An investigation on topologies of hybrid manifold,impinging-jet nozzle and micro-pin-fin heat sinks

The hybrid manifold micro-pin-fin(MMPF)heat sink combined nozzle jets is an option for large-scale integrated circuits(LSI).The demond for uniform and ultra-high heat flux removal by MMPF heat sink has not been adequately investigated.This work aims to solve the problem of fluid organization.The proposed basic tiling topologies,including square,regular hexagon,30°rhombus,and 60°rhombus topologies,provide different organized fluid flows and heat transfer patterns.The present study focuses on comparing these topologies according to independent porous medium parameters,such as nozzle pore size D_(Z),flow pore size D_(X,Y),and porosityε.The results show that the square topology achieves the smallest total thermal resistance R_(tot)value of0.0975×10^(-4)K m^2/W,while the hexagon topology achieved the highest value of COP/?T,which was 2033.9 K^(-1).According to the sensitivity analysis results,the optimal total thermal resistance can be obtained by balancing the influences of nozzle pore size,flow pore size,and porosity.The optimal pressure drop can be obtained by maximizing the porosity.

An investigation on application potentiality of microstructure heat sinks with different flow topological morphology

Microstructure heat sinks have great potential for high heat flux cooling.In this paper,we compared microchannel(MC),micro-pin-fin(MPF),manifold microchannel(MMC),and manifold micro-pin-fin(MMPF)heat sinks to figure out the pros and cons.Fluid flow and manifold unit models are used to study thermal and hydrodynamic performance.The heat sinks with different channel/fin sizes,manifold numbers,and porosities are discussed according to the pressure drop,temperature,thermal resistance,and coefficient of performance.Results show that MMC and MMPF heat sinks are superior to MC and MPF heat sinks,and there are also differences between MMC and MMPF heat sinks.Typically,the MMPF heat sink has lower maximum temperature,temperature non-uniformity,and total thermal resistance R_(tot).In contrast,the MMC heat sink has a lower pressure drop and higher COP.For the MMPF heat sink,at the nozzle width of 6.75μm and the MPF width of 70.71μm(porosity=0.167),it achieves the lowest total thermal resistance of R_(tot)=2.97×10^(-6)K m^(2)/W.Under 10^(3)W/cm^(2)heat flux,the maximum surface temperature rise is 29.74 K,and the maximum temperature difference of the heating surface is 3.15 K.This research initially provides a clear reference on the selection of single-phase cooling microstructures for ultra-high heat flux dissipation.