Four process parameters, pad diameter, stencil thickness, ball diameter and stand-off were chosen as four control factors. By using an L25 （5^6 ） orthogonal array the ceramic ball grid array （ CBGA ） solder joints...Four process parameters, pad diameter, stencil thickness, ball diameter and stand-off were chosen as four control factors. By using an L25 （5^6 ） orthogonal array the ceramic ball grid array （ CBGA ） solder joints which have 25 different combinations of process parameters were designed. The numerical models of all the 25 CBGA solder joints were developed using the Sugrace Evolver. Utilizing the sugrace coordinate exported from the 25 CBGA solder joints numerical models, the finite element analysis models were set up and the nonlinear finite element analysis of the CBGA solder joints under thermal cycles were pegrormed by ANSYS. The thermal fatigue life of CBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results, the range analysis and the variance analysis were pegrormed. The results show that the fatigue life of CBGA solder joint is affected by the pad diameter, the stencil thickness, the ball diameter and the stand-off in a descending order, the best combination of process parameters results in the longest fatigue life is 0.07 mm stand-off, 0.125 mm stencil thickness of, 0.85 mm ball diameter and 0. 89 mm pad diameter. With 95% confidence the pad diameter has a significant effect on the reliability of CBGA solder joints whereas the stand-off, the stencil thickness and the ball diameter have little effect on the reliability of CBGA solder joints.展开更多
In order to improve efficiency of developing customized artificial joint, a virtual enterprise is organized based on the manufacturing grid. The application-oriented framework of the virtual enterprise is created for ...In order to improve efficiency of developing customized artificial joint, a virtual enterprise is organized based on the manufacturing grid. The application-oriented framework of the virtual enterprise is created for organization of the virtual enterprise. The manufacturing system of the virtual enterprise is built up based on the exterior grid and manufacturing subsystems of member enterprises are set up based on the interior grid. Furthermore, according to characteristic matching of manufacturing resources, the scheduling flow is studied in detail and the related scheduling strategies are established. The scheduling procedure is divided into distributed scheduling stage and local scheduling stage.Based on the manufacturing grid, the organization of the virtual enterprise for customized artificial joint and the corresponding scheduling strategies can be utilized to shorten developing cycle and reduce produce cost.展开更多
Large-capacity hydropower transmission from southwestern China to load centers via ultra-high voltage direct current(UHVDC) or ultra-high voltage alternating current(UHVAC) transmission lines is an important measure o...Large-capacity hydropower transmission from southwestern China to load centers via ultra-high voltage direct current(UHVDC) or ultra-high voltage alternating current(UHVAC) transmission lines is an important measure of the accommodation of large-scale hydropower in China. The East China Grid(ECG) is the main hydropower receiver of the west–east power transmission channel in China. Moreover, it has been subject to a rapidly increasing rate of hydropower integration over the past decade. Currently, large-scale outer hydropower is one of the primary ECG power sources. However, the integration of rapidly increasing outer hydropower into the power grid is subject to a series of severe drawbacks. Therefore, this study considered the load demands and hydropower transmission characteristics for the analysis of several major problems and the determination of appropriate solutions. The power supply-demand balance problem, hydropower transmission schedule problem, and peakshaving problem were considered in this study. Correspondingly, three solutions are suggested in this paper, which include coordination between the outer hydropower and local power sources, an inter-provincial power complementary operation, and the introduction of a market mechanism. The findings of this study can serve as a basis to ensure that the ECG effectively receives an increased amount of outer hydropower in the future.展开更多
Nanoindentation test is performed on study the plastic and creep properties of the Sn-Ag-Cu （SAC） lead-free ball grid array （ BGA ） solder joints. The dynamic hardness of two kinds of solder joints decreases with ...Nanoindentation test is performed on study the plastic and creep properties of the Sn-Ag-Cu （SAC） lead-free ball grid array （ BGA ） solder joints. The dynamic hardness of two kinds of solder joints decreases with indentation depth increase. SACO705 BiNi/ Cu exhibits a higher ultimate dynamic hardness and a smaller indentation depth than SAC305/ Cu. Then the strain hardening phenomenon of SAC305/ Cu is more obvious compared to that of SACO705 BiNi/ Cu. The indentation creep of SACO705BiNi/ Cu solder joint is lower than that of SAC305/ Cu solder joint before and after thermal shock. The creep rate sensitive index of SACBiNi/Cu solder joint is lower than that of solder joint. SACO705BiNi/Cu solder joint is superior to SAC305/Cu solder joint in the anti-creep property. The plasticity of SACOTOSBiNi/Cu and SAC305/Cu solder joints are similar. Compared with SAC305 solder, the SACO705 BiNi solder pe^forms higher hardness and solder creep resistance and still maintains a good plasticity.展开更多
Based on a method combined artificial neural network (ANN) with particle swarm optimization (PSO) algorithm, the thermo-mechanical fatigue reliability of plastic ball grid array (PBGA) solder joints was studied. The s...Based on a method combined artificial neural network (ANN) with particle swarm optimization (PSO) algorithm, the thermo-mechanical fatigue reliability of plastic ball grid array (PBGA) solder joints was studied. The simulation experiments of accelerated thermal cycling test were performed by ANSYS software. Based on orthogonal array experiments, a back-propagation artificial neural network (BPNN) was used to establish the nonlinear multivariate relationship between thermo-mechanical fatigue reliability and control factors. Then, PSO was applied to obtaining the optimal levels of control factors by using the output of BPNN as the affinity measure. The results show that the control factors, such as print circuit board (PCB) size, PCB thickness, substrate size, substrate thickness, PCB coefficient of thermal expansion (CTE), substrate CTE, silicon die CTE, and solder joint CTE, have a great influence on thermo-mechanical fatigue reliability of PBGA solder joints. The ratio of signal to noise of ANN-PSO method is 51.77 dB and its error is 33.3% less than that of Taguchi method. Moreover, the running time of ANN-PSO method is only 2% of that of the BPNN. These conclusions are verified by the confirmative experiments.展开更多
基金This work was supported by Science Foundation of Guangxi Zhuang Autonomous Region (Contract No. 02336060).
文摘Four process parameters, pad diameter, stencil thickness, ball diameter and stand-off were chosen as four control factors. By using an L25 （5^6 ） orthogonal array the ceramic ball grid array （ CBGA ） solder joints which have 25 different combinations of process parameters were designed. The numerical models of all the 25 CBGA solder joints were developed using the Sugrace Evolver. Utilizing the sugrace coordinate exported from the 25 CBGA solder joints numerical models, the finite element analysis models were set up and the nonlinear finite element analysis of the CBGA solder joints under thermal cycles were pegrormed by ANSYS. The thermal fatigue life of CBGA solder joint was calculated using Coffin-Manson equation. Based on the calculated thermal fatigue life results, the range analysis and the variance analysis were pegrormed. The results show that the fatigue life of CBGA solder joint is affected by the pad diameter, the stencil thickness, the ball diameter and the stand-off in a descending order, the best combination of process parameters results in the longest fatigue life is 0.07 mm stand-off, 0.125 mm stencil thickness of, 0.85 mm ball diameter and 0. 89 mm pad diameter. With 95% confidence the pad diameter has a significant effect on the reliability of CBGA solder joints whereas the stand-off, the stencil thickness and the ball diameter have little effect on the reliability of CBGA solder joints.
文摘In order to improve efficiency of developing customized artificial joint, a virtual enterprise is organized based on the manufacturing grid. The application-oriented framework of the virtual enterprise is created for organization of the virtual enterprise. The manufacturing system of the virtual enterprise is built up based on the exterior grid and manufacturing subsystems of member enterprises are set up based on the interior grid. Furthermore, according to characteristic matching of manufacturing resources, the scheduling flow is studied in detail and the related scheduling strategies are established. The scheduling procedure is divided into distributed scheduling stage and local scheduling stage.Based on the manufacturing grid, the organization of the virtual enterprise for customized artificial joint and the corresponding scheduling strategies can be utilized to shorten developing cycle and reduce produce cost.
基金supported by the National Natural Science Foundation of China [No.51579029]Fundamental Research Funds for the Central Universities (No. DUT19JC43)
文摘Large-capacity hydropower transmission from southwestern China to load centers via ultra-high voltage direct current(UHVDC) or ultra-high voltage alternating current(UHVAC) transmission lines is an important measure of the accommodation of large-scale hydropower in China. The East China Grid(ECG) is the main hydropower receiver of the west–east power transmission channel in China. Moreover, it has been subject to a rapidly increasing rate of hydropower integration over the past decade. Currently, large-scale outer hydropower is one of the primary ECG power sources. However, the integration of rapidly increasing outer hydropower into the power grid is subject to a series of severe drawbacks. Therefore, this study considered the load demands and hydropower transmission characteristics for the analysis of several major problems and the determination of appropriate solutions. The power supply-demand balance problem, hydropower transmission schedule problem, and peakshaving problem were considered in this study. Correspondingly, three solutions are suggested in this paper, which include coordination between the outer hydropower and local power sources, an inter-provincial power complementary operation, and the introduction of a market mechanism. The findings of this study can serve as a basis to ensure that the ECG effectively receives an increased amount of outer hydropower in the future.
基金This work was supported by National Natural Science Foundation of China （ Grant No. 51174069 and 51075107） and Research Special Funds for Technology Creative Talents of Harbin （Grant No. 2013RFQXJ166）.
文摘Nanoindentation test is performed on study the plastic and creep properties of the Sn-Ag-Cu （SAC） lead-free ball grid array （ BGA ） solder joints. The dynamic hardness of two kinds of solder joints decreases with indentation depth increase. SACO705 BiNi/ Cu exhibits a higher ultimate dynamic hardness and a smaller indentation depth than SAC305/ Cu. Then the strain hardening phenomenon of SAC305/ Cu is more obvious compared to that of SACO705 BiNi/ Cu. The indentation creep of SACO705BiNi/ Cu solder joint is lower than that of SAC305/ Cu solder joint before and after thermal shock. The creep rate sensitive index of SACBiNi/Cu solder joint is lower than that of solder joint. SACO705BiNi/Cu solder joint is superior to SAC305/Cu solder joint in the anti-creep property. The plasticity of SACOTOSBiNi/Cu and SAC305/Cu solder joints are similar. Compared with SAC305 solder, the SACO705 BiNi solder pe^forms higher hardness and solder creep resistance and still maintains a good plasticity.
基金Project(60371046) supported by the National Natural Science Foundation of ChinaProject(9140C0301060C03001) supported by the National Defense Science and Technology Foundation of Key Laboratory, China
文摘Based on a method combined artificial neural network (ANN) with particle swarm optimization (PSO) algorithm, the thermo-mechanical fatigue reliability of plastic ball grid array (PBGA) solder joints was studied. The simulation experiments of accelerated thermal cycling test were performed by ANSYS software. Based on orthogonal array experiments, a back-propagation artificial neural network (BPNN) was used to establish the nonlinear multivariate relationship between thermo-mechanical fatigue reliability and control factors. Then, PSO was applied to obtaining the optimal levels of control factors by using the output of BPNN as the affinity measure. The results show that the control factors, such as print circuit board (PCB) size, PCB thickness, substrate size, substrate thickness, PCB coefficient of thermal expansion (CTE), substrate CTE, silicon die CTE, and solder joint CTE, have a great influence on thermo-mechanical fatigue reliability of PBGA solder joints. The ratio of signal to noise of ANN-PSO method is 51.77 dB and its error is 33.3% less than that of Taguchi method. Moreover, the running time of ANN-PSO method is only 2% of that of the BPNN. These conclusions are verified by the confirmative experiments.
