Growth of a-Plane GaN Films on r-Plane Sapphire by Combining Metal Organic Vapor Phase Epitaxy with the Hydride Vapor Phase Epitaxy

Hydride vapor phase epitaxy （HVPE） is utilized to grow nonpolar a-plane GaN layers on r-plane sapphire templates prepared by metal organic vapor phase epitaxy （MOVPE）. The surface morphology and microstructures of the samples are characterized by atomic force microscopy. The full width at half maximum （FWHM） of the HVPE sample shows a W-shape and that of the MOVPE sample shows an M-shape plane with the degree of 0 in the high-resolution x-ray diffraction （HRXRD） results. The surface morphology attributes to this significant anisotropic. HRXRD reveals that there is a significant reduction in the FWHM, both on-axis and off-axis for HVPE GaN are compared with the MOVPE template. The decrease of the FWHM of E2 （high） Raman scat tering spectra further indicates the improvement of crystal quality after HVPE. By comparing the results of secondary- ion-mass spectroscope and photoluminescence spectrum of the samples grown by HVPE and MOVPE, we propose that C-involved defects are originally responsible for the yellow luminescence.

6英寸SiC衬底上MOVPE生长GaN HEMT材料

采用金属有机气相外延(MOVPE)方法在6英寸(1英寸=2.54 cm)SiC衬底上生长了GaN HEMT材料。使用高分辨X射线衍射仪、原子力显微镜和微区拉曼光谱仪等对材料的表面形貌、晶体质量和应力进行了测试和表征。测试结果表明,GaN外延材料(002)面和(102)面的半高宽(FWHM)分别为204″和274″,表面粗糙度(扫描范围为5μm×5μm)为0.18 nm,GaN外延材料具有较好的晶体质量。拉曼光谱测试结果显示,6英寸GaN外延材料应力为压应力,并得到有效控制。非接触霍尔测试结果显示AlGaN/GaN HEMT结构材料二维电子气(2DEG)迁移率为2046 cm2/(V·s),面密度为6.78×1012 cm-2,方块电阻相对标准偏差为1.85%,结果表明,制备的6英寸GaN HEMT结构材料具有良好的电学性能。

Response time improvement of AlGaN photoconductive detectors by adjusting crystal-nuclei coalescence process in metal organic vapor phase epitaxy

AlGaN photoconductive ultraviolet detectors are fabricated to study their time response characteristics. Persistent photoconductivity, a deterring factor for the detector response time, is found to be strongly related to the grain boundary density in AlGaN epilayers. By improving the crystal-nuclei coalescence process in metal organic vapor phase epitaxy, the grain-boundary density can be reduced, resulting in an-order-of-magnitude decrease in response time.

Migration characterization of Ga and In adatoms on dielectric surface in selective MOVPE

Migration characterizations of Ga and In adatoms on the dielectric surface in selective metal organic vapor phase epitaxy （MOVPE） were investigated. In the typical MOVPE environment, the selectivity of growth is preserved for GaN, and the growth rate of GaN micro-pyramids is sensitive to the period of the patterned SiO2 mask. A surface migration induced model was adopted to figure out the effective migration length of Ga adatoms on the dielectric surface. Different from the growth of GaN, the selective area growth of InGaN on the patterned template would induce the deposition of InGaN polycrystalline particles on the patterned Si02 mask with a long period. It was demonstrated with a scanning electron microscope and energy dispersive spectroscopy that the In adatoms exhibit a shorter migration length on the dielectric surface.

A MOVPE method for improving InGaN growth quality by pre-introducing TMIn

We propose a metal organic vapor phase epitaxy(MOVPE) method of pre-introducing TMIn during the growth of uGa N to improve the subsequent growth of In Ga N and discuss the impact of this method in detail. Monitoring the MOVPE by the interference curve generated by the laser incident on the film surface, we found that this method avoided the problem of the excessive In Ga N growth rate. Further x-ray diffraction(XRD), photoluminescence(PL), and atomic force microscope(AFM) tests showed that the quality of In Ga N is improved. It is inferred that by introducing TMIn in advance, the indium atom can replace the gallium atom in the reactor walls, delivery pipes, and other corners. Hence the auto-incorporation of gallium can be reduced when In Ga N is grown, so as to improve the material quality.

Kinetic Study on Uniformity of AlGaAs Grown by MOVPE

The growth kinetic factors affecting the uniformity of AlGaAs in a horizontal atmospheric MOVPE (AP-MOVPE) reactor with a horizontal susceptor were investigated. The decrease in the growth rate of AlGaAs (R-AlGaAs) in the now direction is related to both the gas depletion and the decreasing growth rate of GaAs (R-GaAs) with the increasing gas temperature in this direction. The change of x in the flow direction has relations not only to the different changes of R-GaAs and R-AlAs(the growth rate of AlAs) with the gas temperature, according to which x will increase in the now direction, but also to the higher depletion rate of Al containing species compared with that of Ga containing species, according to which x: will decrease. Due to the similar reason, the loss of symmetry about the length axis of the susceptor can also result in the monotone increase or decrease in thickness and x in the crosswise direction.

Studies on Growth of N-Polar InN Films by Pulsed Metal-organic Vapor Phase Epitaxy

We reported the growth of N-polar InN films on N-polar GaN/sapphire substrates by pulsed metal-organic vapor phase epitaxy. The crystalline quality, surface morphology, optical and electrical properties of N-polar InN films were investigated in details by varying the breaking time and trimethylindium（TMIn） duration of pulse cycle. It has been found that when the breaking time and the TMIn duration in each cycle remain at 30 and 60 s, respectively, the N-polar InN film obtained exhibits a better crystalline quality and greater optical properties. Meanwhile, the surface morphology and electrical properties of the N-polar InN films also greatly depend on the given growth conditions.

Influence of adatom migration on wrinkling morphologies of AlGaN/GaN micro-pyramids grown by selective MOVPE

Ga N micro-pyramids with AlGaN capping layer are grown by selective metal–organic–vapor phase epitaxy（MOVPE）. Compared with bare Ga N micro-pyramids, AlGaN/Ga N micro-pyramids show wrinkling morphologies at the bottom of the structure. The formation of those special morphologies is associated with the spontaneously formed AlGaN polycrystalline particles on the dielectric mask, owing to the much higher bond energy of Al–N than that of Ga–N. When the sizes of the polycrystalline particles are larger than 50 nm, the uniform source supply behavior is disturbed, thereby leading to unsymmetrical surface morphology. Analysis reveals that the scale of surface wrinkling is related to the migration length of Ga adatoms along the AlGaN {1ī01} facet. The migration properties of Al and Ga further affect the distribution of Al composition along the sidewalls, characterized by the μ-PL measurement.

Quasi-homoepitaxial GaN-based blue light emitting diode on thick GaN template

The high power GaN-based blue light emitting diode(LED) on an 80-μm-thick GaN template is proposed and even realized by several technical methods like metal organic chemical vapor deposition(MOCVD), hydride vapor-phase epitaxial(HVPE), and laser lift-off(LLO). Its advantages are demonstrated from material quality and chip processing. It is investigated by high resolution X-ray diffraction(XRD), high resolution transmission electron microscope(HRTEM), Rutherford back-scattering(RBS), photoluminescence, current-voltage and light output-current measurements. The width of(0002) reflection in XRD rocking curve, which reaches 173 for the thick GaN template LED, is less than that for the conventional one, which reaches 258. The HRTEM images show that the multiple quantum wells(MQWs) in 80-μmthick GaN template LED have a generally higher crystal quality. The light output at 350 mA from the thick GaN template LED is doubled compared to traditional LEDs and the forward bias is also substantially reduced. The high performance of 80-μm-thick GaN template LED depends on the high crystal quality. However, although the intensity of MQWs emission in PL spectra is doubled, both the wavelength and the width of the emission from thick GaN template LED are increased. This is due to the strain relaxation on the surface of 80-μm-thick GaN template, which changes the strain in InGaN QWs and leads to InGaN phase separation.

石墨烯插入层对蓝宝石上GaN材料的应力调制

较大的晶格失配和热失配使得异质外延生长的GaN材料具有很高的残余应力,对材料和器件的性能产生重要影响。在蓝宝石衬底和GaN外延层之间插入一层石墨烯,通过Raman光谱和弯曲度测试分析了石墨烯插入层对GaN材料应力的影响。Raman测试结果表明,蓝宝石衬底上GaN材料压应力为0.56 GPa,引入石墨烯插入层后GaN材料压应力为0.08 GPa。弯曲度测试结果表明无石墨烯插入层的蓝宝石上GaN材料弯曲度约为21.74μm,引入石墨烯插入层后弯曲度约为1.39μm,引入石墨烯插入层的GaN材料弯曲度显著降低。讨论了石墨烯插入层对蓝宝石上GaN材料的应力调制机制,验证了石墨烯插入层技术对于异质衬底上获得完全弛豫GaN外延层的可行性。

具有多MO喷嘴垂直MOCVD反应腔外延层厚度均匀性的优化理论及应用

金属有机物化学气相淀积(metal organic chemical vapor deposition,MOCVD)作为异质结半导体材料外延的关键手段,其外延层厚度均匀性会直接影响产品的良率.本文将理论与实验相结合,针对3个MO源喷嘴的垂直反应腔MOCVD,将各MO源喷嘴等效为蒸发面源,并引入一等效高度来涵盖MOCVD的相关外延参数,建立外延层厚度与各MO源喷嘴流量间的定量关系,设计并利用EMCORE D125 MOCVD系统外延生长了AlGaAs谐振腔结构,根据实验测得的外延层厚度分布结果,利用最小二乘法对模型参数进行了拟合提取,基于提取的模型参数,给出了优化外延层厚度均匀性的方法.4 in(1 in=2.54 cm)外延片mapping反射谱的统计结果为,腔模的平均波长为651.89 nm,标准偏差为1.03 nm,厚度均匀性达到0.16%.同时外延生长了GaInP量子阱结构,4 in外延片mapping荧光光谱的统计结果为,峰值波长平均值为653.3 nm,标准偏差仅为0.46 nm,厚度均匀性达到0.07%.本文提出的调整外延层厚度均匀性的方法具有简单、有效、快捷的特点,且可以进一步推广至具有4个MO喷嘴以上的垂直反应腔MOCVD系统.

现代MOCVD技术的发展与展望

ＭＯＣＶＤ是一门制造化合物半导体器件的关键技术－ 本文综合分析了现代ＭＯＣＶＤ 技术的基本原理、特点及实现这种技术的设备的现状及其发展－ 重点讨论了能实现衬底温度、衬底表面反应源流均匀性的立式高速涡轮转盘ＭＯＣＶＤ技术－

基于GaN同质衬底的高迁移率AlGaN/GaNHEMT材料

研究了表面预处理对GaN同质外延的影响,获得了高电子迁移率AlGaN/GaN异质结材料.通过NH_3/H_2混合气体与H_2交替通入反应室的方法对GaN模板和GaN半绝缘衬底进行高温预处理.研究结果表明,NH_3/H_2能够抑制GaN的分解,避免粗糙表面,但不利于去除表面的杂质,黄光带峰相对强度较高;H_2促进GaN分解,随时间延长GaN分解加剧,导致模板表面粗糙不平,AlGaN/GaN HEMT材料二维电子气迁移率降低.采用NH_3/H_2混合气体与H_2交替气氛模式处理模板或衬底表面,能够清洁表面,去除表面杂质,获得平滑的生长表面和外延材料表面,有利于提高AlGaN/GaN HEMT材料电学性能.在GaN衬底上外延AlGaN/GaN HEMT材料,2DEG迁移率达到2113 cm^2/V·s,电学性能良好.

GaN核辐射探测器材料与器件研究进展

文章介绍GaN材料作为核探测器的潜在优势和国内外的研究状况,并概要综述GaN材料外延的主要技术、特点及其最新发展。通过模拟计算,总结了使用GaN制备核探测器对材料的基本要求。同时,根据目前的研究现状,提出了在GaN材料生长和器件制作方面存在的主要技术问题及其解决方向。

GaN基材料及其外延生长技术研究

介绍了GaN基材料的基本特性、三种主要外延生长技术(MOCVD、MBE、HVPE)、衬底材料的选择及缓冲层技术;分析得出目前存在的GaN体单晶技术不完善、外延成本高、衬底缺陷及接触电阻大等主要问题制约了研究的进一步发展;指出今后的研究重点是完善GaN体单晶材料的生长工艺,以利于深入研究GaN的物理特性及有效地解决衬底问题,研究缓冲层的材料、厚度、组分等以提高GaN薄膜质量。

RAS在线监测AlGaAs的MOCVD生长(英文)

通过瞬态反射各向异性谱和瞬态反射谱在线监测和研究了AlxGa1-xAs的生长过程,利用金属有机化合物汽相淀积技术在GaAs(001)衬底上生长了多层AlxGa1-xAs结构。选择最适合在线监测生长过程的探测光能量,在此探测光能量处所得到的反射各向异性谱和反射谱的信号在生长过程中有很明显的振荡行为产生。研究发现,通过瞬态反射各向异性谱可以很好地分辨出由表面引起的光学各向异性和由界面处引起的光学各向异性,能够得到界面处形成缺陷的信息,并且发现了反射各向异性谱和反射谱的信号随着铝组分的不同而发生有规律的变化。

GaAs/Al_xGa_(1-x)As多量子阱外延结构及其LP-MOCVD生长工艺研究

在低压金属有机化学气相沉积生长工艺中,对用于制作850nm垂直腔面发射激光器件的GaAs/Al_xGa_(1-x)As多量子阱外延结构的生长温度、反应室压力、总载气流量以及生长速度等主要工艺参量进行优化,并进行了完整外延结构的生长.实验结果表明:在700℃条件下,得到多种组分的GaAs/Al_xGa_(1-x)As多量子阱结构,通过光致发光谱对比测试得到的最佳组分x为0.24,同时得到良好的表面形貌,最终确定的最佳生长速度为0.34~0.511nm/s.

图形化蓝宝石衬底表面原位处理对GaN外延薄膜的影响

采用预铺Ga或NH_3氮化等方式原位处理图形化蓝宝石衬底(PSS)表面,然后外延生长了GaN薄膜,研究了PSS表面预处理对GaN薄膜表面形貌、晶体质量以及残余应力的影响。结果显示,PSS经过预铺Ga后生长的GaN薄膜具有平滑的表面和清晰平直的原子台阶,且位错密度最低;氮化后生长的GaN薄膜原子台阶较宽,螺型位错密度较低;衬底未经表面处理生长的GaN薄膜,原子台阶模糊,位错密度最高;同时,与氮化或未经预处理的方法相比,经过预铺Ga的方式预处理PSS表面后生长的GaN薄膜残余应力最小。分析认为,预铺Ga、氮化等方式处理衬底表面,改变了PSS微结构,有利于生长表面平滑、晶体质量高、残余应力小的GaN薄膜。

液相外延生长法层层组装金属-有机框架薄膜

作为新一代的多孔材料,金属-有机框架(MOFs)由于具有晶体结构多样性、比表面积高、热稳定性较好以及功能可调等优点而受到人们的广泛关注。如何制备高质量的MOFs薄膜并将其功能化应用是当前的研究热点。本综述将介绍一类通过液相外延生长法在功能化基底表面上层层组装MOFs薄膜(SURMOFs),并重点总结了SURMOFs的制备途径,包括层层浸渍法、层层泵式法、层层喷雾法、层层旋涂法以及层层流动法,从而为制备高质量SURMOFs提供了保障,将更有利于MOFs材料在传感器和器件等领域的应用。

金属有机物气相外延生长InAlGaN薄膜及其性能表征(英文)

在不同的生长温度和载气的条件下 ,采用低压金属有机物气相外延方法生长了系列的InAlGaN薄膜 ,通过能量色散谱 (EDS) ,高分辨X射线衍射 (HRXRD)和光致发光谱 (PL)对样品进行表征与分析 ,研究了生长工艺对InAlGaN外延层结构和光学性能的影响。发现当以氮气做载气时 ,样品的发光很弱并且在 5 5 0nm附近存在一个很宽的深能级发光峰 ;当采用氮气和氢气的混合气做载气时 ,样品中的深能级发光峰消失且发光强度明显提高。以混合气做载气 ,InAlGaN薄膜中铟的组分随生长温度的升高而降低 ,而薄膜的结构和光学性能却提高。结合PL和HRXRD的测试结果得到了较佳的生长参数 :即载气为氢气和氮气的混合气以及生长温度在 85 0℃到 870℃。