Contact Resistance and Arc Erosion of Tungsten-copper Contacts in Direct Currents

The arc erosion under medium direct currents in the argon flow was tested on tungsten-copper（W-Cu） contacts which were processed by hot extrusion and heat treatment. The scanning electron microscopy（SEM） and transmission electron microscopy（TEM） were used to study the microstructure of the W-Cu powders and compacts. The contact resistance, arcing energy, and arcing time were continuously measured by JF04C contact materials test system. Changes in tungsten-copper contact surface were observed by SEM. The test results showed that the arcing time and arcing energy all increase with current and voltage, but the changes of average contact resistance are more complicated. For a short arcing time, the average contact resistance decreases with increasing current due to the vaporization of Cu. However, for a longer arcing time, it slightly increases due to the formation of high resistant films, compound copper tungsten. The formation of compound copper tungsten was confirmed by the increased Rc kept in the range from 1.1 to 1.6 mΩ. The compound copper tungsten is first exposed with a tungsten and copper-rich surface, and then totally exposed due to evaporation of copper from the surface. At last a stabilized surface is created and the crystals decrease from 8 μm to 2 μm caused by the arc erosion.

Bioinspired tungsten-copper composites with Bouligand-type architectures mimicking fish scales

The microscopic Bouligand-type architectures of fish scales demonstrate a notable efficiency in enhancing the damage tolerance of materials;nevertheless,it is challenging to reproduce in metals.Here bioinspired tungsten-copper composites with different Bouligand-type architectures mimicking fish scales were fabricated by infiltrating a copper melt into woven contextures of tungsten fibers.These composites exhibit a synergetic enhancement in both strength and ductility at room temperature along with an improved resistance to high-temperature oxidization.The strengths were interpreted by adapting the classical laminate theory to incorporate the characteristics of Bouligand-type architectures.In particular,under load the tungsten fibers can reorient adaptively within the copper matrix by their straightening,stretching,interfacial sliding with the matrix,and the cooperative kinking deformation of fiber grids,representing a successful implementation of the optimizing mechanisms of the Bouligand-type architectures to enhance strength and toughness.This study may serve to promote the development of new high-performance tungsten-copper composites for applications,e.g.,as electrical contacts or heat sinks,and offer a viable approach for constructing bioinspired architectures in metallic materials.

Reliability improvement of gas discharge tube by suppressing the formation of short-circuit pathways

After cumulative discharge of gas discharge tube(GDT),it is easy to form a short circuit pathway between the two electrodes,which increases the failure risk and causes severe influences on the protected object.To reduce the failure risk of GDT and improve cumulative discharge times before failure,this work aims to suppress the formation of two short-circuit pathways by optimizing the tube wall structure,the electrode materials and the electrode structure.A total of five improved GDT samples are designed by focusing on the insulation resistance change that occurs after the improvement;then,by combining these designs with the microscopic morphology changes inside the cavity and the differences in deposition composition,the reasons for the differences in the GDT failure risk are also analyzed.The experimental results show that compared with GDT of traditional structure and material,the method of adding grooves at both ends of the tube wall can effectively block the deposition pathway of the tube wall,and the cumulative discharge time before device failure is increased by 149%.On this basis,when the iron-nickel electrode is replaced with a tungsten-copper electrode,the difference in the electrode’s surface splash characteristics further extends the discharge time before failure by 183%.In addition,when compared with the traditional electrode structure,the method of adding an annular structure at the electrode edge to block the splashing pathway for the particles on the electrode surface shows no positive effect,and the cumulative discharge time before the failure of the two structures is reduced by 22.8%and 49.7%,respectively.Among these improved structures,the samples with grooves at both ends of the tube wall and tungsten-copper as their electrode material have the lowest failure risk.

A corrosion study on W-Cu alloys in sodium chloride solution at different pH

A corrosion study of two types of tungsten-copper(W-Cu)alloys in 3.38 wt.%Na Cl solution with different pH at 25℃were investigated using potentiodynamic polarization and immersion test.It is crucial that the corrosion behavior and preferential attacked phases of the W-Cu alloys were found to alter with p H.The micro-galvanic effect of tungsten phase and copper binder played a significant role.It was also proved that the existence of aggressive chloride ions could accelerate the Cu binder dissolution in acidic and neutral solution,which induced tungsten phase detachment and increased the corrosion rate of the W-Cu alloys.While Cl-would accelerate the Cu binder dissolution of W-Cu alloys at high potential during polarization test in strong alkaline solution.