We investigate the impact of heavy ion irradiation on a hypothetical static random access memory （SRAM） device. Influences of the irradiation angle, critical charge, drain-drain spacing, and dimension of device stru...We investigate the impact of heavy ion irradiation on a hypothetical static random access memory （SRAM） device. Influences of the irradiation angle, critical charge, drain-drain spacing, and dimension of device structure on the device sensitivity have been studied. These prediction and simulated results are interpreted with MUFPSA, a Monte Carlo code based on Geant4. The results show that the orientation of ion beams and device with different critical charge exert indis- pensable effects on multiple-bit upsets （MBUs）, and that with the decrease in spacing distance between adjacent cells or the dimension of the cells, the device is more susceptible to single event effect, especially to MBUs at oblique incidence.展开更多
Experimental evidence is presented relevant to the angular dependences of multiple-bit upset （MBU） rates and patterns in static random access memories （SRAMs） under heavy ion irradiation. The single event upset （...Experimental evidence is presented relevant to the angular dependences of multiple-bit upset （MBU） rates and patterns in static random access memories （SRAMs） under heavy ion irradiation. The single event upset （SEU） cross sections under tilted ion strikes are overestimated by 23.9%-84.6%, compared with under normally incident ion with the equivalent linear energy transfer （LET） value of 41 MeV/（mg/cm2）, which can be partially explained by the fact that the MBU rate for tilted ions of 30° is 8.5%-9.8% higher than for normally incident ions. While at a lower LET of - 9.5 MeV/（mg/cm2）, no clear discrepancy is observed. Moreover, since the ion trajectories at normal and tilted incidences are different, the predominant double-bit upset （DBU） patterns measured are different in both conditions. Those differences depend on the LET values of heavy ions and devices under test. Thus, effective LET method should be used carefully in ground-based testing of single event effects （SEE） sensitivity, especially in MBU-sensitive devices.展开更多
针对SRAM(Static Random Access Memory)型FPGA单粒子翻转引起软错误的问题,该文分析了单粒子单位翻转和多位翻转对布线资源的影响,提出了可以减缓软错误的物理设计方法。通过引入布线资源错误发生概率评价布线资源的软错误,并与故障传...针对SRAM(Static Random Access Memory)型FPGA单粒子翻转引起软错误的问题,该文分析了单粒子单位翻转和多位翻转对布线资源的影响,提出了可以减缓软错误的物理设计方法。通过引入布线资源错误发生概率评价布线资源的软错误,并与故障传播概率结合计算系统失效率,驱动布局布线过程。实验结果表明,该方法在不增加额外资源的情况下,可以降低系统软错误率约18%,还可以有效减缓多位翻转对系统的影响。展开更多
基金Project supported by the National Natural Science Foundation of China (Grant Nos. 11179003, 10975164, 10805062, and 11005134)
文摘We investigate the impact of heavy ion irradiation on a hypothetical static random access memory （SRAM） device. Influences of the irradiation angle, critical charge, drain-drain spacing, and dimension of device structure on the device sensitivity have been studied. These prediction and simulated results are interpreted with MUFPSA, a Monte Carlo code based on Geant4. The results show that the orientation of ion beams and device with different critical charge exert indis- pensable effects on multiple-bit upsets （MBUs）, and that with the decrease in spacing distance between adjacent cells or the dimension of the cells, the device is more susceptible to single event effect, especially to MBUs at oblique incidence.
基金supported by the National Natural Science Foundation of China(Grant Nos.11179003,10975164,10805062,and 11005134)
文摘Experimental evidence is presented relevant to the angular dependences of multiple-bit upset （MBU） rates and patterns in static random access memories （SRAMs） under heavy ion irradiation. The single event upset （SEU） cross sections under tilted ion strikes are overestimated by 23.9%-84.6%, compared with under normally incident ion with the equivalent linear energy transfer （LET） value of 41 MeV/（mg/cm2）, which can be partially explained by the fact that the MBU rate for tilted ions of 30° is 8.5%-9.8% higher than for normally incident ions. While at a lower LET of - 9.5 MeV/（mg/cm2）, no clear discrepancy is observed. Moreover, since the ion trajectories at normal and tilted incidences are different, the predominant double-bit upset （DBU） patterns measured are different in both conditions. Those differences depend on the LET values of heavy ions and devices under test. Thus, effective LET method should be used carefully in ground-based testing of single event effects （SEE） sensitivity, especially in MBU-sensitive devices.
文摘针对SRAM(Static Random Access Memory)型FPGA单粒子翻转引起软错误的问题,该文分析了单粒子单位翻转和多位翻转对布线资源的影响,提出了可以减缓软错误的物理设计方法。通过引入布线资源错误发生概率评价布线资源的软错误,并与故障传播概率结合计算系统失效率,驱动布局布线过程。实验结果表明,该方法在不增加额外资源的情况下,可以降低系统软错误率约18%,还可以有效减缓多位翻转对系统的影响。
