At present, microelectro mechanical systems (MEMS) sensors have gradually replaced traditional mechanical sensors and are applied to several fields. Many developed countries pay high attention to technological innovat...At present, microelectro mechanical systems (MEMS) sensors have gradually replaced traditional mechanical sensors and are applied to several fields. Many developed countries pay high attention to technological innovation of MEMS sensors, and have applied a large number of patents since 2000. In this study, the patents of MEMS sensor from 2000 to 2015 are researched, the patents data is collected from Derwent Innovation Index (DII), and the method of co-classification analysis is used to investigate the technology cluster evolution of MEMS sensors. Results show that the technology diffusion occurrs in each technical field and the technology relevance between different technical fields is changed over time. On the whole, the evolution process of MEMS sensor is the manufacture and material of sensor chip, the electronic components and measuring function, the computing and control technology, and applications to biochemical field and communication.展开更多
随着工业技术的进步,高温高动态压力传感器的应用需求显著增加。提出一种集成专用补偿电路的高动态硅压阻式微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)压力传感器,进行压力敏感芯片的结构设计和加工工艺设计,并对压力传感...随着工业技术的进步,高温高动态压力传感器的应用需求显著增加。提出一种集成专用补偿电路的高动态硅压阻式微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)压力传感器,进行压力敏感芯片的结构设计和加工工艺设计,并对压力传感器进行封装和温度补偿电路设计。多层绝缘体上硅(Silicon On Insulator,SOI)材料能够使传感器在高温环境下正常工作。无引线的封装方式可有效提升传感器的频响性能。传感器后端集成了桥阻式专用集成电路(Application Specific Integrated Circuits,ASIC),能够显著减小传感器的体积,同时提升传感器整体性能。该MEMS传感器通过自动压力测试系统进行性能试验,结果表明MEMS压力传感器经过补偿后能够实现较高的线性度、稳定的零点输出特性以及理想的动态输出特性。展开更多
基金Supported by the Scientific Monitoring and Key Areas in-depth Investigation Analysis and Research(No.ZD2017-1)Science and Technology Major Specific Project Core Electronic Elements,High-General Chips and Basic Software(No.2015XM54)
文摘At present, microelectro mechanical systems (MEMS) sensors have gradually replaced traditional mechanical sensors and are applied to several fields. Many developed countries pay high attention to technological innovation of MEMS sensors, and have applied a large number of patents since 2000. In this study, the patents of MEMS sensor from 2000 to 2015 are researched, the patents data is collected from Derwent Innovation Index (DII), and the method of co-classification analysis is used to investigate the technology cluster evolution of MEMS sensors. Results show that the technology diffusion occurrs in each technical field and the technology relevance between different technical fields is changed over time. On the whole, the evolution process of MEMS sensor is the manufacture and material of sensor chip, the electronic components and measuring function, the computing and control technology, and applications to biochemical field and communication.
文摘随着工业技术的进步,高温高动态压力传感器的应用需求显著增加。提出一种集成专用补偿电路的高动态硅压阻式微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)压力传感器,进行压力敏感芯片的结构设计和加工工艺设计,并对压力传感器进行封装和温度补偿电路设计。多层绝缘体上硅(Silicon On Insulator,SOI)材料能够使传感器在高温环境下正常工作。无引线的封装方式可有效提升传感器的频响性能。传感器后端集成了桥阻式专用集成电路(Application Specific Integrated Circuits,ASIC),能够显著减小传感器的体积,同时提升传感器整体性能。该MEMS传感器通过自动压力测试系统进行性能试验,结果表明MEMS压力传感器经过补偿后能够实现较高的线性度、稳定的零点输出特性以及理想的动态输出特性。
