Low surface energy layers, proposed application for non-water printing in computer to plate （CTP） technology, are deposited in both continuous wave and pulse radio frequency （13.56 MHz） plasma with hexamethyldisil...Low surface energy layers, proposed application for non-water printing in computer to plate （CTP） technology, are deposited in both continuous wave and pulse radio frequency （13.56 MHz） plasma with hexamethyldisiloxane （HMDSO） as precursor. It is found that the plasma mode dominates the polymer growth rate and the surface composition. Derived from the spectra of X-ruy photoelectron spectroscopy （XPS） and combined with printable test it is concluded that concentration of Si in coatings plays an important role for the ink printability and the ink does not adhere on the surface with high silicon concentration.展开更多
Manufacturing and integration of micro-electro-mechanical systems （MEMS） devices and integrated circuits （ICs） by wafer bonding often generate problems caused by thermal properties of materials. This paper present...Manufacturing and integration of micro-electro-mechanical systems （MEMS） devices and integrated circuits （ICs） by wafer bonding often generate problems caused by thermal properties of materials. This paper presents a low temperature wafer direct bonding process assisted by 02 plasma. Silicon wafers were treated with wet chemical cleaning and subsequently activated by 02 plasma in the etch element of a sputtering system. Then, two wafers were brought into contact in the bonder followed by annealing in N2 atmosphere for several hours. An infrared imaging system was used to detect bonding defects and a razor blade test was carried out to determine surface energy. The bonding yield reaches 90%--95% and the achieved surface energy is 1.76 J/m2 when the bonded wafers are annealed at 350 ~C in N2 atmosphere for 2 h. Void formation was systematically observed and eli-mination methods were proposed. The size and density of voids greatly depend on the annealing temperature. Short O2 plasma treatment for 60 s can alleviate void formation and enhance surface energy. A pulling test reveals that the bonding strength is more than 11.0 MPa. This low temperature wafer direct bonding process provides an efficient and reliable method for 3D integration, system on chip, and MEMS packaging.展开更多
基金the Beijing Institute of Graphic Communication Talent Founds,PHR (IHLB) and the Beijing Key Scientific Research Foundation for Returned Overseas and NSFCs 10475010,10775017
文摘Low surface energy layers, proposed application for non-water printing in computer to plate （CTP） technology, are deposited in both continuous wave and pulse radio frequency （13.56 MHz） plasma with hexamethyldisiloxane （HMDSO） as precursor. It is found that the plasma mode dominates the polymer growth rate and the surface composition. Derived from the spectra of X-ruy photoelectron spectroscopy （XPS） and combined with printable test it is concluded that concentration of Si in coatings plays an important role for the ink printability and the ink does not adhere on the surface with high silicon concentration.
基金Project supported by the Foreign Cultural and Educational Experts Employing Plan,Ministry of Education,China (No. TS2010CQDX 056)the Fundamental Research Funds for the Central Universi-ties,China (No. CDJZR12135502)
文摘Manufacturing and integration of micro-electro-mechanical systems （MEMS） devices and integrated circuits （ICs） by wafer bonding often generate problems caused by thermal properties of materials. This paper presents a low temperature wafer direct bonding process assisted by 02 plasma. Silicon wafers were treated with wet chemical cleaning and subsequently activated by 02 plasma in the etch element of a sputtering system. Then, two wafers were brought into contact in the bonder followed by annealing in N2 atmosphere for several hours. An infrared imaging system was used to detect bonding defects and a razor blade test was carried out to determine surface energy. The bonding yield reaches 90%--95% and the achieved surface energy is 1.76 J/m2 when the bonded wafers are annealed at 350 ~C in N2 atmosphere for 2 h. Void formation was systematically observed and eli-mination methods were proposed. The size and density of voids greatly depend on the annealing temperature. Short O2 plasma treatment for 60 s can alleviate void formation and enhance surface energy. A pulling test reveals that the bonding strength is more than 11.0 MPa. This low temperature wafer direct bonding process provides an efficient and reliable method for 3D integration, system on chip, and MEMS packaging.
