The layout of power modules is one of the key points in power module design,especially for silicon carbide module,which may parallel more devices compared with silicon counterpart.In this paper,along with the design e...The layout of power modules is one of the key points in power module design,especially for silicon carbide module,which may parallel more devices compared with silicon counterpart.In this paper,along with the design example,a improved layout design method for planar power modules is presented.Some practical considerations and implementations are also introduced in the optimization of module layout design.展开更多
A novel multi-chip module(MCM) interconnect test generation scheme based on ant algorithm(AA) with mutation operator was presented.By combing the characteristics of MCM interconnect test generation,the pheromone updat...A novel multi-chip module(MCM) interconnect test generation scheme based on ant algorithm(AA) with mutation operator was presented.By combing the characteristics of MCM interconnect test generation,the pheromone updating rule and state transition rule of AA is designed.Using mutation operator,this scheme overcomes ordinary AA’s defects of slow convergence speed,easy to get stagnate,and low ability of full search.The international standard MCM benchmark circuit provided by the MCNC group was used to verify the approach.The results of simulation experiments,which compare to the results of standard ant algorithm,genetic algorithm(GA) and other deterministic interconnecting algorithms,show that the proposed scheme can achieve high fault coverage,compact test set and short CPU time,that it is a newer optimized method deserving research.展开更多
We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic(LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, a...We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic(LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module(MCM) for integration of integrated circuit(IC) bare chips.A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 d B, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm×6.1 mm×2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.展开更多
Wafer-level mass production of photonic integrated circuits(PIC)has become a technological mainstay in the field of optics and photonics,enabling many novel and disrupting a wide range of existing applications.However...Wafer-level mass production of photonic integrated circuits(PIC)has become a technological mainstay in the field of optics and photonics,enabling many novel and disrupting a wide range of existing applications.However,scalable photonic packaging and system assembly still represents a major challenge that often hinders commercial adoption of PIC-based solutions.Specifically,chip-to-chip and fiber-to-chip connections often rely on so-called active alignment techniques,where the coupling efficiency is continuously measured and optimized during the assembly process.This unavoidably leads to technically complex assembly processes and high cost,thereby eliminating most of the inherent scalability advantages of PIC-based solutions.In this paper,we demonstrate that 3D-printed facet-attached microlenses(FaML)can overcome this problem by opening an attractive path towards highly scalable photonic system assembly,relying entirely on passive assembly techniques based on industry-standard machine vision and/or simple mechanical stops.FaML can be printed with high precision to the facets of optical components using multi-photon lithography,thereby offering the possibility to shape the emitted beams by freely designed refractive or reflective surfaces.Specifically,the emitted beams can be collimated to a comparatively large diameter that is independent of the device-specific mode fields,thereby relaxing both axial and lateral alignment tolerances.Moreover,the FaML concept allows to insert discrete optical elements such as optical isolators into the free-space beam paths between PIC facets.We show the viability and the versatility of the scheme in a series of selected experiments of high technical relevance,comprising pluggable fiber-chip interfaces,the combination of PIC with discrete micro-optical elements such as polarization beam splitters,as well as coupling with ultra-low back-reflection based on non-planar beam paths that only comprise tilted optical surfaces.Based on our results,we believe that the FaML concept opens an attractive path towards novel PIC-based system architectures that combine the distinct advantages of different photonic integration platforms.展开更多
基金This work is supported by The National key research and development program of China(2016YFB0100600)the Key Program of Bureau of Frontier Sciences and Education,Chinese Academy of Sciences(QYZDBSSW-JSC044)the National Natural Science Foundation of China(No.51507166).
文摘The layout of power modules is one of the key points in power module design,especially for silicon carbide module,which may parallel more devices compared with silicon counterpart.In this paper,along with the design example,a improved layout design method for planar power modules is presented.Some practical considerations and implementations are also introduced in the optimization of module layout design.
文摘A novel multi-chip module(MCM) interconnect test generation scheme based on ant algorithm(AA) with mutation operator was presented.By combing the characteristics of MCM interconnect test generation,the pheromone updating rule and state transition rule of AA is designed.Using mutation operator,this scheme overcomes ordinary AA’s defects of slow convergence speed,easy to get stagnate,and low ability of full search.The international standard MCM benchmark circuit provided by the MCNC group was used to verify the approach.The results of simulation experiments,which compare to the results of standard ant algorithm,genetic algorithm(GA) and other deterministic interconnecting algorithms,show that the proposed scheme can achieve high fault coverage,compact test set and short CPU time,that it is a newer optimized method deserving research.
基金supported by the National Natural Science Foundation of China(Nos.61574106 and 61334003)the National Defense Pre-research Foundation of China(No.9140A23060115DZ01062)the Key Science and Technology Special Pro ject of Shaanxi Province,China(No.2015KTCQ01-5)
文摘We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic(LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module(MCM) for integration of integrated circuit(IC) bare chips.A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 d B, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm×6.1 mm×2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.
基金the Deutsche Forschungsgemeinschaft(DFG,German Research Foundation)under Germany’s Excellence Strategy via the Excellence Cluster 3D Matter Made to Order(EXC-2082/1-390761711)the Collaborative Research Center WavePhenomena(CRC 1173)+4 种基金by the Bundesministerium für Bildung und Forschung(BMBF)via the projects PRIMA(#13N14630),DiFeMiS(#16ES0948)which is part of the programme“Forschungslabore Mikroelektronik Deutschland(ForLab),and Open6GHub(#16KISK010)by the European Research Council(ERC Consolidator Grant‘TeraSHAPE’#773248),by the H2020 Photonic Packaging Pilot Line PIXAPP(#731954)by the Alfried Krupp von Bohlen und Halbach Foundation,and by the Karlsruhe School of Optics and Photonics(KSOP).
文摘Wafer-level mass production of photonic integrated circuits(PIC)has become a technological mainstay in the field of optics and photonics,enabling many novel and disrupting a wide range of existing applications.However,scalable photonic packaging and system assembly still represents a major challenge that often hinders commercial adoption of PIC-based solutions.Specifically,chip-to-chip and fiber-to-chip connections often rely on so-called active alignment techniques,where the coupling efficiency is continuously measured and optimized during the assembly process.This unavoidably leads to technically complex assembly processes and high cost,thereby eliminating most of the inherent scalability advantages of PIC-based solutions.In this paper,we demonstrate that 3D-printed facet-attached microlenses(FaML)can overcome this problem by opening an attractive path towards highly scalable photonic system assembly,relying entirely on passive assembly techniques based on industry-standard machine vision and/or simple mechanical stops.FaML can be printed with high precision to the facets of optical components using multi-photon lithography,thereby offering the possibility to shape the emitted beams by freely designed refractive or reflective surfaces.Specifically,the emitted beams can be collimated to a comparatively large diameter that is independent of the device-specific mode fields,thereby relaxing both axial and lateral alignment tolerances.Moreover,the FaML concept allows to insert discrete optical elements such as optical isolators into the free-space beam paths between PIC facets.We show the viability and the versatility of the scheme in a series of selected experiments of high technical relevance,comprising pluggable fiber-chip interfaces,the combination of PIC with discrete micro-optical elements such as polarization beam splitters,as well as coupling with ultra-low back-reflection based on non-planar beam paths that only comprise tilted optical surfaces.Based on our results,we believe that the FaML concept opens an attractive path towards novel PIC-based system architectures that combine the distinct advantages of different photonic integration platforms.
