An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a...An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a compliant layer between them. The behaviors of the integrated structure were evaluated in an electron beam facility under different heat loads and cooling conditions. The surface temperature and bulk temperature distribution were carefully measured by optical pyrometers and thermocouples under a steady state heat flux of 1 to 5 MW/m^2 and a water flow rate of 3 m^3/h, 4.5 m^3/h and 6 m^3/h, respectively. It was found that the surface temperature increased rapidly with the heat flux rising, but decreased only slightly with the water flow rate rising. The surface temperature reached approximately 1200℃ at 5 MW/m^2 of heat flux and 6 m^3/h of water flow. The primary experimental results indicate that the integrated design meets the requirements for the heat expelling capacity of the HT-7 device. A set of numerical simulations was also completed, whose outcome was in good accord with the experimental results.展开更多
A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling. An Indirect cooling module has been experimentally studied and analyzed under steady state cond...A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling. An Indirect cooling module has been experimentally studied and analyzed under steady state condition for both natural and forced convection. The thermal model is employed to determine the actual heat transfer and the effectiveness of the present model and compared it with the conventional cooling method and found that there is an appreciable improvement in the present model.展开更多
Heat transfer experiments were conducted to investigate the thermal performance of air cooling through mini-channel heat sink with various configurations. Two types of channels have been used, one has a rectangular cr...Heat transfer experiments were conducted to investigate the thermal performance of air cooling through mini-channel heat sink with various configurations. Two types of channels have been used, one has a rectangular cross section area of 5 × 18 mm2 and the other is triangular with dimension of 5 × 9 mm2. Four channels of each configuration have been etched on copper block of 40 mm width,30 mm height, and 200 mm length. The measurements were performed in steady state with air flow rates of 0.002 - 0.005 m3/s, heating powers of 80 - 200 W and channel base temperatures of 48°C, 51°C, 55°C and 60°C. The results showed that the heat transfer to air stream is increased with increasing both of air mass flow rate and channel base temperature. The rectangular channels have better thermal performance than trian- gular ones at the same conditions. Analytical fin approach of 1-D and 2-D model were used to predict the heat transfer rate and outlet air temperature from channels heat sink. Theoretical results have been compared with experimental data. The predicted values for outlet air temperatures using the two models agree well with a deviation less than ±10%. But for the heat transfer data, the deviation is about +30% to –60% for 1-D model, and –5% to –80% for 2-D model. The global Nusselt number of the present experimental data is empirically correlated as with accuracy of ±20% for and compared with other literature correlations.展开更多
Pressure drops and heat transfer over staggered pin fin heat sinks with top bypass flow were experimentally evaluated. The authors considered liquid-cooling applications because there were few data available comparing...Pressure drops and heat transfer over staggered pin fin heat sinks with top bypass flow were experimentally evaluated. The authors considered liquid-cooling applications because there were few data available comparing to air-cooling applications. Empirical equations to predict heat transfer on the endwall were developed by obtaining experimental data on the copper base plate with acrylic pins. A new model for predicting pressure drops and heat transfer over staggered pin fin heat sinks with top bypass flow based on mass, momentum, and energy conservation within the two control volumes is proposed. The first control volume in the model is located within the finned area, and the second is located in the gap between the tip of the pins and the flow channel. This model combines two conditions according to the boundary-layer thickness. A comparison between experimental and calculated results revealed that dimensionless pressure drops and the Nusselt number could be predicted within 30% error for the former and 50% error for the latter.展开更多
Endothermic hydrocarbon fuels are advanced coolants for high-temperature structures of spacecraft. No data of tested-cooling-ability of endothermic fuels have been broadly discussed in literature. In this work a high-...Endothermic hydrocarbon fuels are advanced coolants for high-temperature structures of spacecraft. No data of tested-cooling-ability of endothermic fuels have been broadly discussed in literature. In this work a high-temperature flow calorimeter was designed, and the cooling capacity of six different hydrocarbon fuels were measured. Experimental results showed that these hydrocarbon fuels have capacity for cooling high-temperature structures, and that the cooling capacity of fuel N-1 can reach 3.15 M J/kg, which can nearly satisfy the requirement of thermal management for a Mach 3 cruise aircraft, whose heat sink requirement is about 3.5 M J/kg. The endothermic velocity of hydrocarbon fuels was also measured by the calorimeter.展开更多
An experimental investigation of the jet nanofluids impingement heat transfer characteristics of mini-channel heat sink for cooling computer processing unit of personal computer is performed. The experiments are teste...An experimental investigation of the jet nanofluids impingement heat transfer characteristics of mini-channel heat sink for cooling computer processing unit of personal computer is performed. The experiments are tested under the real personal computer operating conditions: no load and full load conditions. The experiments are performed for the following ranges of the parameters: coolant flow rate varies from 0.008 to 0.020 kg/s, the nozzle diameter is set to 1.00, 1.40, 1.80 mm, the distance nozzle-to-fins tip is 2.00 mm, the channel width of the mini-channel heat sink is 1.00 mm. The nanofluids with suspending of TiO2 particles in base fluid are used as a working fluids. It was observed that the average CPU temperatures obtained from the jet nanofluids impingement cooling system are 3.0%, 6.25% lower than those from the jet liquid impingement and from the conventional liquid cooling systems, respectively. However, this cooling system requires higher energy consumption.展开更多
A single concentrator solar cell model with a heat sink is established to simulate the thermal performance of the system by varying the number, height, and thickness of fins, the base thickness and thermal resistance ...A single concentrator solar cell model with a heat sink is established to simulate the thermal performance of the system by varying the number, height, and thickness of fins, the base thickness and thermal resistance of the thermal conductive adhesive. Influence disciplines of those parameters on temperatures of the solar cell and heat sink are obtained. With optimized number, height and thickness of fins, and the thickness values of base of 8, 1.4 cm, 1.5 mm, and 2 mm, the lowest temperatures of the solar cell and heat sink are 41.7 ~C and 36.3 ~C respectively. A concentrator solar cell prototype with a heat sink fabricated based on the simulation optimized structure is built. Outdoor temperatures of the prototype are tested. Temperatures of the solar cell and heat sink are stabilized with time continuing at about 37 ℃-38 ℃ and 35 ℃-36 ℃respectively, slightly lower than the simulation results because of effects of the wind and cloud. Thus the simulation model enables to predict the thermal performance of the system, and the simulation results can be a reference for designing heat sinks in the field of single concentrator solar cells.展开更多
With recent advances in power electronic packaging technologies,liquid-cooled ceramic heat sinks have been considered as a promising solution for further improving the performance of power electronic devices.In this s...With recent advances in power electronic packaging technologies,liquid-cooled ceramic heat sinks have been considered as a promising solution for further improving the performance of power electronic devices.In this study,several aluminum oxide heat sinks were fabricated and tested using the digital light processing-based ad-ditive manufacturing method,to verify their practical performance.The results showed that the complex cooling structures inside the heat sinks can be completely formed and exhibited high surface quality.The experimental thermal and hydraulic performances of the heat sinks were consistent with the numerically modeled predictions.Furthermore,by exploiting the advantages of additive manufacturing,a direct manifold microchannel(MMC)configuration was designed to reduce the vertical flow of the traditional MMC configuration and achieve an im-proved cooling efficiency.At a constant volumetric flow rate of 1 L/min,the direct MMC configuration achieved a 19.8%reduction in pressure drop and an 11.8%reduction in thermal resistance,as well as a more uniform temperature distribution.展开更多
As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans ...As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as vari- ous fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.展开更多
基金The project partially supported by National Natural Science Foundation of China (No. 10275069)
文摘An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a compliant layer between them. The behaviors of the integrated structure were evaluated in an electron beam facility under different heat loads and cooling conditions. The surface temperature and bulk temperature distribution were carefully measured by optical pyrometers and thermocouples under a steady state heat flux of 1 to 5 MW/m^2 and a water flow rate of 3 m^3/h, 4.5 m^3/h and 6 m^3/h, respectively. It was found that the surface temperature increased rapidly with the heat flux rising, but decreased only slightly with the water flow rate rising. The surface temperature reached approximately 1200℃ at 5 MW/m^2 of heat flux and 6 m^3/h of water flow. The primary experimental results indicate that the integrated design meets the requirements for the heat expelling capacity of the HT-7 device. A set of numerical simulations was also completed, whose outcome was in good accord with the experimental results.
文摘A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling. An Indirect cooling module has been experimentally studied and analyzed under steady state condition for both natural and forced convection. The thermal model is employed to determine the actual heat transfer and the effectiveness of the present model and compared it with the conventional cooling method and found that there is an appreciable improvement in the present model.
文摘Heat transfer experiments were conducted to investigate the thermal performance of air cooling through mini-channel heat sink with various configurations. Two types of channels have been used, one has a rectangular cross section area of 5 × 18 mm2 and the other is triangular with dimension of 5 × 9 mm2. Four channels of each configuration have been etched on copper block of 40 mm width,30 mm height, and 200 mm length. The measurements were performed in steady state with air flow rates of 0.002 - 0.005 m3/s, heating powers of 80 - 200 W and channel base temperatures of 48°C, 51°C, 55°C and 60°C. The results showed that the heat transfer to air stream is increased with increasing both of air mass flow rate and channel base temperature. The rectangular channels have better thermal performance than trian- gular ones at the same conditions. Analytical fin approach of 1-D and 2-D model were used to predict the heat transfer rate and outlet air temperature from channels heat sink. Theoretical results have been compared with experimental data. The predicted values for outlet air temperatures using the two models agree well with a deviation less than ±10%. But for the heat transfer data, the deviation is about +30% to –60% for 1-D model, and –5% to –80% for 2-D model. The global Nusselt number of the present experimental data is empirically correlated as with accuracy of ±20% for and compared with other literature correlations.
文摘Pressure drops and heat transfer over staggered pin fin heat sinks with top bypass flow were experimentally evaluated. The authors considered liquid-cooling applications because there were few data available comparing to air-cooling applications. Empirical equations to predict heat transfer on the endwall were developed by obtaining experimental data on the copper base plate with acrylic pins. A new model for predicting pressure drops and heat transfer over staggered pin fin heat sinks with top bypass flow based on mass, momentum, and energy conservation within the two control volumes is proposed. The first control volume in the model is located within the finned area, and the second is located in the gap between the tip of the pins and the flow channel. This model combines two conditions according to the boundary-layer thickness. A comparison between experimental and calculated results revealed that dimensionless pressure drops and the Nusselt number could be predicted within 30% error for the former and 50% error for the latter.
基金Project (No. 863-2-1-1-7) supported by the Hi-Tech Research and Development Program (863) of China
文摘Endothermic hydrocarbon fuels are advanced coolants for high-temperature structures of spacecraft. No data of tested-cooling-ability of endothermic fuels have been broadly discussed in literature. In this work a high-temperature flow calorimeter was designed, and the cooling capacity of six different hydrocarbon fuels were measured. Experimental results showed that these hydrocarbon fuels have capacity for cooling high-temperature structures, and that the cooling capacity of fuel N-1 can reach 3.15 M J/kg, which can nearly satisfy the requirement of thermal management for a Mach 3 cruise aircraft, whose heat sink requirement is about 3.5 M J/kg. The endothermic velocity of hydrocarbon fuels was also measured by the calorimeter.
文摘An experimental investigation of the jet nanofluids impingement heat transfer characteristics of mini-channel heat sink for cooling computer processing unit of personal computer is performed. The experiments are tested under the real personal computer operating conditions: no load and full load conditions. The experiments are performed for the following ranges of the parameters: coolant flow rate varies from 0.008 to 0.020 kg/s, the nozzle diameter is set to 1.00, 1.40, 1.80 mm, the distance nozzle-to-fins tip is 2.00 mm, the channel width of the mini-channel heat sink is 1.00 mm. The nanofluids with suspending of TiO2 particles in base fluid are used as a working fluids. It was observed that the average CPU temperatures obtained from the jet nanofluids impingement cooling system are 3.0%, 6.25% lower than those from the jet liquid impingement and from the conventional liquid cooling systems, respectively. However, this cooling system requires higher energy consumption.
基金supported by the Doctoral Initial Fund of Beijing University of Technology,China(Grant No.X0006015201101)the National Natural Science Foundation of China(Grant Nos.60876006 and 51202007)
文摘A single concentrator solar cell model with a heat sink is established to simulate the thermal performance of the system by varying the number, height, and thickness of fins, the base thickness and thermal resistance of the thermal conductive adhesive. Influence disciplines of those parameters on temperatures of the solar cell and heat sink are obtained. With optimized number, height and thickness of fins, and the thickness values of base of 8, 1.4 cm, 1.5 mm, and 2 mm, the lowest temperatures of the solar cell and heat sink are 41.7 ~C and 36.3 ~C respectively. A concentrator solar cell prototype with a heat sink fabricated based on the simulation optimized structure is built. Outdoor temperatures of the prototype are tested. Temperatures of the solar cell and heat sink are stabilized with time continuing at about 37 ℃-38 ℃ and 35 ℃-36 ℃respectively, slightly lower than the simulation results because of effects of the wind and cloud. Thus the simulation model enables to predict the thermal performance of the system, and the simulation results can be a reference for designing heat sinks in the field of single concentrator solar cells.
基金This study was supported by the National Natural Science Founda-tion of China(Grant.No.52175333)Basic Research Program of China(Grant.No.JCKY∗∗∗∗∗∗∗C102)+1 种基金Tribology Science Fund of the China State Key Laboratory of Tribology,Tsinghua University(Grant.No.SKLT2021B05)This study was also supported by the Ten Dimensions(Guangdong,China)Technology Co.,Ltd.,in the course of the lead-ing project“Additive Manufacturing of Ceramic Heat Sinks”(Grant.No.20232000308).
文摘With recent advances in power electronic packaging technologies,liquid-cooled ceramic heat sinks have been considered as a promising solution for further improving the performance of power electronic devices.In this study,several aluminum oxide heat sinks were fabricated and tested using the digital light processing-based ad-ditive manufacturing method,to verify their practical performance.The results showed that the complex cooling structures inside the heat sinks can be completely formed and exhibited high surface quality.The experimental thermal and hydraulic performances of the heat sinks were consistent with the numerically modeled predictions.Furthermore,by exploiting the advantages of additive manufacturing,a direct manifold microchannel(MMC)configuration was designed to reduce the vertical flow of the traditional MMC configuration and achieve an im-proved cooling efficiency.At a constant volumetric flow rate of 1 L/min,the direct MMC configuration achieved a 19.8%reduction in pressure drop and an 11.8%reduction in thermal resistance,as well as a more uniform temperature distribution.
文摘As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as vari- ous fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.
