Edge effect during microwave plasma chemical vapor deposition diamond-film:Multiphysics simulation and experimental verification

This study focused on the investigation of the edge effect of diamond films deposited by microwave plasma chemical vapor de-position.Substrate bulge height△h is a factor that affects the edge effect,and it was used to simulate plasma and guide the diamond-film deposition experiments.Finite-element software COMSOL Multiphysics was used to construct a multiphysics(electromagnetic,plasma,and fluid heat transfer fields)coupling model based on electron collision reaction.Raman spectroscopy and scanning electron microscopy were performed to characterize the experimental growth and validate the model.The simulation results reflected the experimental trends observed.Plasma discharge at the edge of the substrate accelerated due to the increase in△h(△h=0-3 mm),and the values of electron density(n_(c)),molar concentration of H(C_(H)),and molar concentration of CH_(3)(C_(CH_(3)))doubled at the edge(for the special concave sample with△h=−1 mm,the active chemical groups exhibited a decreased molar concentration at the edge of the substrate).At=0-3 mm,a high diamond growth rate and a large diamond grain size were observed at the edge of the substrate,and their values increased with.The uniformity of film thickness decreased with.The Raman spectra of all samples revealed the first-order characteristic peak of dia-mond near 1332 cm^(−1).When△h=−1 mm,tensile stress occurred in all regions of the film.When△h=1-3 mm,all areas in the film ex-hibited compressive stress.

Microwave Plasma Chemical Vapor Deposition of Diamond Films on Silicon From Ethanol and Hydrogen

Diamond films with very smooth surface and good optical quality have been deposited onto silicon substrate using microwave plasma chemical vapor deposition (MPCVD) from a gas mixture of ethanol and hydrogen at a low substrate temperature of 450 ℃. The effects of the substrate temperature on the diamond nucleation and the morphology of the diamond film have been investigated and observed with scanning electron microscopy (SEM). The microstructure and the phase of the film have been characterized using Raman spectroscopy and X-ray diffraction (XRD). The diamond nucleation density significantly decreases with the increasing of the substrate temperature. There are only sparse nuclei when the substrate temperature is higher than 800 ℃ although the ethanol concentration in hydrogen is very high. That the characteristic diamond peak in the Raman spectrum of a diamond film prepared at a low substrate temperature of 450 ℃ extends into broadband indicates that the film is of nanophase. No graphite peak appeared in the XRD pattern confirms that the film is mainly composed of SP3 carbon. The diamond peak in the XRD pattern also broadens due to the nanocrystalline of the film.

Nanocrystalline Diamond Films Grown by Microwave Plasma Chemical Vapor Deposition and Its Biocompatible Property

Due to its unique properties such as high hardness, light transmittance, thermal conductance, chemical stability and corrosion resistance, diamond has drawn tremendous attention in last two decades. These specific properties made diamond film a promising material for cutting tools, microwave windows, heat sinks for electronic devices and diamond electrodes. However, the diamond film with grain sizes at microscale usually exhibits high surface roughness and hinders its applications in the microelectro mechanical system (MEMS) and biological field because it is difficult to be polished by mechanical and chemical methods. With the development of the chemical vapor deposition, the nanocrystalline diamond (NCD) film has been fabricated and found new applications. The grain size of NCD film is in the range of 10 to 100 nm, which inherits the properties of the diamond and possesses the unique properties of the nanoscale materials, and the morphology of the NCD film is granular or needle-like structure. The microwave plasma chemical vapor deposition (MPCVD) has been regarded as the most promising method to deposit NCD film at low temperature. Compared to the hot filament CVD, MPCVD can grow high quality NCD film avoiding of the contamination from the filament materials. The MPCVD technique has high plasma density to activate carbonaceous compound and grow NCD film in high growth rate and low substrate temperature. The unique properties of NCD film, such as the superior electrical, mechanical and biological properties facilitate their application in various fields. The biological application, especially as a biocompatible coating, mainly includes the joint replacement implants and protective coatings and the ophthalmological prosthesis.

Growth of Aligned Carbon Nanotubes through Microwave Plasma Chemical Vapor Deposition

Aligned carbon nanotubes (CNTs) were synthesized on glass by microwave plasma chemical vapor deposition (MWPCVD) with a mixture of methane and hydrogen gases at the low temperature of 550 ℃. The experimental results show that both the self-bias potential and the density of the catalyst particles are responsible for the alignment of CNTs. When the catalyst particle density is high enough, strong interactions among the CNTs can inhibit CNTs from growing randomly and result in parallel alignment.

Preparation of Nano-Crystalline Diamond Films on Poly-Crystalline Diamond Thick Films by Microwave Plasma Enhanced Chemical Vapor Deposition

Nano-crystalline diamond （NCD） films were prepared on poly-crystalline diamond （PCD） thick flims by the microwave plasma enhanced chemical vapor deposition （MPCVD） method. Free standing PCD thick film （50 mm in diameter） with a thickness of 413 μm was deposited in CHn/H2 plasma. It was then abraded for 2 hours and finally cut into pieces in a size of 10×10 mm^2 by pulse laser. NCD fihns were deposited on the thick film substrates by introducing a micro-crystalline diamond （MCD） interlayer. Results showed that a higher carbon concentration （5%） and a lower substrate temperature （650℃） were feasible to obtain a highly smooth interlayer, and the appropriate addition of oxygen （2%） into the gas mixture was conducive to obtaining a smooth nano-crystalline diamond film with a tiny grain size.

SYNTHESIS OF PPCuPc FILM BY MICROWAVE PLASMA CHEMICAL VAPORIZATION DEPOSITION(MPCVD)

Using a low power microwave generator(W_(max)=100W) and a Surfatron discharge device, Plasma-polymerized copper phthalocyanine (PPCuPc) film was synthesised from monomer copper phthalocyanine(CuPc) by microwave plasma chemical vaporization deposition(MPCVD) with Ar as incorporation gas. The film was characterized by FTIR and ESCA. The role of dissociation of chemical bond in the polymerization process and the influence of substrate temperature and material on deposition were investigated in some detail.

Microstructure evolution and mechanical properties of Ti-B-N coatings deposited by plasma-enhanced chemical vapor deposition

Ternary Ti-B-N coatings were synthesized on AISI 304 and Si wafer by plasma-enhanced chemical vapor deposition (PECVD) technique using a gaseous mixture of TiCl4,BCl3,H2,N2,and Ar.By virtue of X-ray diffraction analysis,X-ray photoelectron spectroscopy,scanning electron microscope,and high-resolution transmission electron microscope,the influences of B content on the microstructure and properties of Ti B N coatings were investigated systematically.The results indicated that the microstructure and mechanical properties of Ti-B-N coatings largely depend on the transformation from FCC-TiN phase to HCP-TiB2 phase.With increasing B content and decreasing N content in the coatings,the coating microstructure evolves gradually from FCC-TiN/a-BN to HCP-TiB2 /a-BN via FCC-TiN+HCP-TiB2/a-BN.The highest microhardness of about 34 GPa is achieved,which corresponds to the nanocomposite Ti-63%B-N (mole fraction) coating consisting of the HCP-TiB2 nano-crystallites and amorphous BN phase.The lowest friction-coefficient was observed for the nanocomposite Ti-41%B-N (mole fraction) coating consisting of the FCC-TiN nanocrystallites and amorphous BN

Structural evolution and optical characterization in argon diluted Si:H thin films obtained by plasma enhanced chemical vapor deposition

The structural evolution and optical characterization of hydrogenated silicon(Si:H) thin films obtained by conventional radio frequency(RF) plasma enhanced chemical vapor deposition(PECVD) through decomposition of silane diluted with argon were studied by X-ray diffractometry(XRD),Fourier transform infrared(FTIR) spectroscopy,Raman spectroscopy,transmission electron microscopy(TEM),and ultraviolet and visible(UV-vis) spectroscopy,respectively.The influence of argon dilution on the optical properties of the thin films was also studied.It is found that argon as dilution gas plays a significant role in the growth of nano-crystal grains and amorphous network in Si:H thin films.The structural evolution of the thin films with different argon dilution ratios is observed and it is suggested that argon plasma leads to the nanocrystallization in the thin films during the deposition process.The nanocrystallization initiating at a relatively low dilution ratio is also observed.With the increase of argon portion in the mixed precursor gases,nano-crystal grains in the thin films evolve regularly.The structural evolution is explained by a proposed model based on the energy exchange between the argon plasma constituted with Ar* and Ar+ radicals and the growth regions of the thin films.It is observed that both the absorption of UV-vis light and the optical gap decrease with the increase of dilution ratio.

PECVD喷淋板上微通道结构对射流均匀性的影响性分析

喷淋板微通道结构对等离子体增强化学气相沉积镀膜工艺成膜均匀性具有重要影响,目前缺少对不同微通道差异性的研究。通过采用滑移边界修正的连续流计算方法,获得克努森数为0.009~0.01的微通道流动特性结果,计算结果与其他微通道试验与计算结果具有一致性。结果表明,等径型与收缩型微通道几何尺寸对均匀性影响较小,出口射流所形成的涡流会降低均匀性,扩张型微通道提高出口扩散性,其射流均匀性明显优于前两者。通过提出均匀性量化方法,研究等径型、收缩型和扩张型三种具有代表性的微通道结构,进一步完善了喷淋板及稀薄环境微通道研究的不足。

应用于PECVD过渡流模拟的NS/DSMC双向耦合方法特性研究

将纳维-斯托克斯(NS)方程方法与直接模拟蒙特卡罗(DSMC)方法耦合以实现过渡流态计算.相对过去欠缺反馈机制的单向耦合方法,提出以NS,DSMC速度场相互修正边界值的方法实现双向耦合方法的反馈机制,这对于非稳态研究和数值修正十分重要.结果表明,双向耦合结果与全局DSMC结果有高相似性,相对单向耦合具有更高的效率、稳定性及精度,提高耦合强度可以提升稳定性与精度.双向耦合通过采用全局NS结果边界值获得更高的子域收敛性、稳定性及精度.提出超前演算方法可以增强DSMC域的时间耦合性,为非稳态计算奠定基础.

High rate deposition of microcrystalline silicon films by high-pressure radio frequency plasma enhanced chemical vapor deposition (PECVD)

Hydrogenated microcrystalline silicon (μc-Si:H) thin films were prepared by high- pressure radio-frequency (13.56 MHz) plasma enhanced chemical vapor deposition (rf-PECVD) with a screened plasma. The deposition rate and crystallinity varying with the deposition pressure, rf power, hydrogen dilution ratio and electrodes distance were systematically studied. By optimizing the deposition parameters the device quality μc-Si:H films have been achieved with a high deposition rate of 7.8 /s at a high pressure. The Voc of 560 mV and the FF of 0.70 have been achieved for a single-junction μc-Si:H p-i-n solar cell at a deposition rate of 7.8 /s.

SiC基GaN上多晶金刚石散热膜生长及其影响

通过微波等离子体化学气相沉积(MPCVD)法,在SiC基GaN高电子迁移率晶体管(HEMT)异质结构材料上生长多晶金刚石散热膜,采用光学显微镜(OM)、拉曼光谱、非接触霍尔测试系统、X射线衍射(XRD)和扫描电子显微镜(SEM)对生长样品进行表征,研究了生长温度、多晶金刚石散热膜厚度对GaN HEMT异质结构材料性能的影响。测试结果表明,当多晶金刚石生长温度为625℃,散热膜厚度为20μm时,GaN材料载流子迁移率降低9.8%,载流子浓度上升5.3%,(002)衍射峰半高宽增加40%。生长温度越高,金刚石散热膜的生长速率越快。当金刚石散热膜厚度相差不大时,生长温度越高,GaN所受拉应力越大,材料电特性衰退越明显。多晶金刚石高温生长过程中,金刚石引入的应力未对GaN结构产生破坏作用,GaN材料中没有出现孔洞等缺陷。

PECVD法氮化硅薄膜生长工艺的研究

采用等离子体增强化学气相沉积法(PECVD),在单晶硅衬底(100)上成功制备了不同生长工艺条件下的氮化硅薄膜。分别采用XP-2台阶仪、椭圆偏振仪等手段测试了薄膜的厚度、折射率、生长速率等参数。并采用原子力显微镜(AFM)研究了薄膜的表面形貌。结果表明,温度和射频功率是影响薄膜生长速率的主要因素,生长速率变化幅度可以达到230nm/min甚至更高。对于薄膜折射率和成分影响最大的是NH3流量,折射率变化范围可以达到2.7～1.86。分析得出受工艺参数调控的薄膜生长速率对薄膜的性质有重要影响。

PECVD法低温制备二氧化硅薄膜(英文)

针对金属层间介质以及MEMS等对氧化硅薄膜的需求,介绍了采用等离子增强型化学气相沉积(PECVD)技术,以SiH4和N2O为反应气体,低温制备SiO2薄膜的方法.利用椭偏仪和应力测试系统对制得的SiO2薄膜的厚度、折射率、均匀性以及应力等性能指标进行了测试,探讨了射频功率、反应腔室压力、气体流量比等关键工艺参数对SiO2薄膜性能的影响.结果表明:SiO2薄膜的折射率主要由N2O/SiH4的流量比决定,而薄膜均匀性主要受电极间距以及反应腔室压力的影响.通过优化工艺参数,在低温260℃下制备了折射率为1.45～1.52、均匀性为±0.64%、应力在-350～-16MPa可控的SiO2薄膜.采用该方法制备的SiO2薄膜均匀性好、结构致密、沉积速率快、沉积温度低且应力可控,可广泛应用于集成电路以及MEMS器件中.

气压对VHF-PECVD制备的μc-Si∶H薄膜特性影响的研究

本文主要研究了用VHF PECVD方法制备的不同工作气压的微晶硅薄膜样品。结果表明 :沉积速率随反应气压的增大而逐渐增大 ;光敏性 (光电导 /暗电导 )和激活能测试结果给出了相同的变化规律 ;傅立叶红外测试、X射线衍射和室温微区喇曼谱的结果都表明了样品的晶化特性 ;

氧气对MWPCVD制备金刚石膜的影响

在水冷反应室式微波等离子体化学气相沉积装置中以混合的CH4 H2 O2 为反应气体 ,研究了O2 浓度对制备金刚石膜的影响。实验发现 ,很低浓度的O2 会显著促进金刚石的沉积 ,并稍稍抑制非晶C的沉积 ,因而沉积膜中非晶C的含量急剧下降 ;较高浓度的O2 会同时抑制金刚石和非晶C的沉积 ,但由于抑制金刚石的作用更强烈 ,沉积膜中非晶C的含量反而有所升高。另外 ,O2 的存在 。

射频PECVD高速沉积微晶硅薄膜

本文采用射频等离子体增强化学气相沉积(RF-PECVD)技术高速沉积微晶硅薄膜。系统研究了射频功率、气体总流量、沉积气压、硅烷浓度等沉积参数对薄膜沉积速率和晶化率的影响。通过沉积参数的优化,使微晶硅薄膜沉积速率达到了3/s左右。

H_2稀释在PECVD法制备微晶硅薄膜中的影响

利用等离子增强化学气相沉积(PECVD)技术,研究了H稀释度D=H 2/(H 2+SiH 4)对在玻璃和不锈钢衬底上低温制备微晶硅薄膜的晶化率、晶粒尺寸、薄膜质量等的影响。结果表明,随着硅烷浓度的降低,样品的晶化率、晶粒尺寸有所改变。当D=99%时,晶粒突然变大,晶化率显著提高。因此,我们认为此时的硅薄膜由非晶硅转化为微晶硅。

射频PECVD方法生长含氢非晶碳膜的结构及摩擦学性能

利用射频等离子体增强化学气相沉积技术在不锈钢表面制备了含氢非晶碳膜.采用Raman光谱、红外光谱、X射线光电子能谱和原子力显微镜等研究了薄膜的微观结构和表面形貌,在栓盘摩擦磨损试验机上考察了薄膜在不同载荷与滑动速度下的摩擦学性能.结果表明:所制备的含氢非晶碳膜具有典型的类金刚石结构特征,薄膜均匀、致密,表面粗糙度小;薄膜与不锈钢球对磨时显示出良好的抗磨减摩性能;薄膜的抗磨减摩性能同对磨件表面上形成的转移膜以及摩擦过程中薄膜结构的石墨化相关.

VHF-PECVD制备微晶硅材料及电池初步研究

研究了用甚高频等离子体增强化学气相沉积(VHF-PECVD)方法制备的不同沉积气压下的微晶硅薄膜样品。随着沉积气压的逐渐增大,样品的沉积速率也逐渐增大;样品的光敏性和激活能测试结果表明:随气压的变化两者发生了规律性一致的变化;傅立叶变换红外(FTIR)测试表明制备的样品中含有一定量的氧,使得样品呈现弱n型;室温微区喇曼光谱测试分析得到样品的微晶化特征与IR的分析是一致的,用高斯函数对喇曼谱解谱分析定量得出了晶化程度;分析了H处理p/I界面对电池性能的影响;首次在国内用VHF-PECVD制备出效率达4.24%的微晶硅电池。