利用脉宽为8 ns的Nd:YAG脉冲激光对AZ31B镁合金表面进行激光喷丸处理,研究激光喷丸诱导微织构对AZ31B镁合金耐腐蚀性能的影响,进行表面微织构的形貌分析,测量试样表面的动电位极化曲线。结果表明,激光喷丸产生的微织构周围未出现烧蚀现...利用脉宽为8 ns的Nd:YAG脉冲激光对AZ31B镁合金表面进行激光喷丸处理,研究激光喷丸诱导微织构对AZ31B镁合金耐腐蚀性能的影响,进行表面微织构的形貌分析,测量试样表面的动电位极化曲线。结果表明,激光喷丸产生的微织构周围未出现烧蚀现象,其微凹坑的直径和深度随激光能量的增加而增大,随喷丸次数的增加呈现先增大后趋于饱和趋势。与未处理试样相比,在相同微织构间距下,激光能量为1.0 J、1.5 J、2.0 J时试样的自腐蚀电位分别向正移95 m V、123 m V、151 m V,自腐蚀电流密度分别减少36.48%、50.26%、60.42%;在相同激光能量下,微织构间距为1.0 mm、1.5 mm、2.0 mm试样的自腐蚀电位分别向正移145 m V、134 m V、123 m V,自腐蚀电流密度分别减少50.26%、46.19%、44.34%。研究表明激光喷丸诱导的微织构提高了AZ31B镁合金表面的耐腐蚀性,且激光能量越高,喷丸间距越小,抗腐蚀性能越好。展开更多
An innovative method for high-speed micro-dicing of SiC has been proposed using two types of diamond dicing blades,a resin-bonded dicing blade and a metal-bonded dicing blade.The experimental research investigated the...An innovative method for high-speed micro-dicing of SiC has been proposed using two types of diamond dicing blades,a resin-bonded dicing blade and a metal-bonded dicing blade.The experimental research investigated the radial wear of the dicing blade,the maximum spindle current,the surface morphology of the SiC die,the number of chips longer than 10μm,and the chipped area,which depend on the dicing process parameters such as spindle speed,feed speed,and cutting depth.The chipping fractures in the SiC had obvious brittle fracture characteristics.The performance of the metal-bonded dicing blade was inferior to that of the resin-bonded dicing blade.The cutting depth has the greatest influence on the radial wear of the dicing blade,the maximum spindle current,and the damage to the SiC wafer.The next most important parameter is the feed speed.The parameter with the least influence is the spindle speed.The main factor affecting the dicing quality is blade vibration caused by spindle vibration.The optimal SiC dicing was for a resin-bonded dicing blade with a spindle speed of 20000 rpm,a feed speed of 4 mm/s,and a cutting depth of 0.1 mm.To improve dicing quality and tool performance,spindle vibrations should be reduced.This approach may enable high-speed dicing of SiC wafers with less dicing damage.展开更多
The abrasive waterjet (AWJ) is now widely used in the advanced cutting processes of polymers,metals,glass,ceramics and composite materials like thin multiple-layered material (TMM).Various research and development eff...The abrasive waterjet (AWJ) is now widely used in the advanced cutting processes of polymers,metals,glass,ceramics and composite materials like thin multiple-layered material (TMM).Various research and development efforts have recently been made to understand the science of AWJ.However,the interaction mechanism between a workpiece and high-velocity abrasive particles still remains a complicated problem.In this work,the material removal mechanisms of AWJ such as micro penetration and micro dent were experimentally investigated.In addition,a new computer simulation model considering high strain rate effect was proposed to understand the micro impact behavior of high-velocity micro-sized abrasives in AWJ cutting.展开更多
文摘利用脉宽为8 ns的Nd:YAG脉冲激光对AZ31B镁合金表面进行激光喷丸处理,研究激光喷丸诱导微织构对AZ31B镁合金耐腐蚀性能的影响,进行表面微织构的形貌分析,测量试样表面的动电位极化曲线。结果表明,激光喷丸产生的微织构周围未出现烧蚀现象,其微凹坑的直径和深度随激光能量的增加而增大,随喷丸次数的增加呈现先增大后趋于饱和趋势。与未处理试样相比,在相同微织构间距下,激光能量为1.0 J、1.5 J、2.0 J时试样的自腐蚀电位分别向正移95 m V、123 m V、151 m V,自腐蚀电流密度分别减少36.48%、50.26%、60.42%;在相同激光能量下,微织构间距为1.0 mm、1.5 mm、2.0 mm试样的自腐蚀电位分别向正移145 m V、134 m V、123 m V,自腐蚀电流密度分别减少50.26%、46.19%、44.34%。研究表明激光喷丸诱导的微织构提高了AZ31B镁合金表面的耐腐蚀性,且激光能量越高,喷丸间距越小,抗腐蚀性能越好。
基金This work was supported by the National Natural Science Foundation of China(Grant No.51305278)LiaoNing Revitalization Talents Program,China(Grant No.XLYC2007133)the Natural Science Foundation of Liaoning Province,China(Grant No.2020-MS-213).
文摘An innovative method for high-speed micro-dicing of SiC has been proposed using two types of diamond dicing blades,a resin-bonded dicing blade and a metal-bonded dicing blade.The experimental research investigated the radial wear of the dicing blade,the maximum spindle current,the surface morphology of the SiC die,the number of chips longer than 10μm,and the chipped area,which depend on the dicing process parameters such as spindle speed,feed speed,and cutting depth.The chipping fractures in the SiC had obvious brittle fracture characteristics.The performance of the metal-bonded dicing blade was inferior to that of the resin-bonded dicing blade.The cutting depth has the greatest influence on the radial wear of the dicing blade,the maximum spindle current,and the damage to the SiC wafer.The next most important parameter is the feed speed.The parameter with the least influence is the spindle speed.The main factor affecting the dicing quality is blade vibration caused by spindle vibration.The optimal SiC dicing was for a resin-bonded dicing blade with a spindle speed of 20000 rpm,a feed speed of 4 mm/s,and a cutting depth of 0.1 mm.To improve dicing quality and tool performance,spindle vibrations should be reduced.This approach may enable high-speed dicing of SiC wafers with less dicing damage.
文摘The abrasive waterjet (AWJ) is now widely used in the advanced cutting processes of polymers,metals,glass,ceramics and composite materials like thin multiple-layered material (TMM).Various research and development efforts have recently been made to understand the science of AWJ.However,the interaction mechanism between a workpiece and high-velocity abrasive particles still remains a complicated problem.In this work,the material removal mechanisms of AWJ such as micro penetration and micro dent were experimentally investigated.In addition,a new computer simulation model considering high strain rate effect was proposed to understand the micro impact behavior of high-velocity micro-sized abrasives in AWJ cutting.
