Multi-source heterogeneous data access management framework and key technologies for electric power Internet of Things

The power Internet of Things(IoT)is a significant trend in technology and a requirement for national strategic development.With the deepening digital transformation of the power grid,China’s power system has initially built a power IoT architecture comprising a perception,network,and platform application layer.However,owing to the structural complexity of the power system,the construction of the power IoT continues to face problems such as complex access management of massive heterogeneous equipment,diverse IoT protocol access methods,high concurrency of network communications,and weak data security protection.To address these issues,this study optimizes the existing architecture of the power IoT and designs an integrated management framework for the access of multi-source heterogeneous data in the power IoT,comprising cloud,pipe,edge,and terminal parts.It further reviews and analyzes the key technologies involved in the power IoT,such as the unified management of the physical model,high concurrent access,multi-protocol access,multi-source heterogeneous data storage management,and data security control,to provide a more flexible,efficient,secure,and easy-to-use solution for multi-source heterogeneous data access in the power IoT.

Manufacturability and mechanical reliability study for heterogeneous integration system in display(HiSID)

In this paper,the system on display panel(SoDP)architecture,the primary stage of heterogeneous integration system in display(HiSID),is introduced for the first time.In this architecture,the driving components of display,which are supposed to be on the display flexible print circuit(FPC)in traditional architecture,are innovatively integrated onto the backside of display panel.Through the SoDP architecture,the simulated impact strain in the panel fan-out region can decrease about 30%compared to the traditional architecture,and SoDP provides more the 10 mm extra space in the in-plane Y-direction for holding a larger battery.Also,the SoDP is compatible with the current organic laser emitted diode(OLED)and system in package(SiP)processes.Besides the primary stage,this paper also presents a comprehensive and extensive analysis on the challenges of the manufacturability for the advanced stage of HiSID from four key technologies perspectives:device miniaturization,massive manufacturing,driving technology,and advanced heterogeneous integration.