Active Micro-Nano-Collaborative Bioelectronic Device for Advanced Electrophysiological Recording

The development of precise and sensitive electrophysiological recording platforms holds the utmost importance for research in the fields of cardiology and neuroscience.In recent years,active micro/nano-bioelectronic devices have undergone significant advancements,thereby facilitating the study of electrophysiology.The distinctive configuration and exceptional functionality of these active micro-nano-collaborative bioelectronic devices offer the potential for the recording of high-fidelity action potential signals on a large scale.In this paper,we review three-dimensional active nano-transistors and planar active micro-transistors in terms of their applications in electroexcitable cells,focusing on the evaluation of the effects of active micro/nano-bioelectronic devices on electrophysiological signals.Looking forward to the possibilities,challenges,and wide prospects of active micro-nano-devices,we expect to advance their progress to satisfy the demands of theoretical investigations and medical implementations within the domains of cardiology and neuroscience research.

Fabrication of Fuze Micro-electro-mechanical System Safety Device

Fuze micro-electro-mechanical system（MEMS） has become a popular subject in recent years.Studies have been done for the application of MEMS-based fuze safety and arm devices.The existing researches mainly focused on reducing the cost and volume of the fuze safety device.The reduction in volume allows more payload and,thus,makes small-caliber rounds more effective and the weapon system more affordable.At present,MEMS-based fuze safety devices are fabricated mainly by using deep reactive ion ething or LIGA technology,and the fabrication process research on the fuze MEMS safety device is in the exploring stage.In this paper,a new micro fabrication method of metal-based fuze MEMS safety device is presented based on ultra violet（UV）-LIGA technology.The method consists of SU-8 thick photoresist lithography process,micro electroforming process,no back plate growing process,and SU-8 photoresist sacrificial layer process.Three kinds of double-layer moveable metal devices have been fabricated on metal substrates directly with the method.Because UV-LIGA technology and no back plate growing technology are introduced,the production cycle is shortened and the cost is reduced.The smallest dimension of the devices is 40 μm,which meets the requirement of size.To evaluate the adhesion property between electroforming deposit layer and substrate qualitatively,the impact experiments have been done on the device samples.The experimental result shows that the samples are still in good condition and workable after undergoing impact pulses with 20 kg peak and 150 μs duration and completely met the requirement of strength.The presented fabrication method provides a new option for the development of MEMS fuze and is helpful for the fabrication of similar kinds of micro devices.

Accuracy and Electromagnetic Safety Evaluation of a Portable Electromagnetic Localization System for Micro Invasive Medical Devices in Vivo

Aiming at localizing the telemetric capsule for detecting gastrointestinal physiological parameters in vivo accurately,a portable alternating current(AC)electromagnetic localization system is designed.To verify the feasibility of the method,the model and construction of the localization system are detailed.And static and dynamic accuracy of the localization system are tested by experiments.Next,we compare the simulating results of the electromagnetic radiation aroused by the localization system with the electromagnetic safety standards of human(ICNIRP guidelines and IEEE standard C95.1-1991).Finally,in terms of the results of the static and dynamic experiments,conclusions are drawn that the accuracy of portable positioning system is high(less than 10 mm)enough to satisfy the localization need of the micro invasive medical devices in vivo,and there is no harm of electromagnetic radiation to human.

Magnetostrictive Flexible Thin Film Structure for Micro Devices

Polyimide (Kapton, Dupont Corp.) based magnetostrictive thin film structures were designed and fabricated for micro device applications. In particular the growth of films on flexible substrates was studied to allow a simple integration of the system in miniaturized magnetostrictive devices. The films were fabricated on different substrates to compare their different magnetic and structural properties. It showed much more magnetostriction and higher impact resistance results compared with traditional Si based film type actuators. In the fabrication process, amorphous TbDyFe films with thicknesses of 500 nm, 1 μm, 1.5 μm respectively, were deposited on the designed substrate by DC magnetron sputtering. During sputtering process the substrate holder was maintained at room temperature. After the sputter process, X-ray diffraction studies were also carried out to determine the film structure and thickness of the sputtered film. At last, magnetization from VSM (Vibrating Sample Magnetometer) and magnetostriction from optical cantilever method of each structure were measured to estimate the magneto-mechanical characteristics under the external magnetic field lower than 0.7 T for micro-system applications.

RF Micro Devices开始交付802.11a WLAN芯片组

RF Micro Devices公司于1月7日宣布,开始交付首批802.11a WLAN(无线局域网)芯片组。公司预计一季度的交货量将逐步上升,在今年全年中都将加速增长。802.11a标准所支持的更高的传输速率和5GHz频段带来的更大的信道容量为高带宽应用(如大量用户间的多媒体交换)提供了一种高效、价廉的介质。这一WLAN技术标准还将使得2.4GHz和5GHz网络实现互操作。

California Micro Devices展示新近发布的移动ASIPTM器件

California Micro Device公司的市场部副总经理Kyle Baker于2月24日在Globalpress主办的电子产品高峰会(加州Monterey)上公开展示了其公司的新产品。他集中介绍了公司在无线手机市场方面的机遇和努力,并展示了独有的专用集成无源元件(Application-Specific IntegratedPassive,ASIP)。

Microwave Induced Ethanol Bath Bonding for PMMA Microfluidic Device

High bonding strength,low deformation and convenient procedure are all very important aspects in the microfluidic device fabrication process. In this paper,an improved microwave induced bonding technology is proposed to fabricate microfluidic device based on methyl methacrylate( PMMA). This method employs pure ethanol as the bonding assisted solvent. The ethanol not only acts as the microwave absorbing material,but also works as the organic solvent in bath. The presented research work has shown that the bonding process can be completed in less than 45 s. Furthermore,the convenient bonding only applies microwave oven,beakers and binder clips. Then,we discuss effects of microwave power,bonding time on bonding strength and deformation of microstructures on PMMA microfluidic device. Finally,a 4 layers micro-mixer has been fabricated using the proposed bonding technique which includes 15 trapezoid micro-channels,9 T-type mix units and an X-type mix unit. Experimental results show that the proposed bonding method have some advantages compared with several traditional bonding technologies,such as hot pressing bonding,ultrasonic bonding and solvent assisted bonding methods in respect of bonding strength,deformation and bonding process. The presented work would be helpful for low coat mass production of multilayer polymer microfluidic devices in lab.

Hybrid device for acoustic noise reduction and energy harvesting based on a silicon micro-perforated panel structure

A kind of hybrid device for acoustic noise reduction and vibration energy harvesting based on the silicon micro- perforated panel （MPP） resonant structure is investigated in the article. The critical parts of the device include MPP and energy harvesting membranes. They are all fabricated by means of silicon micro-electro-mechanical systems （MEMS） tech- nology. The silicon MPP has dense and accurate micro-holes. This noise reduction structure has the advantages of wide band and higher absorption coefficients. The vibration energy harvesting part is formed by square piezoelectric membranes arranged in rows. ZnO material is used as it has a good compatibility with the fabrication process. The MPP, piezo- electric membranes, and metal bracket are assembled into a hybrid device with multifunctions. The device exhibits good performances of acoustic noise absorption and acoustic-electric conversion. Its maximum open circuit voltage achieves 69.41 mV.

Digi—Key与RF MicroDevices签订全球分销协议

Digi-Key公司日前宣布，其已与RF Micro Devices．1nc．（简称RFMD）公司签订分销协议。RFMD是设计和制造推动移动通信应用的高性能射频系统及解决方案的全球领导者。RFMD公司的功率放大器．传输模块、蜂窝收发器和片上系统（SoC）解决方案可实现全球移动性．提供更高的连接能力．并支持当代及下一代移动手持设备、蜂窝基站．无线局域网（WLAN）和全球定位系统IGPS）。

California Micro Devices推出用于手机的Praetorian(R) Ⅲ LC滤波器架构 以成本更低的架构为高速数据接口提供更优质的EMI滤波

加州米尔皮塔斯2008年6月30日电／新华美通／-California Micro Devices（Nasdaq：CAMD）（简称“CMD”）今天宣布推出其用于手机的第三代Praetorian Ⅲ LC滤波器架构。Praetorian Ⅲ产品为滤波器性能树立了新的基准，以较Praetorian Ⅰ产品更低的成本（相当于最近推出的Praetorian Ⅱ系列产品的成本）提供了更高的性能。基于创新的耦合电感设计，CMD的Praetorian Ⅲ架构提供感应水平较高以及电容水平较低的滤波器。这使得滤波器设计可提供较同类竞争产品更高的衰减水平以及更高的信号完整性。

Maskless Microscopic Lithography through Shaping Ultraviolet Laser with Digital Micro-mirror Device

Laser shaping was introduced to maskless projection soft lithography by using digital micro-mirror device (DMD). The predesigned intensity pattern was imprinted onto the DMD and the input laser beam with a Gaussian or quasi-Gaussian distribution will carry the pattern on DMD to etch the resin. It provides a method of precise control of laser beam shapes and?photon-induced curing behavior of resin. This technology provides an accurate micro-fabrication of microstructures used for micro-systems. As a virtual mask generator and a binary-amplitude spatial light modulator, DMD is equivalent to the masks in the conventional exposure system. As the virtual masks and shaped laser beam can be achieved flexibly, it is a good method of precision soft lithography for 2D/3D microstructures.

Diode Laser Soldering Technology of Fine Pitch QFP Devices

The laser provides a controllable means of supplying localized energy for solder joint formation and is a valuable tool in electronics manufacture.Diode laser soldering for fine pitch QFP devices were carried out with Sn-Ag-Cu lead-free solder and Sn-Pb solder respectively,and the mechanical properties of micro-joints of the QFP devices were tested and studied by STR-1000 micro-joints tester.The results indicate that sound QFP micro-joints without bridging or solder ball are gained by means of diode laser soldering method with appropriate laser processing parameters,and the pitch of the QFP devices is as fine as to 0.4mm.Tensile strength of QFP micro-joints increases gradually with the increase of laser output power,the maximum tensile strength presents when the laser output power increase to a certain value.The results also indicate that the mechanical properties of QFP micro-joints soldered by diode laser soldering system are better than those of QFP micro-joints soldered by IR reflow soldering method.The experimental results may provide a theory guide for investigation of diode laser soldering.