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Heat Transfer Performance of Microgroove Back Plate Heat Pipes with Working Fluid and Heating Power 被引量:2
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作者 WU Yanpeng JIA Jie +1 位作者 TIAN Dongmin CHUAH Yew Khoy 《Journal of Thermal Science》 SCIE EI CAS CSCD 2020年第4期982-991,共10页
Micro heat pipes(MHP) cooling is one of the most efficient solutions to radiate heat for high heat flux electronic components in data centers. It is necessary to improve heat transfer performance of microgroove back p... Micro heat pipes(MHP) cooling is one of the most efficient solutions to radiate heat for high heat flux electronic components in data centers. It is necessary to improve heat transfer performance of microgroove back plate heat pipes. This paper discusses about influence on thermal resistance through experiments and numerical simulation with different working fluids, filling ratio and heat power. Thermal resistance of the CO2 filled heat pipe is 14.8% lower than the acetone filled heat pipe. In the meantime, at the best filling ratio of 40%, the CO2 filled heat pipe has the optimal heat transfer behavior with the smallest thermal resistance of 0.123 K/W. The thermal resistance continues to decline but the magnitude of decreases is going to be minor. In addition, this paper illustrates methods about how to enhance heat pipe performance from working fluids, filling ratio and heat power, which provides a theoretical basis for practical applications. 展开更多
关键词 microgroove back plate heat pipes working fluids filling ratio heat power
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