Relationship between amounts of low-melting-point eutectics and hot tearing susceptibility of ternary Al−Cu−Mg alloys during solidification

A systematical study on the relationship between the amounts of different eutectic phases especially the low-melting-point(LMP)eutectics and the hot tearing susceptibility of ternary Al−Cu−Mg alloys during solidification was performed.By controlling the concentrations of major alloying elements(Cu,Mg),the amounts of LMP eutectics at the final stages of solidification were varied and the corresponding hot tearing susceptibility(HTS)was determined.The results showed that the Al−4.6Cu−0.4Mg(wt.%)alloy,which contained the smallest fraction of LMP eutectics among the investigated alloys,was observed to be the most susceptible to hot tearing.With the amount of total residual liquid being approximately the same in the alloys,the hot tearing resistance is considered to be closely related to the amounts of LMP eutectics.Specifically,the higher the amount of LMP eutectics was,the lower the HTS of the alloy was.Further,the potential mechanism of low HTS for alloys with high amounts of LMP eutectics among ternary Al−Cu−Mg alloys was discussed in terms of feeding ability and permeability as well as total viscosity evolution during solidification.

泡沫铜/低熔点合金复合相变材料凝固放热分析

为研究泡沫铜/低熔点合金(LMPA)复合相变材料在间歇放热工作环境下恢复至初始状态的能力及不同孔隙率泡沫铜的添加对其凝固放热过程的影响,通过数值模拟对比分析了47合金、正二十三烷与泡沫铜复合前后的凝固放热过程,并调节泡沫铜/47合金复合材料孔隙率计算模拟芯片温度在凝固放热过程中温度随时间变化曲线。结果表明:泡沫铜的添加对2类材料凝固过程均有促进作用,模拟芯片恢复至目标温度所需时间分别被缩短6.6%和47.7%。因体积潜热值的差距,泡沫铜/47合金凝固时需放出更多热量,恢复至目标温度的时间较长,是正二十三烷复合相变材料的1.52倍。随着孔隙率的增大,复合相变材料恢复至室温状态所用时长变化不大,考虑到孔隙率对相变热控过程中的影响,实际使用时应综合考虑。

基于低熔点合金相变的变刚度软体机械臂稳态传热研究

建立了基于低熔点合金相变的变刚度软体机械臂稳态传热模型,通过理论方法计算了机械臂稳态传热过程中各子模块的温度、传热功率和螺旋盘管中水的对流换热情况,并利用COMSOL Multiphysics仿真软件直观表达其稳态传热过程。仿真结果与理论计算结果差异在4.5%以内。理论分析和仿真结果可用于指导软体机械臂变刚度模块的设计。