A single-chip UHF RFID reader transceiver IC has been implemented in 0.18 μm SiGe BiCMOS technology. The chip includes all transceiver blocks as RX/TX RF front-end, RX/TX analog baseband, frequency synthesizer and I2...A single-chip UHF RFID reader transceiver IC has been implemented in 0.18 μm SiGe BiCMOS technology. The chip includes all transceiver blocks as RX/TX RF front-end, RX/TX analog baseband, frequency synthesizer and I2C with fully-compliant China 800/900 MHz RFID draft, ISO/IEC 18000-6C protocol and ETSI 302 208-1 local regulation. The normal mode receiver in the presence of -3 dBm self-jammer achieves -75 dBm 1% PER sensitivity. The linear class-A PA integrated in transmitter has 25 dBm OP1 dB output power for CW. The fully-integrated fractional-N fre-quency synthesizer is designed based on MASH 1-1-1 sigma-delta modulator and 1.8 GHz fundamental frequency LC-VCO for lower in-band and out-of-band phase noise. The measured phase noise is up to -106 dBc/Hz@200 kHz and -131 dBc/Hz@1 MHz offset from center frequency and the integrated RMS jitter from 10 kHz to 10 MHz is less than 1.6 pS. The chip dissipates 330 mA from 3.3 V power supply when transmitting 22.4 dBm CW signal and the PAE of linear PA is up to 26%. The chip die area is 16.8 mm2.展开更多
An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapt...An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapter board technology.Four layers of high-resistance silicon substrate stack packaging are implemented based on the wafer-level gold-gold bonding process.Each layer adopts though silicon via(TSV)technology to realize signal interconnection.A core monolithic integrated microwave chip(MMIC)is embedded in the silicon cavity,and the silicon-based filter is integrated with the high-resistance silicon substrate.The interconnect line,cavity and filter of the silicon-based adapter board are designed with AutoCAD,and HFSS is adopted for 3D electromagnetic field simulation.According to the measured results,the radio frequency(RF)of the mixing multi-function chip is 40-44 GHz and its intermediate frequency(IF)can cover the Ku band with a chip size of 10 mm×11 mm×1 mm.The multiplier multi-function chip operates at 16-20 GHz.The fundamental suppression is greater than 50 dB and the second harmonic suppression is better than 40 dB with a chip size of 8 mm×8 mm×1 mm.The cascaded fully assembled mixing component achieves a spur of better than-50 dBc and a gain of better than 15 dB.展开更多
报道了一款应用于Ku波段的GaN T/R MMIC。该芯片采用0.15μm GaN HEMT器件工艺制造,集成了T/R组件的接收通道和发射通道,芯片面积7.00mm×3.32mm。研制的MMIC集成了5位数字衰减器、5位数字移相器、前级低噪声放大器、后级低噪声放...报道了一款应用于Ku波段的GaN T/R MMIC。该芯片采用0.15μm GaN HEMT器件工艺制造,集成了T/R组件的接收通道和发射通道,芯片面积7.00mm×3.32mm。研制的MMIC集成了5位数字衰减器、5位数字移相器、前级低噪声放大器、后级低噪声放大器、驱动放大器、功率放大器、公用支路的小信号开关和收发切换的功率开关。在16~17GHz工作频带内测得该芯片接收通道增益大于21dB,噪声系数小于3.5dB;发射通道增益大于20.8dB,饱和功率大于40.8dBm,功率附加效率典型值30%。该芯片上集成的5位数字移相器、5位数字衰减器功能正常,达到设计要求。展开更多
文摘A single-chip UHF RFID reader transceiver IC has been implemented in 0.18 μm SiGe BiCMOS technology. The chip includes all transceiver blocks as RX/TX RF front-end, RX/TX analog baseband, frequency synthesizer and I2C with fully-compliant China 800/900 MHz RFID draft, ISO/IEC 18000-6C protocol and ETSI 302 208-1 local regulation. The normal mode receiver in the presence of -3 dBm self-jammer achieves -75 dBm 1% PER sensitivity. The linear class-A PA integrated in transmitter has 25 dBm OP1 dB output power for CW. The fully-integrated fractional-N fre-quency synthesizer is designed based on MASH 1-1-1 sigma-delta modulator and 1.8 GHz fundamental frequency LC-VCO for lower in-band and out-of-band phase noise. The measured phase noise is up to -106 dBc/Hz@200 kHz and -131 dBc/Hz@1 MHz offset from center frequency and the integrated RMS jitter from 10 kHz to 10 MHz is less than 1.6 pS. The chip dissipates 330 mA from 3.3 V power supply when transmitting 22.4 dBm CW signal and the PAE of linear PA is up to 26%. The chip die area is 16.8 mm2.
文摘An ultra-wideband mixing component cascaded by a mixing multi-function chip and a frequency multiplier multi-function chip was demonstrated and implemented using 3D heterogeneous integration based on the silicon adapter board technology.Four layers of high-resistance silicon substrate stack packaging are implemented based on the wafer-level gold-gold bonding process.Each layer adopts though silicon via(TSV)technology to realize signal interconnection.A core monolithic integrated microwave chip(MMIC)is embedded in the silicon cavity,and the silicon-based filter is integrated with the high-resistance silicon substrate.The interconnect line,cavity and filter of the silicon-based adapter board are designed with AutoCAD,and HFSS is adopted for 3D electromagnetic field simulation.According to the measured results,the radio frequency(RF)of the mixing multi-function chip is 40-44 GHz and its intermediate frequency(IF)can cover the Ku band with a chip size of 10 mm×11 mm×1 mm.The multiplier multi-function chip operates at 16-20 GHz.The fundamental suppression is greater than 50 dB and the second harmonic suppression is better than 40 dB with a chip size of 8 mm×8 mm×1 mm.The cascaded fully assembled mixing component achieves a spur of better than-50 dBc and a gain of better than 15 dB.
文摘报道了一款应用于Ku波段的GaN T/R MMIC。该芯片采用0.15μm GaN HEMT器件工艺制造,集成了T/R组件的接收通道和发射通道,芯片面积7.00mm×3.32mm。研制的MMIC集成了5位数字衰减器、5位数字移相器、前级低噪声放大器、后级低噪声放大器、驱动放大器、功率放大器、公用支路的小信号开关和收发切换的功率开关。在16~17GHz工作频带内测得该芯片接收通道增益大于21dB,噪声系数小于3.5dB;发射通道增益大于20.8dB,饱和功率大于40.8dBm,功率附加效率典型值30%。该芯片上集成的5位数字移相器、5位数字衰减器功能正常,达到设计要求。
