In this paper,a hybrid integrated broadband Doherty power amplifier(DPA)based on a multi-chip module(MCM),whose active devices are fabricated using the gallium nitride(GaN)process and whose passive circuits are fabric...In this paper,a hybrid integrated broadband Doherty power amplifier(DPA)based on a multi-chip module(MCM),whose active devices are fabricated using the gallium nitride(GaN)process and whose passive circuits are fabricated using the gallium arsenide(GaAs)integrated passive device(IPD)process,is proposed for 5G massive multiple-input multiple-output(MIMO)application.An inverted DPA structure with a low-Q output network is proposed to achieve better bandwidth performance,and a single-driver architecture is adopted for a chip with high gain and small area.The proposed DPA has a bandwidth of 4.4-5.0 GHz that can achieve a saturation of more than 45.0 dBm.The gain compression from 37 dBm to saturation power is less than 4 dB,and the average power-added efficiency(PAE)is 36.3%with an 8.5 dB peak-to-average power ratio(PAPR)in 4.5-5.0 GHz.The measured adjacent channel power ratio(ACPR)is better than50 dBc after digital predistortion(DPD),exhibiting satisfactory linearity.展开更多
针对多芯片功率模块MCPMs(multi-chip power modules)从功率模块布局设计角度对碳化硅SiC(sili-con carbide)MOSFET的并联不均流进行了研究。理论分析了造成SiC MOSFET并联不均流的原因,在忽略器件自身差异的情况下,重点分析了非对称布...针对多芯片功率模块MCPMs(multi-chip power modules)从功率模块布局设计角度对碳化硅SiC(sili-con carbide)MOSFET的并联不均流进行了研究。理论分析了造成SiC MOSFET并联不均流的原因,在忽略器件自身差异的情况下,重点分析了非对称布局对功率管并联不均流的影响。在此基础之上,以集成化大功率固态功率控制器SSPC(solid-state power controller)为背景,提出了3种适用于大功率SSPC集成功率模块的非对称布局,分别对3种布局的不均流电流进行了理论分析,并利用Ansoft Q3D提取寄生参数在Saber中对模块的动态开关过程进行仿真。仿真结果表明,通过合理的布局可以减小非对称布局引起的寄生电感不对称对SiCMOSFET并联不均流造成的影响。展开更多
基金supported in part by the National Key Research and Development Program of China(2021YFA0716601)the National Science Fund(62225111).
文摘In this paper,a hybrid integrated broadband Doherty power amplifier(DPA)based on a multi-chip module(MCM),whose active devices are fabricated using the gallium nitride(GaN)process and whose passive circuits are fabricated using the gallium arsenide(GaAs)integrated passive device(IPD)process,is proposed for 5G massive multiple-input multiple-output(MIMO)application.An inverted DPA structure with a low-Q output network is proposed to achieve better bandwidth performance,and a single-driver architecture is adopted for a chip with high gain and small area.The proposed DPA has a bandwidth of 4.4-5.0 GHz that can achieve a saturation of more than 45.0 dBm.The gain compression from 37 dBm to saturation power is less than 4 dB,and the average power-added efficiency(PAE)is 36.3%with an 8.5 dB peak-to-average power ratio(PAPR)in 4.5-5.0 GHz.The measured adjacent channel power ratio(ACPR)is better than50 dBc after digital predistortion(DPD),exhibiting satisfactory linearity.
文摘针对多芯片功率模块MCPMs(multi-chip power modules)从功率模块布局设计角度对碳化硅SiC(sili-con carbide)MOSFET的并联不均流进行了研究。理论分析了造成SiC MOSFET并联不均流的原因,在忽略器件自身差异的情况下,重点分析了非对称布局对功率管并联不均流的影响。在此基础之上,以集成化大功率固态功率控制器SSPC(solid-state power controller)为背景,提出了3种适用于大功率SSPC集成功率模块的非对称布局,分别对3种布局的不均流电流进行了理论分析,并利用Ansoft Q3D提取寄生参数在Saber中对模块的动态开关过程进行仿真。仿真结果表明,通过合理的布局可以减小非对称布局引起的寄生电感不对称对SiCMOSFET并联不均流造成的影响。
