module's process development.展开更多
This study considered the role of coal as China’s basic energy source and examines the development of the coal industry.We focused on the intelligent development of coal mines,and introduced the“Chinese mode”of int...This study considered the role of coal as China’s basic energy source and examines the development of the coal industry.We focused on the intelligent development of coal mines,and introduced the“Chinese mode”of intelligent mining in underground coal mines,which uses complete sets of technical equipment to propose classifcation and grading standards.In view of the basic characteristics and technical requirements of intelligent coal mine systems,we established a digital logic model and propose an information entity and knowledge map construction method.This involves an active information push strategy based on a knowledge demand model and an intelligent portfolio modeling and distribution method for collaborative control of coal mines.The top-level architecture of 5G+intelligent coal mine systems combines intelligent applications such as autonomous intelligent mining,human–machine collaborative rapid tunneling,unmanned auxiliary transportation,closed-loop safety control,lean collaborative operation,and intelligent ecology.Progress in intelligent mining technology was described in terms of a dynamic modifed geological model,underground 5G network and positioning technology,intelligent control of the mining height and straightness of the longwall working face,and intelligent mining equipment.The development of intelligent coal mines was analyzed in terms of its imbalances,bottlenecks,and the compatibility of large-scale systems.Implementation ideas for promoting the development of intelligent coal mines were proposed,such as establishing construction standards and technical specifcations,implementing classifcation and grading standards according to mining policy,accelerating key technology research,and building a new management and control model.展开更多
Proton conduction controlled by light is important for advanced applications in sensors and information processing devices.We herein report a metal-organic framework(MOF)thin film by introducing indocyanine green dye ...Proton conduction controlled by light is important for advanced applications in sensors and information processing devices.We herein report a metal-organic framework(MOF)thin film by introducing indocyanine green dye into HSB-W5(HSB=hydrogenated Schiff base)matrix(ICG@HSB-W5)to construct a series of basic logic gates(NOT,NAND,and NOR)on account of its good photothermal conversion ability and photo-controlled proton conductivity.The proton conductivity of ICG@HSB-W5 thin film is 25 times higher than that of the pristine HSB-W5 thin film and responses efficiently to lasers.In addition,the change of proton conductivity is very large with an ON/OFF ratio above1000 and enough to be distinguished to build logic gates.In this logic gate system,808-and 405-nm lasers are used as inputs and the proton conductivity is used as output signal with different thresholds.The electrical output signal is convenient and available to be received and detected.It offers a new route for the design of molecular logic gates based on MOF and facilitates the construction of proton-based logic gate or more complicated logic devices.展开更多
A new LUT and carry structure embedded in the configurable logic block of an FPGA is proposed. The LUT is designed to support both 4-input and 5-input structures, which can be configured by users according to their ne...A new LUT and carry structure embedded in the configurable logic block of an FPGA is proposed. The LUT is designed to support both 4-input and 5-input structures, which can be configured by users according to their needs without increasing interconnect resources. We also develop a new carry chain structure with an optimized critical path. Finally a newly designed configurable scan-chain is inserted. The circuit is fabricated in 0.13μm 1P8M 1.2/2.5/3.3 V logic CMOS process. The test results show a correct function of 4/5-input LUT and scan- chain, and a speedup in carry performance of nearly 3 times over current architecture in the same technology at the cost of an increase in total area of about 72.5%. Our results also show that the logic utilization of this work is better than that of a Virtex lI/Virtex 4/Virtex 5/Virtex 6/Virtex 7 FPGA when implemented using only 4-LUT and better than that of a Virtex lI/Virtex 4 FPGA when implemented using only 5-LUT.展开更多
文摘In this study, the mechanical properties of aluminum-5%magnesium doped with rare earth metal neodymium were evaluated. Fuzzy logic (FL) and artificial neural network (ANN) were used to model the mechanical properties of aluminum-5%magnesium (0-0.9 wt%) neodymium. The single input (SI) to the fuzzy logic and artificial neural network models was the percentage weight of neodymium, while the multiple outputs (MO) were average grain size, ultimate tensile strength, yield strength elongation and hardness. The fuzzy logic-based model showed more accurate prediction than the artificial neutral network-based model in terms of the correlation coefficient values (R).
文摘Under various deployment circumstances,fifth-generation(5G)telecommunications delivers improved network compound management with fast communication channels.Due to the introduction of the Internet of Things(IoT)in data management,the majority of the ultra-dense network models in 5G networks frequently have decreased spectral efficiency,weak handover management,and vulnerabilities.The majority of traditional handover authentication models are seriously threatened,making them vulnerable to a variety of security attacks.The authentication of networked devices is the most important issue.Therefore,a model that incorporates the handover mechanism and authentication model must be created.This article uses a fuzzy logic model to create a handover and key management system that focuses on cloud handover management and authentication performance.In order to decrease delays in 5G networks,the fuzzy logic is built with multiple criteria that aim to reduce the number of executed handovers and target cell selection.The simulation is run to evaluate the model’s performance in terms of latency,spatial complexity,and other metrics related to authentication attack validation.
文摘With the introduction of EUV lithography,the photolithographic process in 5 nm logic process can be simplified to use mostly single exposure method.In a typical 5 nm logic process,the contact-poly pitch(CPP)is 44-50 nm,the minimum metal pitch(MPP)is around 30-32 nm.And the overlay budget is estimated to be 2.5 nm(on product overlay).Although the optical resolution of a 0.33NA exposure tool(such as ASML NXE3400)can reach below 32 nm pitch,stochastics in the EUV absorption in photoresists has limited its application to smaller pitches.For the CPP mentioned above,one can use 193 nm immersion lithography with Self-Aligned Double Patterning(SADP)technique to provide good image contrast(or CDU,LWR)as well as good overlay,as for the 10 and 7 nm generations.In the BEOL,however,the 30-32 pitch cannot be realized by a single EUV exposure with enough printing defect process window.If this pitch is to be done by 193 nm immersion lithography,more than 6-8 exposures are needed with very complicated overlay result.For EUV,this can be done through self-aligned LELE with both good CD and overlay control.We have done an optimization of the photolithographic process parameters for the typical metal with a self-developed aerial image simulator based on rigorous coupled wave analysis(RCWA)algorithm and the Abbe imaging routine with an EUV absorption model which describes stochastics.We have calibrated our model with wafer exposure data from several photoresists under collaboration with IMEC.As we have presented last year,to accommodate all pitches under a logic design rule,as well as to provide enough CDU for the logic device performance,in DUV lithography,a typical minimum exposure latitude(EL)for the poly and metal layers can be set at,respectively,18%and 13%.In EUV,due to the existence of stochastics,13%EL,which corresponds to an imaging contrast of 40%,seems not enough for the metal trenches,and to obtain an imaging contrast close to 100%,which yields an EL of 31.4%means that we need to relax minimum pitch to above 41 nm(conventional imaging limit for 0.33NA).This is the best imaging contrast a photolithographic process can provide to reduce LWR and stochastics.In EUV,due to the significantly smaller numerical apertures compared to DUV,the aberration impact can cause much more pronounced image registration error,in order to satisfy 2.5 nm total overlay,the aberration induced shift needs to be kept under 0.2 nm.We have also studied shadowing effect and mask 3D scattering effect and our results will be provided for discussion.
基金I thank the higher management team from Shanghai IC R&D Company for the support of this work.
文摘5 nm logic process is the current leading-edge technology which is under development in world-wide leading foundries.In a typical 5 nm logic process,the Fin pitch is 22~27 nm,the contact-poly pitch(CPP)is 48?55 nm,and the minimum metal pitch(MPP)is around 30~36 nm.Due to the fact that these pitches are much smaller than the resolution capability of 193 nm immersion lithography,it is also the first generation which adopts EUV photolithography technology on a large-scale where the process flow can be simplified by single exposure method from more than 10 layers.Relentless scaling brings big challenges to process integration and pushes each process module to the physical and material limit.Therefore,the success of process development will largely depend on careful balance the pros and cons to achieve both performance and yield targets.In the paper,we discussed the advantages and disadvantages of different process approaches for key process loops for 5 nm logic process flow,including dummy poly cut versus metal gate cut approaches in the metal gate loops,self-aligned contact(SAC)versus brutally aligned contact(BAC)approaches,and also introduced the self-aligned double patterning approach in the lower metal processes.Based on the above evaluation,we will provide a recommendation for module's process development.
基金supported by the National Natural Science Foundation of China(Grant Numbers 51834006 and 51874174).
文摘This study considered the role of coal as China’s basic energy source and examines the development of the coal industry.We focused on the intelligent development of coal mines,and introduced the“Chinese mode”of intelligent mining in underground coal mines,which uses complete sets of technical equipment to propose classifcation and grading standards.In view of the basic characteristics and technical requirements of intelligent coal mine systems,we established a digital logic model and propose an information entity and knowledge map construction method.This involves an active information push strategy based on a knowledge demand model and an intelligent portfolio modeling and distribution method for collaborative control of coal mines.The top-level architecture of 5G+intelligent coal mine systems combines intelligent applications such as autonomous intelligent mining,human–machine collaborative rapid tunneling,unmanned auxiliary transportation,closed-loop safety control,lean collaborative operation,and intelligent ecology.Progress in intelligent mining technology was described in terms of a dynamic modifed geological model,underground 5G network and positioning technology,intelligent control of the mining height and straightness of the longwall working face,and intelligent mining equipment.The development of intelligent coal mines was analyzed in terms of its imbalances,bottlenecks,and the compatibility of large-scale systems.Implementation ideas for promoting the development of intelligent coal mines were proposed,such as establishing construction standards and technical specifcations,implementing classifcation and grading standards according to mining policy,accelerating key technology research,and building a new management and control model.
基金supported by the National Natural Science Foundations of China(NSFC 21875212)the Key Program of National Natural Science and Foundation(NSFC 51632008)+1 种基金Major R&D plan of Zhejiang Natural Science Foundation(LD18E020001)the Fundamental Research Funds for the Central Universities。
文摘Proton conduction controlled by light is important for advanced applications in sensors and information processing devices.We herein report a metal-organic framework(MOF)thin film by introducing indocyanine green dye into HSB-W5(HSB=hydrogenated Schiff base)matrix(ICG@HSB-W5)to construct a series of basic logic gates(NOT,NAND,and NOR)on account of its good photothermal conversion ability and photo-controlled proton conductivity.The proton conductivity of ICG@HSB-W5 thin film is 25 times higher than that of the pristine HSB-W5 thin film and responses efficiently to lasers.In addition,the change of proton conductivity is very large with an ON/OFF ratio above1000 and enough to be distinguished to build logic gates.In this logic gate system,808-and 405-nm lasers are used as inputs and the proton conductivity is used as output signal with different thresholds.The electrical output signal is convenient and available to be received and detected.It offers a new route for the design of molecular logic gates based on MOF and facilitates the construction of proton-based logic gate or more complicated logic devices.
基金supported by the National High Technology Research and Development Thematic Program of China(No.2012AA012001)
文摘A new LUT and carry structure embedded in the configurable logic block of an FPGA is proposed. The LUT is designed to support both 4-input and 5-input structures, which can be configured by users according to their needs without increasing interconnect resources. We also develop a new carry chain structure with an optimized critical path. Finally a newly designed configurable scan-chain is inserted. The circuit is fabricated in 0.13μm 1P8M 1.2/2.5/3.3 V logic CMOS process. The test results show a correct function of 4/5-input LUT and scan- chain, and a speedup in carry performance of nearly 3 times over current architecture in the same technology at the cost of an increase in total area of about 72.5%. Our results also show that the logic utilization of this work is better than that of a Virtex lI/Virtex 4/Virtex 5/Virtex 6/Virtex 7 FPGA when implemented using only 4-LUT and better than that of a Virtex lI/Virtex 4 FPGA when implemented using only 5-LUT.
