期刊文献+
共找到7篇文章
< 1 >
每页显示 20 50 100
Energy Absorption Diagrams of Multi-layer Corrugated Boards 被引量:5
1
作者 王冬梅 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2010年第1期58-61,共4页
Based on the static compression experiments, the compressive stress-strain curve of multi-layer corrugated boards is simplified into three sections of linear elasticity, sub-buckling going with local collapse and dens... Based on the static compression experiments, the compressive stress-strain curve of multi-layer corrugated boards is simplified into three sections of linear elasticity, sub-buckling going with local collapse and densification. By considering the structure factors of multi-layer corrugated boards, the energy absorption model is obtained and characterized by the structure factors of corrugated cell-wall. The model is standardized by the solid modulus and it is universal for corrugated structures of different basis material. In the liner-elastic section, with the increase of the load, the energy absorption per unit volume of multi-layer corrugated boards gradually increases; in the sub-buckling section going with local collapse, the compression resistance of multi-layer corrugated boards goes on under a nearly constant load, but the energy absorption per unit volume rapidly increases with the increase of the compression strain. It is shown as an ascending curve in the energy absorption diagram. In the densification section, the corrugated sandwich core has no energy absorption capability. A good consistency is achieved between theoretical and experimental energy absorption curves. In designing the cushioning package, the cushioning properties can be evaluated by the theoretical model without more experiments. The suggested method to develop the energy absorption diagram for corrugated boards can be used to characterize the cushioning properties and optimize the structures of corrugated sandwich structures. 展开更多
关键词 multi-layer corrugated boards stress strain curve energy absorption diagram MODELLING
下载PDF
Modeling of Micropores Drilling Force for Printed Circuit Board Micro-holes Based on Energy Method
2
作者 郑小虎 阮浩 +2 位作者 陈宏博 刘骁佳 刘正好 《Journal of Donghua University(English Edition)》 CAS 2023年第5期525-530,共6页
The quality of printed circuit board(PCB)micro-hole processing directly determines the stability of the inner and outer circuit connections.Micro-hole drilling technology is a typical method for PCB micro-hole process... The quality of printed circuit board(PCB)micro-hole processing directly determines the stability of the inner and outer circuit connections.Micro-hole drilling technology is a typical method for PCB micro-hole processing.The problem of optimal control of its drilling force is one of the main factors affecting the quality of micro-hole machining.To address this problem,the thrust forces and torques in PCB drilling were first modeled and analyzed,and the corresponding prediction models were established.The drilling force analysis was carried out through the micro-hole drilling experiment,the specific cutting energy under different feed rates was calculated,the influence of the size effect was clarified,and the accuracy of the prediction model was verified.The result shows that during the drilling of glass fiber cloth,changes in the material removal mechanism are induced as the feed per revolution is varied.When the feed per revolution is less than the tool edge radius,the glass fiber is not cut by the main cutting edge,but is crushed and broken.When the feed per revolution is greater than the radius of the tool edge,the glass fiber is cut by the main cutting edge.At the same time,the established analytical model can accurately reflect the influence of the size effect on the drilling torque in PCB micro-hole drilling,and the error is within 10%.This method has certain practical application value in controlling PCB micro hole processing quality. 展开更多
关键词 printed circuit board(PCB) micro-hole drilling predictive model size effect multi-layer material
下载PDF
多层板层压过程中的尺寸收缩分析 被引量:7
3
作者 邓丹 许鹏 +5 位作者 吴丰顺 姜雪飞 彭卫红 刘东 叶应才 高团芬 《印制电路信息》 2010年第S1期366-373,共8页
在多层板制造过程中,内层芯板的收缩极大地影响了产品的质量。本文通过对多层板制作过程中的尺寸变形的分析,指出导致内层芯板变形的主要因素为材料热胀系数不匹配。通过对半固化片状态变化过程的分析,建立了层压过程各个阶段的数学模... 在多层板制造过程中,内层芯板的收缩极大地影响了产品的质量。本文通过对多层板制作过程中的尺寸变形的分析,指出导致内层芯板变形的主要因素为材料热胀系数不匹配。通过对半固化片状态变化过程的分析,建立了层压过程各个阶段的数学模型。通过解析计算,得到结构为铜面/半固化片/铜面的一种高Tg芯板纬向菲林补偿系数为1.24668,与实际实验中得到的补偿系数比较接近。 展开更多
关键词 多层板 层压 热胀系数 半固化片 补偿系数
下载PDF
多层板层压过程中的尺寸收缩分析 被引量:1
4
作者 邓丹 许鹏 +4 位作者 王立全 吴丰顺 刘东 姜雪飞 彭卫红 《印制电路信息》 2011年第S1期127-132,共6页
内短作为多层板层压制作过程中的一种常见的失效形式,一直严重的影响了电子产品的性能。而芯板的涨缩是导致层偏内短的主要原因之一。本文通过分析多层板层压过程中内层收缩的两大主要影响因素:残留内应力和热涨系数不匹配,然后以线路/... 内短作为多层板层压制作过程中的一种常见的失效形式,一直严重的影响了电子产品的性能。而芯板的涨缩是导致层偏内短的主要原因之一。本文通过分析多层板层压过程中内层收缩的两大主要影响因素:残留内应力和热涨系数不匹配,然后以线路/PP/线路芯板结构的六层板为例,分别建立内应力完全释放与不释放两种数学模型,各自进行求解,得出两种情况下的菲林补偿系数,分别为-0.37和4.79,这与相关制造厂商提供的线路菲林补偿系数的测量数据2~3.5十分接近。另外,计算结果还验证了内应力对内层收缩的影响。 展开更多
关键词 多层板 内应力 热胀系数 菲林补偿系数
下载PDF
多层板翘曲的分析 被引量:1
5
作者 陈诚 《印制电路信息》 2005年第9期49-50,72,共3页
主要针对多层板在设计生产中容易出现板翘曲的因素加以分析与分类,同时提出了一些常见的解决方法。
关键词 多层板 热膨胀系数 覆铜板 半固化片 残留应力 翘曲
下载PDF
用于空间飞行封装的刚—挠性板 被引量:2
6
作者 A.Suresh M.L.Subramanya +2 位作者 Sumdaraganesan B.N.Baliga 孔祥麟 《印制电路信息》 2005年第12期55-59,共5页
概述了刚—挠性多层板的结构,制作方法和应用实例。
关键词 刚—挠多层板 封装 母板 子板 子系统
下载PDF
多层印制电路板的分层原因与对策
7
作者 张宏 《电子元器件应用》 2002年第7期47-48,共2页
扼要介绍多层印制电路板的分层原因及其对策。
关键词 多层 印制电路板 分层原因 对策 内层处理 半固化片 粘结片
下载PDF
上一页 1 下一页 到第
使用帮助 返回顶部