The model developed for stress-induced structural phase transformations of micro-crystalline silicon films

The nanoindentations were applied to island-shaped regions with metal-induced Si crystallizations. The experimental stress-strain relationship is obtained from the load-depth profile in order to investigate the critical stresses arising at various phase transitions. The stress and strain values at various indentation depths are applied to determine the Gibbs free energy at various phases. The intersections of the Gibbs free energy lines are used to determine the possible paths of phase transitions arising at various indentation depths. All the critical contact stresses corresponding to the various phase transitions at four annealing temperatures were found to be consistent with the experimental results.

Evaluation on residual stresses of silicon-doped CVD diamond films using X-ray diffraction and Raman spectroscopy

The effect of silicon doping on the residual stress of CVD diamond films is examined using both X-ray diffraction (XRD) analysis and Raman spectroscopy measurements. The examined Si-doped diamond films are deposited on WC-Co substrates in a home-made bias-enhanced HFCVD apparatus. Ethyl silicate (Si(OC2H5)4) is dissolved in acetone to obtain various Si/C mole ratio ranging from 0.1% to 1.4% in the reaction gas. Characterizations with SEM and XRD indicate increasing silicon concentration may result in grain size decreasing and diamond [110] texture becoming dominant. The residual stress values of as-deposited Si-doped diamond films are evaluated by both sin2ψ method, which measures the (220) diamond Bragg diffraction peaks using XRD, with ψ-values ranging from 0° to 45°, and Raman spectroscopy, which detects the diamond Raman peak shift from the natural diamond line at 1332 cm-1. The residual stress evolution on the silicon doping level estimated from the above two methods presents rather good agreements, exhibiting that all deposited Si-doped diamond films present compressive stress and the sample with Si/C mole ratio of 0.1% possesses the largest residual stress of ~1.75 GPa (Raman) or ~2.3 GPa (XRD). As the silicon doping level is up further, the residual stress reduces to a relative stable value around 1.3 GPa.

Large Scale Homogeneous Growth Mechanics of Microcrystalline Silicon Films on Rough Surface

Large scale homogenous growth of microcrystalline silicon （μ.c-Si：H） on cheap substrates by inductively coupled plasma （ICP） of Ar diluted Sill4 has been studied. From XRD and Raman spectrum, we find that substrates can greatly affect the crystalline orientation, and the μc-Si：H films are comprised of small particles. Thickness detection by surface profilometry shows that the thin μc-Si：H films are homogenous in large scale. Distributions of both ion density and electron temperature are found to be uniform in the vicinity of substrate by means of diagnosis of Langmuir probe. Based on these experimental results, it can be proposed that rough surfaces play important roles in the crystalline network formation and Ar can affect the reaction process and improve the characteristics of μc-Si：H films. Also, ICP reactor can deposit the thin film in large scale.

Rain Erosion Behavior of Silicon Dioxide Films Prepared on Sapphire

Silicon dioxide （SiO2） films were prepared on sapphire （α-Al2O3） by radio frequency magnetron reactive sputtering in order to increase both transmission and rain erosion resistant performance of infrared domes of sapphire. Composition and structure of SiO2 films were analyzed by X-ray photoelectron spectroscopy （XPS） and X-ray diffraction （XRD）, respectively. The transmittance of uncoated and coated sapphire was measured using a Fourier transform infrared （FTIR） spectrometer. Rain erosion tests of the uncoated and coated sapphire were performed at 211 m/s impact velocity with an exposure time ranging from 1 to 8 min on a whirling arm rig. Results show that the deposited films can greatly increase the transmission of sapphire in mid-wave IR. After rain erosion test, decreases in normalized transmission were less than 1% for designed SiO2 films and the SiO2 coating was strongly bonded to the sapphire substrate. In addition, sapphires coated with SiO2 films had a higher transmittance than uncoated ones after rain erosion.

Study on stability of hydrogenated amorphous silicon films

Hydrogenated amorphous silicon （a-Si：H） films with high and same order of magnitude photosensitivity （-10^5） but different stability were prepared by using microwave electron cyclotron resonance chemical vapour deposition system under the different deposition conditions. It was proposed that there was no direct correlation between the photosensitivity and the hydrogen content （CH） as well as H-Si bonding configurations, but for the stability, they were the critical factors. The experimental results indicated that higher substrate temperature, hydrogen dilution ratio and lower deposition rate played an important role in improving the microstructure of a-Si：H films. We used hydrogen elimination model to explain our experimental results.

Reduced graphene oxide porous films containing SiC whiskers for constructing multilayer electromagnetic shields

Developing lightweight and flexible thin films for electromagnetic interference(EMI)shielding is of great importance.Porous thin films of reduced graphene oxide containing SiC whiskers(SiC@RGO)for EMI shielding were prepared by a two-step reduction of graphene oxide(GO),in which the two steps were chemical reduction by HI and the solid phase microwave irradiation.A significant increase of the film thickness from around 20 to 200μm was achieved due to the formation of a porous structure by gases released during the 3 s of solid phase microwave irradiation.The total shielding effectiveness(SET)and the reflective SE(SE_(R))of the SiC@RGO porous thin films depended on the GO/SiC mass ratio.The highest SET achieved was 35.6 dB while the SE_(R) was only 2.8 dB,when the GO/SiC mass ratio was 4∶1.The addition of SiC whiskers was critical for the multi-reflection,interfacial po-larization and dielectric attenuation of EM waves.A multilayer film with a gradient change of SE values was constructed using SiC@RGO porous films and multi-walled carbon nanotubes buckypapers.The highest SET of the multilayer films reached 75.1 dB with a SE_(R) of 2.7 dB for a film thickness of about 1.5 mm.These porous SiC@RGO thin films should find use in multilayer or sand-wich structures for EMI absorption in packaging or lining.

The effect of initial discharge conditions on the properties of microcrystalline silicon thin films and solar cells

This paper studies the effects of silane back diffusion in the initial plasma ignition stage on the properties of microcrystalline silicon （μc-Si：H） films by Raman spectroscopy and spectroscopic ellipsometry, through delaying the injection of SiH4 gas to the reactor before plasma ignition. Compared with standard discharge condition, delayed SiH4 gas condition could prevent the back diffusion of Sill4 from the reactor to the deposition region effectively, which induced the formation of a thick amorphous incubation layer in the interface between bulk film and glass substrate. Applying this method, it obtains the improvement of spectral response in the middle and long wavelength region by combining this method with solar cell fabrication. Finally, results are explained by modifying zero-order analytical model, and a good agreement is found between the model and experiments concerning the optimum delayed injection time.

Research on the optimum hydrogenated silicon thin films for application in solar cells

Hydrogenated silicon （Si：H） thin films for application in solar ceils were deposited by using very high frequency plasma enhanced chemical vapour deposition （VHF PECVD） at a substrate temperature of about 170 ℃, The electrical, structural, and optical properties of the films were investigated. The deposited films were then applied as i-layers for p-i-n single junction solar cells. The current-voltage （I - V） characteristics of the cells were measured before and after the light soaking. The results suggest that the films deposited near the transition region have an optimum properties for application in solar cells. The cell with an i-layer prepared near the transition region shows the best stable performance.

The study of amorphous incubation layers during the growth of microcrystalline silicon films under different deposition conditions

The structural un-uniformity of microcrystalline silicon, thin film, amorphous incubation layerc-Si：H films prepared using very high frequency plasma-enhanced chemical vapour deposition method has been investigated by Raman spectroscopy, spectroscopic ellipsometer and atomic force mi- croscopy. It was found that the formation of amorphous incubation layer was caused by the back diffusion of SiH4 and the amorphous induction of glass surface during the initial ignition process, and growth of the incubation layer can be suppressed and uniform μc-Si：H phase is generated by the application of delayed initial SiH4 density and silane profiling methods.

Chemical Vapor Deposition Mechanism of Copper Films on Silicon Substrates

A versatile metal-organic chemical vapor deposition （MOCVD） system was designed and constructed. Copper films were deposited on silicon （100） substrates by chemical vapor deposition （CVD） using Cu（hfac）2 as a precursor. The growth of Cu nucleus on silicon substrates by H2 reduction of Cu（hfac）2 was studied by atomic force microscopy and scanning electron microscopy. The growth mode of Cu nucleus is initially Volmer-Weber mode （island）, and then transforms to Stranski-Rastanov mode （layer-by-layer plus island）. The mechanism of Cu nucleation on silicon （100） substrates was further investigated by X-ray photoelectron spectroscopy. From Cu2p, O1s, F1s, Si2p patterns, the observed C=O, OH and CF3/CF2 should belong to Cu（hfac） formed by the thermal dissociation of Cu（hfac）2. H2 reacts with hfac on the surface, producing OH. With its accumulation, OH reacts with hfac, forming HO-hfac, and desorbs, meanwhile, the copper oxide is reduced, and thus the redox reaction between Cu（hafc）2 and H2 occurs.

Laser-Plasma Deposition of Silicon Carbonitride Films by the HMDS Vapor Gas Flow Activation after a Laser Beam Focus

A new laser-plasma deposition method has been developed for the plasma chemical deposition of hard silicon carbonitride coatings on stainless steel substrates from the hexamethyldisilazane (HMDS) Si2NH(CH3)6 vapor in a high-speed Ar and Ar + 10 vol.% He gas stream at the HMDS gas flow activation after the laser beam focus. The method allows depositing silicon carbonitride coatings at the rate of 0.4 - 1.2 μm·min-1, i.e. ~2 times higher than that at introducing HMDS in the laser beam focus zone. The properties of the prepared coatings have been studied by the methods of IR and Raman spectroscopy, atomic force microscopy, nanoindentation and X-ray diffraction (XRD) analysis. Studying the film structure with the use of XRD showed that the prepared silicon carbonitride coatings are X-ray amorphous. It has been found that the coating deposition rate and the structure of coatings depend on the process parameters: HMDS flow rate and plasma-generating gas (argon or (Ar + He). The method allows depositing SiCN films at a high speed and a hardness of 20 - 22 GPa.

Fabrication of seeded substrates for layer transferrable silicon films

The layer transfer process is one of the most promising methods for low-cost and highly-efficient solar cells, in which transferrable mono-crystalline silicon thin wafers or films can be produced directly from gaseous feed-stocks. In this work, we show an approach to preparing seeded substrates for layer-transferrable silicon films. The commercial silicon wafers are used as mother substrates, on which periodically patterned silicon rod arrays are fabricated, and all of the surfaces of the wafers and rods are sheathed by thermal silicon oxide. Thermal evaporated aluminum film is used to fill the gaps between the rods and as the stiff mask, while polymethyl methacrylate （PMMA） and photoresist are used as the soft mask to seal the gap between the filled aluminum and the rods. Under the joint resist of the stiff and soft masks, the oxide on the rod head is selectively removed by wet etching and the seed site is formed on the rod head. The seeded substrate is obtained after the removal of the masks. This joint mask technique will promote the endeavor of the exploration of mechanically stable, unlimitedly reusable substrates for the kerfless technology.

Synthesis of GaN films on porous silicon substrates

A novel and simple method was employed to synthesize GaN films on porous silicon （PS） substrates, GaN films were obtained through the reaction between NH3 and Ga2O3 films deposited on the substrates with magnetron sputtering. Since GaN and PS are all good materials for luminescence, it is expected to obtain some new properties from GaN on PS. The samples were analyzed with X-ray diffraction （XRD） to identify crystalline structure. Fourier transmit infrared （FFIR） spectrum was used to analyze the chemical state of the samples. The films were observed with scanning electron microscopy （SEM） and were found to consist of many big crystal grains. Photoluminescence （PL） spectrum was used to illuminate the optical property of the GaN films.

Thermoelectric effect of silicon films prepared by aluminum-induced crystallization

Aluminum-induced crystallized silicon films were prepared on glass substrates by magnetron sputtering. Aluminum was added in the silicon films intermittently by the regular pulse sputtering of an aluminum target. The amount of aluminum in the silicon films can be controlled by regulating the aluminum sputtering power and the sputtering time of the undoped silicon layer; thus, the Seebeck coefficient and electrical resistivity of the polyerystaUine silicon films can be adjusted. It is found that, when the sputtering power ratio of aluminum to silicon is 16%, both the Seebeck coefficient and the electrical resistivity decrease with the increasing amount of aluminum as expected; the Seebeck coefficient and the electrical resistivity at room temperature are 0.185-0.285 mV/K and 0.30-2.4 Ω.cm, respectively. By reducing the sputtering power ratio to 7%, however, the Seebeck coefficient does not change much, though the electrical resistivity still decreases with the amount of aluminum increasing; the Seebeck coefficient and electrical resistivity at room temperature are 0.219-0.263 mV/K and 0.26-0.80 Ω·cm, respectively.

Surface morphology and impurity distribution of electron beam recrystallized silicon films on low cost substrates for solar cell absorber

A line shaped electron beam recrystallised polycrystalline silicon film on the low cost substrate was investigated for the use of the solar cell absorber. The applied EB energy density strongly influences the surface morphology of the film system. Lower EB energy density results in droplet morphology and the rougher SiO2 capping layer due to the low fluidity. With the energy increasing, the capping layer becomes smooth and continuous and less and small pinholes form in the silicon film. Tungstendisilicide (WSi2) is formed at the interface tungsten/silicon but also at the grain boundaries of the silicon. Because of the fast melting and cooling of the silicon film, the eutectic of silicon and tungstendisilicide mainly forms at the grain boundary of the primary silicon dendrites. The SEM-EDX analysis shows that there are no chlorine and hydrogen in the area surrounding a pinhole after recrystallization because of outgassing during the solidification.

Preparation and characterization of barium strontium titanate/silicon nanoporous pillar array composite thin films by a sol-gel method

Barium strontium titanate （Ba0.5Sr0.5TiO3, BST）/silicon nanoporous pillar array （Si-NPA） thin films were prepared by a spin-coating/annealing technique based on Si-NPA with micro/nano-structure. Both the isomer conversion of acetylacetone and the network structure combined by enol and Ti-alkoxide facilitate the formation of the BST sol and the subsequent crystallization. Before the perovskite BST begins to form, the intermediate phase （Ba, Sr）Ti2OsCO3 is found. The boundary between BST and Si-NPA is of clarity and little interface diffusion, disclosing that Si-NPA is an ideal template substrate in the preparation of multifunctional composite films.

Effect of driving frequency on the structure of silicon grown on Ag(111) films by very-high-frequency magnetron sputtering

The effect of driving frequency on the structure of silicon grown on Ag（111） film is investigated, which was prepared by using the very-high-frequency（VHF）（40.68 MHz and 60 MHz） magnetron sputtering. The energy and flux density of the ions impinging on the substrate are also analyzed. It is found that for the 60-MHz VHF magnetron sputtering, the surface of silicon on Ag（111） film exhibits a small cone structure, similar to that of Ag（111） film substrate, indicating a better microstructure continuity. However, for the 40.68-MHz VHF magnetron sputtering, the surface of silicon on Ag（111） film shows a hybrid structure of hollowed-cones and hollowed-particles, which is completely different from that of Ag（111）film. The change of silicon structure is closely related to the differences in the ion energy and flux density controlled by the driving frequency of sputtering.

High Growth Rate of Microcrystalline Silicon Films Prepared by ICP-CVD with Internal Low Inductance Antennas

The plasma parameters in ICP-CVD system with internal low inductance antennas（LIA） were diagnosed by Langmuir probe.The ions density（Ni） reached 1011-1012 cm-3,and the electron temperature（Te） was below ca.2 eV,which was slightly decreased with applied power.A p-type hydrogenated microcrystalline silicon（μc-Si：H） film was prepared on glass substrate.After optimization of the processing parameters in flow ratio of SiH4：B2H6：H2,a high quality μc-Si：H film with deposition rate above 1.0 nm/s was achieved in this work.

Characterization of doped hydrogenated nanocrystalline silicon films prepared by plasma enhanced chemical vapour deposition

The B- and P-doped hydrogenated nanocrystalline silicon films （nc-Si：H） are prepared by plasma-enhanced chemical vapour deposition （PECVD）. The microstructures of doped nc-Si＇H films are carefully and systematically characterized by using high resolution electron microscopy （HREM）, Raman scattering, x-ray diffraction （XRD）, Auger electron spectroscopy （AES）, and resonant nucleus reaction （RNR）. The results show that as the doping concentration of PH3 increases, the average grain size （d） tends to decrease and the crystalline volume percentage （Xc） increases simultaneously. For the B-doped samples, as the doping concentration of B2H6 increases, no obvious change in the value of d is observed, but the value of Xc is found to decrease. This is especially apparent in the case of heavy B2H6 doped samples, where the films change from nanocrystalline to amorphous.

STRUCTURAL PROPERTIES INVESTIGATION ON MICROCRYSTALLINE SILICON FILMS DEPOSITED WITH VHF-PECVD TECHNIQUE

Raman scattering spectroscopy and scanning electron microscopy (SEM) techniques were used to determine the structural properties of two typical series of microc rystalline silicon (μc-Si:H) films deposited at different VHF plasma power and different working gas pressure by very high frequency plasma enhanced chemical v apor deposition (VHF-PECVD) technique. Raman spectra measurements show that both crystalline volume fraction Xc and average grain size d of μc-Si : H films ar e strongly affected by the two deposition conditions and are more sensitive to w orking gas pressure than VHF plasma power. SEM characterizations have further co nfirmed that VHF plasma power and working gas pressure could clearly enhance the surface roughness of μc-Si : H films ascribing to polymerization reactions, w hich is also more sensitive to working gas pressure than VHF plasma power.