Isothermal solidification process of a dissimilar transient liquid phase （TLP） bonding of FSX-414/MBF80/IN738 system was simulated by finite difference method. The TLP joint model was divided into two parts and a mo...Isothermal solidification process of a dissimilar transient liquid phase （TLP） bonding of FSX-414/MBF80/IN738 system was simulated by finite difference method. The TLP joint model was divided into two parts and a moving liquid /solid interface model was used for the parts. Diffusion equations were solved for each half of the joints simultaneously up to the end of isothermal solidification. The completion time of isothermal solidification, concentration profiles and position of the solid/liquid interface for each half were calculated. The intersection of the solid/liquid interfaces of two halves was considered the end of isothermal solidification. To obtain some required diffusion data, TLP bonding of FSX-414/MBF80/IN738 was performed at different temperature and time under vacuum atmosphere. The calculated results show good agreement with the experimental results.展开更多
The Ni-base single crystal superalloy was bonded by the transient liquid phase (TLP) bonding, using a Ni-base flexible metal cloth as an insert alloy. TLP bonding of superalloy was carried out at 1473-1523 K for 0.5-2...The Ni-base single crystal superalloy was bonded by the transient liquid phase (TLP) bonding, using a Ni-base flexible metal cloth as an insert alloy. TLP bonding of superalloy was carried out at 1473-1523 K for 0.5-24 h in vacuum. The [001] orientation of each test specimen was aligned perpendicular to the joint interface. The bonded region was observed by optical microscopy, and the microstructural and compositional analyses across the bonded interlayer were performed by using a scanning electron microscopy (SEM). The electron back scattering diffraction (EBSD) method was applied to determine the crystallographic orientation. The results indicated that the chemical homogeneity across the bonded region can be achieved, and γ' phase both in the bonded interlayer and in the superalloy substrate is almost identical, while the bonded interlayer had almost matched the crystallographic orientation of the bonded substrates.展开更多
DD6 alloy was bonded by transient liquid phase (TLP) diffusion bonding. The main compositions of the interlayer alloy employed were similar to those of the base metal, DD6, and a certain amount of element B was added ...DD6 alloy was bonded by transient liquid phase (TLP) diffusion bonding. The main compositions of the interlayer alloy employed were similar to those of the base metal, DD6, and a certain amount of element B was added as the melting point depressant. The results show that it is difficult to obtain the joints with the microstructures completely homogeneous. For the joint TLP diffusion bonded at 1290℃ for 12h, about half areas of the beam possessed a γ+γ′ microstructure, nearly identical with that of the base metal, and the other local areas consisted of γ-solution, borides, etc. Prolonging the bonding time to 24h, the inhomogeneous areas in the joint reduced, and the joint property improved. The joint stress-rupture strength at 980℃ and 1100℃ reached 90%-100% and 70%-80% of those of the base metal respectively.展开更多
Influences of gap size and cyclic-thermal-shock treatment on the mechanical properties of transient liquid phase（TLP） bonded IN-738 LC superalloy were investigated. For this purpose, TLP bonding of IN-738 LC superal...Influences of gap size and cyclic-thermal-shock treatment on the mechanical properties of transient liquid phase（TLP） bonded IN-738 LC superalloy were investigated. For this purpose, TLP bonding of IN-738 LC superalloy was carried out in a vacuum furnace using powdered AMS 4777 as the filler metal. The results showed that isothermal solidified zone（ISZ） consisted of Ni solid-solution and the distribution of alloying elements was homogeneous. High hardness of HV 409 and high shear strength of 506 MPa were observed in 40 μm gap sample. Alloying elements formed γ′ precipitates and the solid-solution in the ISZ. Hardness and shear strength of bonds were reduced with increasing the gap size（in range of 40-120 μm）. The fractured surfaces of complete isothermal solidified bonds showed dimpled rupture, but athermal solidified bonds showed cleavage fracture surface. 10, 20, 30 and 40 thermal-shock cycles were applied to 80 μm gap samples, respectively. The shear strength of the bond was measured to be 268 MPa after the 40 th thermal-shock cycle. The sample with gap size of 80 μm was failed due to crack nucleation on faying surface at 45 th thermal-shock cycle. The amount of the produced brittleness due to quenching the samples in water bath was attributed to the number of thermal-shock cycles.展开更多
The effects of joining temperature(TJ)and time(tJ)on microstructure of the transient liquid phase(TLP)bonding of GTD-111 superalloy were investigated.The bonding process was applied using BNi-3 filler at temperatures ...The effects of joining temperature(TJ)and time(tJ)on microstructure of the transient liquid phase(TLP)bonding of GTD-111 superalloy were investigated.The bonding process was applied using BNi-3 filler at temperatures of 1080,1120,and 1160℃ for isothermal solidification time of 195,135,and 90 min,respectively.Homogenization heat treatment was also applied to all of the joints.The results show that intermetallic and eutectic compounds such as Ni-rich borides,Ni−B−Si ternary compound and eutectic-γcontinuously are formed in the joint region during cooling.By increasing tJ,intermetallic phases are firstly reduced and eventually eliminated and isothermal solidification is completed as well.With the increase of the holding time at all of the three bonding temperatures,the thickness of the athermally solidified zone(ASZ)and the volume fraction of precipitates in the bonding area decrease and the width of the diffusion affected zone(DAZ)increases.Similar results are also obtained by increasing TJ from 1080 to 1160℃ at tJ=90 min.Furthermore,increasing the TJ from 1080 to 1160℃ leads to the faster elimination of intermetallic phases from the ASZ.However,these phases are again observed in the joint region at 1180℃.It is observed that by increasing the bonding temperature,the bonding width and the rate of dissolution of the base metal increase.Based on these results,increasing the homogenization time from 180 to 300 min leads to the elimination of boride precipitates in the DAZ and a high uniformity of the concentration of alloying elements in the joint region and the base metal.展开更多
The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface...The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.展开更多
Transient Liquid Phase Diffusion bonding (TLP bonding) is an effective method to achieve excellent joint of DD6, which is a new generation single crystal superalloy to manufacture aero-engine turbine blades. In this p...Transient Liquid Phase Diffusion bonding (TLP bonding) is an effective method to achieve excellent joint of DD6, which is a new generation single crystal superalloy to manufacture aero-engine turbine blades. In this paper, the interlayer alloys for DD6 TLP bonding were designed. The alloy foils with thickness 40 μm ~ 60 μm, width 4 mm were prepared by using a single roller rapid solidification apparatus and the TLP bonding of DD6 was conducted. Then the joint microstructure and alloying elements diffusion behaviors were analyzed. The results indicate that microstructures of interlayer alloys prepared are fine and homogeneous, the melting point range of alloys from 1070°C to 1074°C and their melting temperature interval is merely 20°C, when the chemical composition of alloys are 1.5 ~ 2.0Cr, 3.2 ~ 4.0W, 3.7 ~ 4.5Co, 2.2 ~ 3.0Al, 0.7 ~ 1.0Mo, 3.2B, remain Ni (wt%). When the welding parameters are bonding temperature 1200?C, holding time 8.0 hour and welding pressure 0.3 MPa, the compacted joints obtained and the microstructure of TLP bonding seams were similar to base metal. The bonding joint is composed of weld center zone, isothermal solidification zone and diffusion-affected zone. Within joint, the elements diffusion is sufficient and borides in the diffusion zone are fewer.展开更多
The basic force and bonding energy in wafer bonding have been revealed in this study. The basic cause for bonding contributes to the interatomic attractive forces between surfaces or the reduction of surface energies....The basic force and bonding energy in wafer bonding have been revealed in this study. The basic cause for bonding contributes to the interatomic attractive forces between surfaces or the reduction of surface energies. The amplitude of roughness component can not exceed the criterion if wafer pair is bondable. The bonding behavior and challenge during annealing have been investigated.展开更多
文摘Isothermal solidification process of a dissimilar transient liquid phase （TLP） bonding of FSX-414/MBF80/IN738 system was simulated by finite difference method. The TLP joint model was divided into two parts and a moving liquid /solid interface model was used for the parts. Diffusion equations were solved for each half of the joints simultaneously up to the end of isothermal solidification. The completion time of isothermal solidification, concentration profiles and position of the solid/liquid interface for each half were calculated. The intersection of the solid/liquid interfaces of two halves was considered the end of isothermal solidification. To obtain some required diffusion data, TLP bonding of FSX-414/MBF80/IN738 was performed at different temperature and time under vacuum atmosphere. The calculated results show good agreement with the experimental results.
文摘The Ni-base single crystal superalloy was bonded by the transient liquid phase (TLP) bonding, using a Ni-base flexible metal cloth as an insert alloy. TLP bonding of superalloy was carried out at 1473-1523 K for 0.5-24 h in vacuum. The [001] orientation of each test specimen was aligned perpendicular to the joint interface. The bonded region was observed by optical microscopy, and the microstructural and compositional analyses across the bonded interlayer were performed by using a scanning electron microscopy (SEM). The electron back scattering diffraction (EBSD) method was applied to determine the crystallographic orientation. The results indicated that the chemical homogeneity across the bonded region can be achieved, and γ' phase both in the bonded interlayer and in the superalloy substrate is almost identical, while the bonded interlayer had almost matched the crystallographic orientation of the bonded substrates.
文摘DD6 alloy was bonded by transient liquid phase (TLP) diffusion bonding. The main compositions of the interlayer alloy employed were similar to those of the base metal, DD6, and a certain amount of element B was added as the melting point depressant. The results show that it is difficult to obtain the joints with the microstructures completely homogeneous. For the joint TLP diffusion bonded at 1290℃ for 12h, about half areas of the beam possessed a γ+γ′ microstructure, nearly identical with that of the base metal, and the other local areas consisted of γ-solution, borides, etc. Prolonging the bonding time to 24h, the inhomogeneous areas in the joint reduced, and the joint property improved. The joint stress-rupture strength at 980℃ and 1100℃ reached 90%-100% and 70%-80% of those of the base metal respectively.
文摘Influences of gap size and cyclic-thermal-shock treatment on the mechanical properties of transient liquid phase（TLP） bonded IN-738 LC superalloy were investigated. For this purpose, TLP bonding of IN-738 LC superalloy was carried out in a vacuum furnace using powdered AMS 4777 as the filler metal. The results showed that isothermal solidified zone（ISZ） consisted of Ni solid-solution and the distribution of alloying elements was homogeneous. High hardness of HV 409 and high shear strength of 506 MPa were observed in 40 μm gap sample. Alloying elements formed γ′ precipitates and the solid-solution in the ISZ. Hardness and shear strength of bonds were reduced with increasing the gap size（in range of 40-120 μm）. The fractured surfaces of complete isothermal solidified bonds showed dimpled rupture, but athermal solidified bonds showed cleavage fracture surface. 10, 20, 30 and 40 thermal-shock cycles were applied to 80 μm gap samples, respectively. The shear strength of the bond was measured to be 268 MPa after the 40 th thermal-shock cycle. The sample with gap size of 80 μm was failed due to crack nucleation on faying surface at 45 th thermal-shock cycle. The amount of the produced brittleness due to quenching the samples in water bath was attributed to the number of thermal-shock cycles.
文摘The effects of joining temperature(TJ)and time(tJ)on microstructure of the transient liquid phase(TLP)bonding of GTD-111 superalloy were investigated.The bonding process was applied using BNi-3 filler at temperatures of 1080,1120,and 1160℃ for isothermal solidification time of 195,135,and 90 min,respectively.Homogenization heat treatment was also applied to all of the joints.The results show that intermetallic and eutectic compounds such as Ni-rich borides,Ni−B−Si ternary compound and eutectic-γcontinuously are formed in the joint region during cooling.By increasing tJ,intermetallic phases are firstly reduced and eventually eliminated and isothermal solidification is completed as well.With the increase of the holding time at all of the three bonding temperatures,the thickness of the athermally solidified zone(ASZ)and the volume fraction of precipitates in the bonding area decrease and the width of the diffusion affected zone(DAZ)increases.Similar results are also obtained by increasing TJ from 1080 to 1160℃ at tJ=90 min.Furthermore,increasing the TJ from 1080 to 1160℃ leads to the faster elimination of intermetallic phases from the ASZ.However,these phases are again observed in the joint region at 1180℃.It is observed that by increasing the bonding temperature,the bonding width and the rate of dissolution of the base metal increase.Based on these results,increasing the homogenization time from 180 to 300 min leads to the elimination of boride precipitates in the DAZ and a high uniformity of the concentration of alloying elements in the joint region and the base metal.
基金The work was financially supported by the National Natural Science Foundation of China under grant Nos. 50275076 and 50075039.
文摘The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.
文摘Transient Liquid Phase Diffusion bonding (TLP bonding) is an effective method to achieve excellent joint of DD6, which is a new generation single crystal superalloy to manufacture aero-engine turbine blades. In this paper, the interlayer alloys for DD6 TLP bonding were designed. The alloy foils with thickness 40 μm ~ 60 μm, width 4 mm were prepared by using a single roller rapid solidification apparatus and the TLP bonding of DD6 was conducted. Then the joint microstructure and alloying elements diffusion behaviors were analyzed. The results indicate that microstructures of interlayer alloys prepared are fine and homogeneous, the melting point range of alloys from 1070°C to 1074°C and their melting temperature interval is merely 20°C, when the chemical composition of alloys are 1.5 ~ 2.0Cr, 3.2 ~ 4.0W, 3.7 ~ 4.5Co, 2.2 ~ 3.0Al, 0.7 ~ 1.0Mo, 3.2B, remain Ni (wt%). When the welding parameters are bonding temperature 1200?C, holding time 8.0 hour and welding pressure 0.3 MPa, the compacted joints obtained and the microstructure of TLP bonding seams were similar to base metal. The bonding joint is composed of weld center zone, isothermal solidification zone and diffusion-affected zone. Within joint, the elements diffusion is sufficient and borides in the diffusion zone are fewer.
文摘The basic force and bonding energy in wafer bonding have been revealed in this study. The basic cause for bonding contributes to the interatomic attractive forces between surfaces or the reduction of surface energies. The amplitude of roughness component can not exceed the criterion if wafer pair is bondable. The bonding behavior and challenge during annealing have been investigated.
