The packaging poses a critical challenge for commercialization of MEMS products. Major problems with the packaging process include degraded reliability caused by the excess stress due to thermal mismatch and altered p...The packaging poses a critical challenge for commercialization of MEMS products. Major problems with the packaging process include degraded reliability caused by the excess stress due to thermal mismatch and altered performance of the MEMS device after packaging caused by thermal exposure. The localized laser bonding technique for ceramic MEMS packaging to address above-mentioned challenges was investigated. A continuous wave CO2 laser was used to locally heat sealing material for ceramic MEMS package lid to substrate bonding. To determine the laser power density and scanning speed, finite element analysis thermal models were constructed to simulate the localized laser bonding process. Further, the effect of external pressure at sealing ring on the bonding formation was studied. Pull testing results show that the scanning speed and external pressure have significant influence on the pull strength at the bonding interface. Cross-sectional microscopy of the bonding interface indicates that the packages bonded with relatively low scanning speed and external pressure conditions have higher bonding quality. This research demonstrates the potential of localized laser bonding process for ceramic MEMS packaging.展开更多
圆片级真空封装是提高微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)电场传感器品质因数及批量化制造效率的重要途径.本文提出了一种基于绝缘体上硅(Silicon On Insulator,SOI)-玻璃体上硅(Silicon On Glass,SOG)键合的圆片...圆片级真空封装是提高微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)电场传感器品质因数及批量化制造效率的重要途径.本文提出了一种基于绝缘体上硅(Silicon On Insulator,SOI)-玻璃体上硅(Silicon On Glass,SOG)键合的圆片级真空封装MEMS电场传感器,设计并实现了从传感器敏感结构制备到真空封装的整套圆片级加工工艺.本文建立了传感器的结构电容模型,进行了有限元仿真,分析了传感器的特性,突破了传感器微结构制备与释放、SOI与SOG键合等工艺技术难点.该传感器具有工作电压低、品质因数高的突出优点.实验结果表明,工作电压仅为5 V直流与0.05 V交流电压.在60天测试过程中,传感器品质因数始终保持在5000以上.在0~50 kV/m范围内,传感器灵敏度为0.15 mV/(kV/m),线性度为2.21%,不确定度为4.74%.展开更多
随着工业技术的进步,高温高动态压力传感器的应用需求显著增加。提出一种集成专用补偿电路的高动态硅压阻式微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)压力传感器,进行压力敏感芯片的结构设计和加工工艺设计,并对压力传感...随着工业技术的进步,高温高动态压力传感器的应用需求显著增加。提出一种集成专用补偿电路的高动态硅压阻式微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)压力传感器,进行压力敏感芯片的结构设计和加工工艺设计,并对压力传感器进行封装和温度补偿电路设计。多层绝缘体上硅(Silicon On Insulator,SOI)材料能够使传感器在高温环境下正常工作。无引线的封装方式可有效提升传感器的频响性能。传感器后端集成了桥阻式专用集成电路(Application Specific Integrated Circuits,ASIC),能够显著减小传感器的体积,同时提升传感器整体性能。该MEMS传感器通过自动压力测试系统进行性能试验,结果表明MEMS压力传感器经过补偿后能够实现较高的线性度、稳定的零点输出特性以及理想的动态输出特性。展开更多
Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Arr...Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Array ( LGA ) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled.展开更多
文摘The packaging poses a critical challenge for commercialization of MEMS products. Major problems with the packaging process include degraded reliability caused by the excess stress due to thermal mismatch and altered performance of the MEMS device after packaging caused by thermal exposure. The localized laser bonding technique for ceramic MEMS packaging to address above-mentioned challenges was investigated. A continuous wave CO2 laser was used to locally heat sealing material for ceramic MEMS package lid to substrate bonding. To determine the laser power density and scanning speed, finite element analysis thermal models were constructed to simulate the localized laser bonding process. Further, the effect of external pressure at sealing ring on the bonding formation was studied. Pull testing results show that the scanning speed and external pressure have significant influence on the pull strength at the bonding interface. Cross-sectional microscopy of the bonding interface indicates that the packages bonded with relatively low scanning speed and external pressure conditions have higher bonding quality. This research demonstrates the potential of localized laser bonding process for ceramic MEMS packaging.
文摘圆片级真空封装是提高微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)电场传感器品质因数及批量化制造效率的重要途径.本文提出了一种基于绝缘体上硅(Silicon On Insulator,SOI)-玻璃体上硅(Silicon On Glass,SOG)键合的圆片级真空封装MEMS电场传感器,设计并实现了从传感器敏感结构制备到真空封装的整套圆片级加工工艺.本文建立了传感器的结构电容模型,进行了有限元仿真,分析了传感器的特性,突破了传感器微结构制备与释放、SOI与SOG键合等工艺技术难点.该传感器具有工作电压低、品质因数高的突出优点.实验结果表明,工作电压仅为5 V直流与0.05 V交流电压.在60天测试过程中,传感器品质因数始终保持在5000以上.在0~50 kV/m范围内,传感器灵敏度为0.15 mV/(kV/m),线性度为2.21%,不确定度为4.74%.
文摘随着工业技术的进步,高温高动态压力传感器的应用需求显著增加。提出一种集成专用补偿电路的高动态硅压阻式微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)压力传感器,进行压力敏感芯片的结构设计和加工工艺设计,并对压力传感器进行封装和温度补偿电路设计。多层绝缘体上硅(Silicon On Insulator,SOI)材料能够使传感器在高温环境下正常工作。无引线的封装方式可有效提升传感器的频响性能。传感器后端集成了桥阻式专用集成电路(Application Specific Integrated Circuits,ASIC),能够显著减小传感器的体积,同时提升传感器整体性能。该MEMS传感器通过自动压力测试系统进行性能试验,结果表明MEMS压力传感器经过补偿后能够实现较高的线性度、稳定的零点输出特性以及理想的动态输出特性。
文摘Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Array ( LGA ) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled.
