Modeling of Micropores Drilling Force for Printed Circuit Board Micro-holes Based on Energy Method

The quality of printed circuit board(PCB)micro-hole processing directly determines the stability of the inner and outer circuit connections.Micro-hole drilling technology is a typical method for PCB micro-hole processing.The problem of optimal control of its drilling force is one of the main factors affecting the quality of micro-hole machining.To address this problem,the thrust forces and torques in PCB drilling were first modeled and analyzed,and the corresponding prediction models were established.The drilling force analysis was carried out through the micro-hole drilling experiment,the specific cutting energy under different feed rates was calculated,the influence of the size effect was clarified,and the accuracy of the prediction model was verified.The result shows that during the drilling of glass fiber cloth,changes in the material removal mechanism are induced as the feed per revolution is varied.When the feed per revolution is less than the tool edge radius,the glass fiber is not cut by the main cutting edge,but is crushed and broken.When the feed per revolution is greater than the radius of the tool edge,the glass fiber is cut by the main cutting edge.At the same time,the established analytical model can accurately reflect the influence of the size effect on the drilling torque in PCB micro-hole drilling,and the error is within 10%.This method has certain practical application value in controlling PCB micro hole processing quality.

Fabrication of Through Micro-hole Arrays in Silicon Using Femtosecond Laser Irradiation and Selective Chemical Etching

We demonstrate a method of fabricating through micro-holes and micro-hole arrays in silicon using femtosecond laser irradiation and selective chemical etching. The micro-hole formation mechanism is identified as the chemical reaction of the femtosecond laser-induced structure change zone and hydrofluoric acid solution. The morphologies of the through micro-holes and micro-hole arrays are characterized by using scanning electronic microscopy, The effects of the pulse number on the depth and diameter of the holes are investigated. Honeycomb arrays of through micro-holes fabricated at different laser powers and pulse numbers are demonstrated.

A Novel Micro-hole Electrode Used to Investigate Electron Transfer Reactions at ITIES

A novel micro-hole electrode was fabricated to investigate the electron transfer reaction at the interface between two immiscible electrolyte solutions (ITIES). The electron transfer reaction between ferro/ferricyanide in aqueous phase (W) and ferrocene in 1, 2-dichloroethane (O) phase was studied as a test experiment. The results showed that the diffusion coefficient obtained from the micro-hole electrode was consistent with that obtained at macro-interface. Due to its simplicity and the very small IR drop it will be a useful tool for the study of ITIES systems.

Comparative study on discharge conditions in micro-hole electrical discharge machining of tungsten carbide (WC-Co) material

WC-Co is used widely in die and mold industries due to its unique combination of hardness, strength and wear-resistance. For machining difficult-to-cut materials, such as tungsten carbide, micro-electrical discharge machining(EDM) is one of the most effective methods for making holes because the hardness is not a dominant parameter in EDM. This paper describes the characteristics of the discharge conditions for micro-hole EDM of tungsten carbide with a WC grain size of 0.5 μm and Co content of 12%. The EDM process was conducted by varying the condenser and resistance values. A R-C discharge EDM device using arc erosion for micro-hole machining was suggested. Furthermore, the characteristics of the developed micro-EDM were analyzed in terms of the electro-optical observation using an oscilloscope and field emission scanning electron microscope.

Improving surface integrity of micro-holes in ECDM using ultrahigh-speed rotary of tool cathode and non-water-based electrolyte

The surface integrity of metal micro-hole structures produced by electrochemical discharge machining is unsatisfactory owing to the insufficient reaction area and strength of electrolysis action.A novel ultrahigh-speed Rotary Electrochemical Discharge Machining(R-ECDM)using non-water-based electrolyte is proposed to improve surface integrity by changing the breakdown medium of spark discharge and increasing the reaction area and strength of electrolysis.A mathematical model was developed to establish the relationship between rotational speed and forces acting on the bubble.Based on the magnitude of forces,controlling rotational speed changed the behavior and departure radius of bubbles on the cathode surface.High-speed photographs validate that,in the mathematical model,the number and departure radius of bubbles on the cathode surface gradually decrease with the increase of rotational speed.The experimental results show that the roughness(Ra)of the micro-hole sidewall decreases from 2.54μm to 0.20μm when the rotational speed increases from 500 r/min to 40000 r/min.The length loss and wear ratio of the cathode are only 9.75μm and 6.5%,respectively.Finally,the micro-holes array with recast-free and surface roughness of 0.20μm is fabricated,demonstrating that the proposed approach contributes to improving surface integrity of metal micro-holes.

Influence of longitudinal-torsional ultrasonic-assisted vibration on micro-hole drilling Ti-6Al-4V

As Ti-6 Al-4 V is a typical hard to machine material,especially in micro drilling aviation parts,chip breaking difficulty is of increasing interest to explore its further development.In this study,Longitudinal-Torsional Ultrasonic Assisted Drilling(LTUAD)was employed to machine Ti-6 Al-4 V,and its feasibility was evaluated by comparing with Conventional Drilling(CD).By combining periodical characteristics and vibration models(the separated or the unseparated ultrasonic elliptical vibration),the influence of ultrasonic frequency on the intersection characteristics of trajectories were analyzed.And the intersection characteristics were divided into four categories:even periodicity,odd periodicity,non-odd and even periodicity and composite periodicity,indicating different capability for chip breaking.By applying the longitudinal-torsional compound vibration horn,the micro-hole drilling experiment was carried out on machining center.The chip morphology,the thrust force,and the burr height were discussed.Experimental results showed that the morphology of chips presented as smaller and more fragmentary ones in LTUAD compared with continuous helical conical ones and fold-shaped ones in CD.Compared with CD,the average values of the thrust force in LTUAD reduced by 1.98%to 24.9%.According to the burr around the hole exit in both LTUAD and CD,the height of the latter was greatly affected by the drilling parameters.And the burr around the exit of the hole were distributed rather evenly with smaller extension in LTUAD.Consequently,the LTUAD employed in micro-hole drilling was effective.

基于不同加工工艺的微孔节流空气静压轴承的特性研究

随着超精密加工技术和地面微低重力仿真的发展,相关产业对空气静压轴承的性能要求越来越高。由于传统的孔式节流器其结构特点不能完全满足实际使用的需要,节流孔直径与气膜间隙同一数量级的微孔节流空气静压轴承因其良好的刚度和承载特性,越来越受到关注。但在微孔节流器的发展过程中,微孔的加工工艺却限制了其推广应用。针对目前常用的三类微孔加工工艺,进行了理论仿真研究,通过建立不同加工工艺轴承仿真模型,运用双向流固耦合仿真方法,对比分析了基于不同加工工艺的微孔节流空气静压轴承的动静态特性。研究结果表明:锥孔类轴承承载性能优于其他两类,但耗气量大且在小间隙时刚度较差;薄壁直孔类轴承承载性能稍逊,但在大间隙下轴承刚度较佳;嵌套类轴承承载性能较差,但在小间隙下轴承刚度较大且耗气量较低。

微弧氧化处理对6061铝合金电偶腐蚀防护

目的提高船舶上铝合金的耐蚀性能。方法使用双极性脉冲电源对6061铝合金进行微弧氧化处理,并使用环氧树脂进行封孔,通过电化学测试、扫描电子显微镜(SEM)、能谱仪(EDS)、浸泡腐蚀试验和电偶腐蚀试验等方法,对膜层的表面形貌、截面形貌、物相组成和耐蚀性能进行测试。结果制备的6061铝合金微弧氧化膜层厚度约为40μm,致密均匀。在240h浸泡试验后,仍具有较强的耐蚀性,与316L不锈钢耦合的电流密度从约47μA/cm^(2)下降到20μA/cm^(2)左右,对6061铝合金的耐蚀性有显著提升。封孔处理后,浸泡腐蚀240h,未发现明显腐蚀,电偶电流进一步下降到11μA/cm^(2)。结论对6061铝合金进行微弧氧化处理,可以有效提高其耐蚀性能,对电偶腐蚀有较好的抑制作用,封孔处理则可以进一步提高铝合金的耐蚀性能。

聚合物真空绝缘子表面二级微结构

为研究绝缘子表面二级微结构的耐压提升机制,将表面二级微结构拆分为两种子结构,也即是表面微孔结构与表面微槽结构,并通过复合材料制备、激光处理、酸液选择性腐蚀等方式制备出表面二级微结构与相应的两种子结构。对三种结构分别进行沿面耐压性能测试,结果表明表面微孔与表面微槽均能有效地提升绝缘子的真空沿面耐压性能,而二者组合形成的表面二级微结构能够进一步提升绝缘子的真空沿面耐压性能。该结果表明通过将表面结构进行合理的组合能够实现对绝缘子表面闪络发展的多重、协同抑制,进一步提升绝缘子的真空沿面耐压水平。

深小孔电解加工阴极侧壁绝缘层制备及试验

航空发动机零部件中存在大量深小孔,不仅孔径小、深径比大,而且要求孔表面没有再铸层,这些特点给孔的加工带来了很多困难。电解加工是一种有效的加工方法,针对大深径比小孔电解加工所用的阴极侧壁绝缘层制备困难,且使用过程中容易损坏的问题,尝试了多种材料、多种方式的绝缘层制备方法,并对其在加工过程中的性能稳定性进行了试验研究,最终提出了一种基于弹性石英毛细管的新型多层复合绝缘层制备方法,并借助该方法制作管阴极,在不锈钢材料上成功加工出直径1.1 mm、深径比达181的深小孔。

基于预制孔的SiCf/SiC复合材料微小孔超声振动辅助钻削加工研究

SiCf/SiC复合材料是典型的硬脆性难加工材料。为解决SiCf/SiC复合材料微小孔(<1 mm)加工难题,提高加工精度和改善加工质量,先采用脉冲激光预制SiCf/SiC微小孔,再在不同预制孔尺寸和加工参数下开展直径0.5 mm的SiCf/SiC微小孔超声振动辅助钻削加工试验,最终确定了合适的激光预制孔尺寸及超声振动辅助钻削加工参数域。结果表明:脉冲激光预制孔时存在的较大热影响区和微裂纹等缺陷,会明显影响后续超声辅助钻削微小孔的入、出口质量,推荐的预制孔直径为0.3 mm;超声振动辅助钻削加工时,选择主轴转速为11000~15000 r/min、进给速度为2~10mm/min,可获得加工质量较好的SiCf/SiC微小孔。

超疏水微结构表面的制备工艺研究

针对装备表面大面积采用超疏水结构以实现减阻、防污的需求,考虑加工低成本、可重复及高效的目标,采用PDMS模塑工艺来实现超疏水微结构的制备,基于高速微小孔钻削工艺在铝合金表面加工阵列微孔结构作为PDMS浇铸的模具,成功在PDMS膜表面复印出阵列微柱结构,对制备的超疏水微结构PDMS膜进行了加工误差分析,误差为6%。

基于集成正交实验与CNN方法的微细电火花微孔加工精度

针对改善微细电火花微孔加工精度问题,提出一种集成正交试验与卷积神经网络的方法。首先,利用正交试验研究进给速度、主轴转速、脉冲占空比和脉冲频率4个因素对微细电火花加工H62黄铜微孔入口过切(En-OV)、出口过切(ExOV)和锥度(TA)的影响规律及其最优加工工艺参数。然后,采用基于PyTorch框架的卷积神经网络对试验结果进行预测。结果表明:对于微孔加工入口过切,各因素按影响程度由高到低依次为脉冲占空比、脉冲频率、进给速度和主轴转速;对于微孔加工出口过切,各因素按影响程度由高到低依次为进给速度、主轴转速、脉冲占空比和脉冲频率;对于微孔加工锥度,各因素按影响程度由高到低依次为进给速度、脉冲占空比、主轴转速和脉冲频率。综合考虑并分析各因素之间关系,通过验证实验得到微孔加工精度最优组合参数:进给速度为0.02mm/s、主轴转速为1000r/min、脉冲占空比为60%、脉冲频率为3000Hz。微孔加工入口过切、出口过切和锥度的预测值与试验真实值吻合程度较高,两者相对误差均小于12%。基于PyTorch框架的卷积神经网络(CNN)具有较高的预测准确性,满足实际生产加工需求,为微细电火花微孔加工精度预测研究提供了新方法,也为实际生产加工指导提供了依据。

高温化学辅助激光加工微孔孔貌的优化

研究采用高温化学辅助纳秒激光加工方法,在Inconel 718材料上制造微孔。研究了在空气和高温化学两种环境下,不同脉冲数对微孔直径、深度和孔壁特征的影响,并比较了空气和高温化学下微孔的形貌差异,对高温化学辅助纳秒激光加工微孔的材料去除过程进行了深入研究。通过实验发现较低的脉冲频率对改善高温化学下的微孔形态有益。最后,研究了脉冲延迟对高温化学蚀刻辅助激光加工微孔的影响,并探讨了微孔形成的脉冲延迟规律。结果表明,当延迟时间为1 s时,总加工时间为15 s,孔的圆度改善到0.981,孔壁更加光滑,热影响区也随之减小。增大一定的脉冲延迟可以获得无重铸层、热影响区较小且圆度较好的高质量微孔。

高品质大深径比微孔电火花加工研究现状

针对大深径比深微孔加工面临单一维度下大深径比高导致的排屑难等问题,综述了利用电火花技术加工深微孔的方法及演变。从工具电极的结构设计、运动规划和能场辅助方式等常用方法论述了目前电火花加工深微孔现状,同时介绍了提升深微孔加工表面质量的主要方法,最后探讨了当前电火花加工深微孔面临的瓶颈及未来发展趋势。

高海拔地区光伏支架微孔灌注桩基础快速施工工艺研究

针对高海拔地区光伏支架微孔灌注桩施工存在的诸多问题,文中以刚察县120万千瓦“源网荷储”一体化项目为例,提出一种光伏支架微孔灌注桩基础快速施工工艺,其更好地满足了高海拔地区的施工环境和设计质量的要求,提高了施工效率,降低了施工成本。

微纳级GaN基VCSEL中周期反射结构与电子阻挡层的设置作用分析

氮化镓(GaN)基微纳米结构生长技术的成熟为微纳级GaN基垂直腔面发射激光器(VCSEL)的制备提供了新的途径。本文设计了基于GaN基轴向异质结微纳米柱的微纳级VCSEL结构,采用Al_(0.8)Ga_(0.2)N/In_(0.2)Ga_(0.8)N应变补偿结构作为上下分布式布拉格反射镜(DBR),其中Al_(0.8)Ga_(0.2)N层的Al组分远高于传统结构中的电子阻挡层(EBL),能够更好地起到电子阻挡的作用。本文使用商用软件PICS3D构建了电子阻挡层处于不同位置的VCSEL数理模型,并进行数值模拟计算,探索和分析物理机理,解释了不同位置EBL对空穴注入效率的影响。结果表明,采用Al_(0.8)Ga_(0.2)N与In_(0.2)Ga_(0.8)N组成的应变补偿DBR可以更好地提高空穴注入效率,优化器件光电性能。

基于Micro CT的铜导线短路熔痕孔洞特征分析

导线短路是造成电气火灾的重要原因之一。现行国家标准中将导线短路熔痕分为起火前发生的一次短路熔痕和起火后造成的二次短路熔痕,然而现行国家标准中的鉴定仅停留在定性判断的阶段。火灾现场铜导线短路熔痕特征的量化分析研究是国内外研究人员主要关注的重点。本文应用Micro CT技术对铜导线短路熔痕进行断层扫描检测并重构铜导线短路熔痕的3D图像数据,在此基础上统计、归纳、总结铜导线短路熔痕内部孔洞形态及分布等孔洞特征。研究表明,Micro CT能够全面采集铜导线短路熔痕的整体形态和内部孔洞特征,一次短路熔痕与二次短路熔痕内部孔洞半径、表面积、紧密度的特征数据存在差别,可为短路熔痕定性和定量分析判据研究提供新的理论依据。

湿型砂铸造中的旧砂微粉回用工艺

针对湿型砂铸造中旧砂循环混配再利用时型砂综合性能欠佳,铸件砂眼、夹砂结疤的缺陷率高,铸件质量不稳定等问题,对型砂进行了检测和数据分析,通过对双盘冷却机旋风分离后的微粉进行充分回用,调节了型砂粒度分布,改善了型砂中微粉含量比例,保证了型砂性能相对稳定受控,降低了混砂辅料用量比例,节约了生产成本,降低了型砂对水分的敏感性,促进了改善型砂流动性,提升了型砂综合性能和铸型质量,有效降低了铸件产生砂眼、夹砂结疤缺陷的风险。

基于正交法的超声电火花钻削微小孔最佳加工参数研究

采用正交法研究了用于制造微小孔的高速电火花钻孔机的最优工艺参数。使用的工件材质为钛合金,铜电极直径为2.0 mm。选择要优化的参数是:截至脉冲、最大电流和标准电压。采用正交阵列L9分析了以上参数对材料去除率(MRR)和孔径的影响。获得了孔加工工艺的最佳放电加工参数,并通过实验进行了验证。