The Effect and Mechanism of Nano-Cu Lubricating Additives on the Electroless Deposited Ni-W-P Coating

The coating and deposition process with excellent anti wear and suitable for industrial application were developed, and the optimum bath composition and process were obtained by studying the influence of the bath composition, temperature and pH value on the deposition rate and the plating solution stability. Moreover, the tribological properties of nano-Cu lubricating additives and electroless deposited Ni-W-P coating as well as their synergistic effect are researched using ring-block abrasion testing machine and energy dispersive spectrometer. Research results show that Ni-W-P alloy coating and nano-Cu lubricating additive have excellent synergistic effect, e g, the wear resistance of Ni-W-P alloy coating （with heat treatment and the oil with nano-Cu additives） has increased hundreds times than 45 steel as the metal substrate with the basic oil, and zero wear is achieved, which breaks through the bottleneck of previous separate research of the above-mentioned two aspects.

Influence of additives and concentration of WC nanoparticles on properties of WC−Cu composite prepared by electroplating

The effects of additives(polyethylene glycol(PEG),sodium dodecyl sulfate(SDS))and WC nano-powder on the microstructure,relative density,hardness and electrical conductivity of electroplated WC−Cu composite were investigated.The preparation mechanism was also studied.The microstructure of samples was analyzed by XRD,SEM,EDS,TEM and HRTEM.The synergistic effect of PEG and SDS made the WC−Cu composite more compact during the electroplating process.The hardness of WC−Cu composites increased with the increase in WC content,while the electrical conductivity decreased with the increase in WC content.The density of samples tended to increase initially and then decreased with increase in the additive content.When the electroplating solution contained 10 g/L WC nanopowder,0.2 g/L PEG and 0.1 g/L SDS,the WC−Cu composite exhibited hardness of HV 221 and electric conductivity of 53.7 MS/m.Therefore,the results suggest that WC−Cu composite with excellent properties can be obtained by optimizing the content of additives and WC particles.

EFFECTS OF Pb COMPOUND ADDITIVES ON THE PROPERTIES OF YBa_2Cu_3O_(7-δ)

The melting temperature and critical transition temperature Tc of YBa2Cu3O7-δ with deferent content additives of PbO and BaPbO3 were studied. When PbO was doped in YBa2Cu3O7-δ, the melting temperature of YBa2Cu3O7-δ was reduced, however its superconductivity was weakened. From the XRD pattern of the sintered mixture of YBa2Cu3O7-δ and PbO, it was known that there was a reaction between YBa2Cu3O7-δ and PbO, and the product was BaPbO3. Hence different contents of BaPbO3 (10mass%, 20mass% and 30mass%) were added in YBa2Cu3O7-δ. It was proved that there were no reactions between YBa2Cu3O7-δ and BaPbO3. And the superconductivity of the mixtures was much better than that of the samples with PbO additive.

Toxicity of Cu and Cd in Soils and Detoxication by Additives

Results from laboratory experiments indicated that the concentrations and toxicities of both water-soluble and 0.1 M HCl-extractable Cu and Cd from soils were in the order of red soil> yellow brown earth> black earth.The toxicity of soil varied with the concentrations of metals.The form,concentration and toxicity of Cu and Cd in soils were determined by cation exchange capacity,content of organic matter and composition of clay minerals in the soil.Addition of CaCO3 could significantly decrease the concentration and toxicity of water-soluble and 0.1 M HCl-extractable Cu or Cd from the red soil,and could notably transform the Cu and Cd from the water-soluble or exchangeable form into the organic,free oxides-occluded or sulfic form.

Effects of Cu addition on microstructure and mechanical properties of as-cast magnesium alloy ZK60

The effects of Cu addition on the microstructure and mechanical properties of the as-cast magnesium alloy ZK60 were investigated with optical microscope, SEM, TEM, XRD, EPMA and tensile tester. The mechanism by which the mechanical properties are affected by Cu addition was discussed. The results show that Cu can effectively eliminate the intragranular solute segregations in the alloy, and the grain size of the alloy is decreased considerably with increasing the Cu amount. A ternary eutectic phase MgZnCu with a face-centered cubic structure is identified in the Cu-bearing alloys, which predominantly distributes at the grain boundary and acts as the nucleation sites of microcracks during the plastic deformation process. It is also found that the tensile properties of the alloy firstly increase by the trace addition of 0.5%-1%Cu and then decrease by a further addition up to 2.0%.

g-C_(3)N_(4)锚定Cu(Ⅰ)高选择性催化CCl_(4)合成2,4,4,4-四氯丁腈

以尿素和Cu(NO_(3))_(2)·3H_(2)O为前体,采用热缩合法制备了不同Cu负载量的氮化碳(g-C_(3)N_(4))基催化剂Cu/CNn(n=1、2、3),采用X射线衍射仪、傅里叶变换红外光谱、X射线光电子能谱、比表面积测试、扫描电子显微镜及透射电子显微镜对其结构和形貌进行了表征,比较了不同Cu负载量的Cu/CNn催化CCl_(4)与丙烯腈(AN)的原子转移自由基加成(ATRA)反应合成2,4,4,4-四氯丁腈(TBN)的催化性能。结果表明,Cu/CN1呈现优异的催化性能,以乙腈(MeCN)为溶剂,n(Cu/CN1)∶n(AN)=1∶1000,120℃反应12h,TBN的选择性可达96.5%,产率可达83.3%,Cu/CN作为多相催化剂,经过滤处理便可重复利用,使用7次其催化活性仍能稳定保持。基于相关的实验结果,提出了Cu/CN催化CCl_(4)和AN的ATRA反应的氧化-还原循环机理。实验结果揭示了Cu与g-C_(3)N_(4)载体的协同作用机制,为CCl_(4)深加工开发高效的催化体系提供了新的思路。

Effects of Cu addition on microstructureand mechanical properties of as-cast Mg-6Znmagnesium alloy

The application of Mg-Zn binary alloys is restricted due to their developed dendritic microstructure and poor mechanical properties. In this study, an alloying method was used to improve the mechanical properties of Mg-Zn alloy. The Mg-6Zn magnesium alloys microalloyed with varying Cu content(0, 0.8, 1.5, 2.0 and 2.5wt.%) were fabricated by permanent mould casting, and the effects of Cu content on the microstructure and mechanical properties of as-cast Mg-6Zn alloys were studied using OM, SEM, XRD and tensile tests at room temperature. The obtained results show that the addition of Cu not only can refine the grains effectively, but also can modify the eutectic morphology and improve the mechanical properties of the alloys. The main phases of the studied alloys include α-Mg, MgZn_2, Mg_2Cu and CuMgZn. When the content of Cu exceeds 0.8wt.%, Mg_2Cu phase appears. Meanwhile, the eutectic morphology is modified into dendritic shape or lamellar structure, which has an adverse effect on the tensile properties. Furthermore, among the investigated alloys, the alloy containing 0.8% Cu shows an optimalultimate tensile strength of 196 MPa, while the alloy with 1.5wt.% Cu obtains an excellent elongation of 7.22%. The experimental alloys under different Cu contents show distinguishing fracture behaviors: the fracture of the alloy with 0.8wt.% Cu reveals a mixed mode of inter-granular and quasi-cleavage, while in other investigated alloys, the fracture behaviors are dominated by cleavage fracture.

Effects of Si addition on microstructure, mechanical and thermal fatigue properties of Zn-38Al-2.5Cu alloys

The influence of Si addition on microstructure, mechanical properties and thermal fatigue behavior of Zn-38Al-2.5Cu alloys was investigated. The results show that constitutional supercooling of ZA38 alloys is formed because of the Si addition. Zn-38Al-2.5Cu-0.55Si alloy shows the dramatically refined microstructure and the best mechanical properties. When the Si addition exceeds 0.55%,αdendrites develop and Si phases become larger and aggregate along the dendrites boundaries, decreasing the mechanical properties. Oxides and pits formed by the plastic deformation are the main factors of cracks initiation. During the early stage of crack propagation, the cracks grow at a high speed well described by Paris law because of the porous and loose oxide, and mainly propagate along the dendrites boundaries. During the slow-growth stage, secondary cracks share the energy of crack growth, delaying the propagation of cracks, and the cracks propagate and fracture by the mixture of intergranular and transgranular modes.

Effect of Cu additive on the structure and magnetic properties of (CoPt)_(1-x)Cu_x films

CoPt thin films with various Cu contents varying from 0 vol.% to 21.5 vol.% were deposited on glass substrates by magnetron sputtering. The effects of Cu additive on the structural and magnetic properties and the ordering temperature of CoPt films were investigated in detail. The results show that the Cu in CoPt films plays an important role in promoting the ordering parameter S and reducing the ordering temperature of CoPt films. A nearly perfect （001） texture was obtained in a CoPt film doped with 15.3 vol.% Cu. Besides, the preferred orientation of the CoPt film can be changed by annealing temperature. The perpendicular growth of the CoPt film is favored at a high annealing temperature.

Effects of Ag addition on mechanical properties and microstructures of Al-8Cu-0.5Mg alloy

The mechanical properties and microstructures of Al-8Cu-0.5Mg alloy with and without Ag addition were studied at both room- and elevated-temperatures. The results show that the alloy with Ag is strengthened by a homogeneous distribution of coexistent θ′ and ? precipitates on the matrix (001) and (111) planes, respectively, whereas the alloy without Ag by θ′ precipitates only. The small size and high volume fraction of θ′ and ? precipitates in the Ag-containing alloy improve the tensile strength and yield strength, especially those at the elevated temperatures. However, it is also responsible for the decrease in elongation, compared with the alloy without Ag, which is due to the microcracks initiated from the inherent incompatibility between the particles and the Al matrix during deformation.

Influence of Cerium Addition on Microstructure and Properties of Cu-Ag Alloy in Situ Filamentary Composites

The in situ filamentary composites based on the Cu-10Ag and Cu-10Ag-Ce alloys were prepared. The microstructure and properties of the composites were studied. The effects of Ce addition on the microstructure as cast, including refining Cu grains and the Ag filaments, increasing the proportion of (Cu+Ag) eutectic and decreasing the proportion of the Ag precipitate, were researched. The average size of the Ag filaments in the composites could be approached by a formula: d=C·exp(-0.228η), here C is a coefficient related to the size of the original grains and 1500 nm for Cu-10Ag and 800 nm for Cu-10Ag-Ce. A two-stage strain strengthening effect was found for the deformed composites, that is the dislocation strengthening at low strain stage and the ultra-fine Ag filaments or interface strengthening at the high strain stage. The intermediate heat treatment at lower temperature further refined the Ag filaments and therefore improved the properties. The high strengthening rate of Ce addition on Cu-10Ag alloy attributed the refining effect to Cu grains and Ag filaments. The typical properties of the heavy deformed composites with 1 IHT reached to UTS=1500 MPa with conductivity 62% IACS for the Cu-10Ag alloy and UTS=1550 MPa with conductivity 65% IACS for the Cu-10Ag-Ce alloy, respectively.

Effects of Ag addition on the microstructures and properties of Al–Mg–Si–Cu alloys

Effects of Ag addition on the microsmactures, aging characteristics, tensile properties, electrochemical properties, and intergranu- lar corrosion （IGC） properties of Al 1.1Mg-0.8Si-0.9Cu-0.35Mn4）.02Ti alloy were investigated using scanning electronic microscopy and transmission electronic microscopy. The aging process of Al-Mg-Si-Cu alloys was accelerated by the addition of Ag. The strength of peak-aged Al-Mg-Si-Cu alloys was enhanced by Ag addition because of the high density of β＂- and L-phase age-hardening precipitates. The corrosion performance of the Al-Mg-Sii-Cu alloy is closely related to the aging conditions and is independent of the Ag content. The IGC susceptibility is serious in the peak-aged alloy because of the continuous distribution of Cu-rich Q-phase precipitates along grain boun- daries. Ag addition reduces the size of the grain-boundary-precipitate Q phase and the width of the precipitate-free zone and thus results in decreased IGC susceptibility of Al-Mg-Si Cu alloys.

Effect of Ni addition on microstructure and mechanical properties of Al–Mg–Si–Cu–Zn alloys with a high Mg/Si ratio

The effect of adding 0.03wt%Ni on the microstructure and mechanical properties of Al–Mg–Si–Cu–Zn alloys was systematically studied.The results reveal that the number density of spherical Fe-rich phases within grains increases with the addition of Ni,accompanied by the formation of Q(Al3Mg9Si7Cu2)precipitates around the spherical Fe-rich phases.Additionally,Ni addition is beneficial to reducing the grain size in the as-cast state.During the homogenization process,Q phases could be completely dissolved and the grain size could remain basically unchanged.However,compared with the Ni-free alloy,the Fe-rich phase in the Ni-containing alloy is more likely to undergo the phase transformation and further form more spherical particles during homogenization treatment.After thermomechanical processing,the distribution of Fe-rich phases in the Ni-containing alloy was further greatly improved and directly resulted in a greater formability than that of the Ni-free alloy.Accordingly,a reasonable Ni addition positively affected the microstructure and formability of the alloys.

Effect of Cd and Sn Addition on the Microstructure and Mechanical Properties of AI-Si-Cu-Mg Cast Alloy

The present work has investigated the effect of trace elements Cd and Sn on the microstructure and mechanical properties of Al-Si-Cu-Mg cast alloy. With the increase of Cd addition the strength of alloy rises at first and then drops. The optimal amount of Cd and Sn addition for Al-Si-Cu-Mg alloy is about 0.27% and 0.1% respectively. Due to the formation of some coarse Cd-rich phases and pure Cd particles the mechanical properties of alloy decrease when Cd amount exceeds 0.27%. When more than 0.1% Sn added, some Sn atoms form low-melting eutectic compound at grain boundary, and then cause over-burning in alloy when solution treated, which may deteriorate properties of alloy, especially ductility of alloy. On the other hand, the addition of Cd and Sn remarkably increases the peak hardness and reduces the time to reach aging peak in Al-Si-Cu-Mg alloy. The action of Cd /Sn in quaternary Al-Si-Cu-Mg alloy is effectively the same as that occur in binary Al-Cu alloy that the enhanced hardening associated with Cd / Sn addition is due to the promotion of the 6’ phase.

Effects of Cu and Co additions on the crystallization and magnetic properties of FeNbB alloy

The nanocrystalline-forming element Cu and magnetic element Co are commonly used as additive elements to tune the structure and improve the properties of alloys.In this study,four kinds of amorphous alloys,Fe_(72)Nb_(12)B_(16),Fe_(72)Nb_(12)B_(15)Cu_(1),Fe_(36)Co_(36)Nb_(12)B_(16),and Fe_(36)Co_(36)Nb_(12)B_(15)Cu_(1),were prepared by melt-spinning and annealed at various temperatures to investigate the effects of Cu and Co additions,individually and in combination,on the crystallization and magnetic properties of Fe_(72)Nb_(12)B_(16)alloy.The four kinds of alloys exhibited different crystallization behaviors with different primary crystallization phases observed.For the Fe_(72)Nb_(12)B_(16)alloy,only theα-Mn-type metastable phase formed after annealing.The addition of 1 at.%Cu and 36 at.%Co led to the observation of theα-Mn-type andβ-Mn-type metastable phases,respectively,and a reduction in the crystallization volume fraction in the metastable phase.The Fe_(36)Co_(36)Nb_(12)B_(15)Cu_(1)alloy only exhibitedα-Fe(Co)phase as a primary phase,and the addition of both Cu and Co completely inhibited the precipitation of the metastable phase.Cu clusters were found in energy dispersive spectroscopy elemental maps.Compared with other alloys,Fe_(36)Co_(36)Nb_(12)B_(15)Cu_(1)alloy with both Cu and Co exhibited a lower coercivity(Hc)below 973 K.

Electrolyte additive enhances the electrochemical performance of Cu for rechargeable Cu//Zn batteries

Cu-based cathodes in aqueous batteries become very attractive in view of high theoretical capacity,moderate operation voltage and rich reserves of raw materials.However,their applications are obstructed by serious side reactions.The side reaction mainly arises from the spontaneous formation of Cu_(2)O,which occupies the electrode surface and lowers the reaction reversibility.Here,Na_(2)EDTA is introduced to address these issues.Both experimental results and theoretical calculations indicate that the Na_(2)EDTA reshapes the solvation structure of Cu^(2+)and modifies the electrode/electrolyte interface.Therefore,the redox potential of Cu^(2+)/Cu_(2)O is reduced and the surface of Cu is protected from H2O,thereby inhibiting the formation of Cu_(2)O.Meanwhile,the change in the solvation structure reduces the electrostatic repulsion between Cu^(2+)and the cathode,leading to high local concentration and benefiting uniform deposition.The results shed light on the applications of rechargeable Cu-based batteries.

激光-电弧复合增材制造Al-Cu合金T型结构微观组织演变与熔池流动行为分析

在T型结构增材制造过程中,交叉节点处易出现冶金结合不良及重熔缺陷等问题,制约该结构性能的提升。采用激光-电弧复合增材制造技术制备了Al-Cu合金T型结构,对交叉节点处的组织形貌进行了表征,并通过数值模拟分析了节点处熔池内的温度分布以及流动特征。结果表明,在T型结构节点处能够观察到重熔作用所导致的弧形条纹特征,该区域的模拟形貌与实际结果具有良好的一致性;熔池边界处等温线分布较为密集,内部Marangoni对流导致逆时针涡流的形成,最高流速可达0.16 m/s。依据顶层晶粒形态差异,分为顶层节点重熔区(RZI)和顶层热影响区(HAZ)。其中RZI内主要为细小的树枝晶,平均晶粒尺寸相比于HAZ降低了20.8%,内部析出相主要为与α-Al基体呈非共格界面的大尺寸θ(Al_(2)Cu)相;平均显微硬度可达(98.4±6.4)HV_(0.1),相比于未重熔区最高提升约14.0%。

SYNTHESIS AND STRUCTURE OF Cu(Ⅱ)COMPLEXES BY OXIDATIVE ADDITION OF DIBENZOYL PEROXIDE ON METALLIC COPPER

Dibenzoyl peroxide undergoes oxidative addition on metallic copper powder with 2,2′-bipyridine(or imidazole)in a mixed solvent(methanol and tetrahydrofuran),and affords the Cu(Ⅱ)complexes-[Cu(Ce(C_6H_5COO)_2(2,2'-bipy)]H_2O(1) and[Cu(C_6H_5COO)_2(C_3H_4N_2)_2](2).The structure was solved by direct methods and Fourier synthesis.C_(24)H_(20)N_2O_5Cu (1),Mr=479.78,space group P2(1)/c,a=6.986(7), b=18.833(I),c=17.021(3),α=γ=90°,Z=4,V=2218.1~3,Dc=1.443g/cm\+3,R=0.055 Rw=0.062.Complex(2),C_(20)H_(18)N_4O_4Cu(2),Mr=441.74,space group P2(1)/n,a=8.699(4), b=9.840(6),c=12.399(5),α=γ=90°,β=100.8°,Z=4,V=1010.9~3,Dc=1.654g/cm\+3,R=0.055, Rw=0.062.

助剂Ni对Cu(111)表面催化NH_(3)还原NO反应影响的理论研究

针对商用钒钛脱硝催化剂存在的环境污染和易中毒问题,采用无毒环保的单金属铜催化剂并使用助剂Ni掺杂提高其脱硝性能。基于密度泛函理论(DFT),探究了助剂Ni对Cu(111)表面催化NH_(3)还原NO反应的影响。通过分析催化剂表面反应物种的吸附、反应机理和电子结构,对比了助剂Ni掺杂前后Cu(111)表面的催化活性。结果表明,所有反应物种在CuNi(111)表面上的吸附效果均优于在Cu(111)表面的吸附效果。CuNi(111)表面发生的三步基元反应需克服的能垒均低于Cu(111)表面,其中,速控步骤(NH_(2)NO→N_(2)+H_(2)O)的能垒降低了63.6 kJ/mol,可见CuNi(111)表面催化活性明显较高。相比Cu(111)表面,CuNi(111)表面的d带中心更靠近费米能级,说明助剂Ni的掺杂增强了Cu(111)表面电子的活跃性,从而提高了其催化活性。

Electronic Structure Effect on Model Cluster for L1_2 Structure of Al_3Ti Intermetallic Compound with an Addition of Alloying Elements Fe, Ni and Cu

By use of self-consistent field Xα scattered-wave (SCF-Xα-SW) method, the electronic structure was calculated for four models of Ti4Al14X (X=Al, Fe, Ni and Cu) clusters. The Ti4Al14X cluster was developed based on L12 Al3Ti-base intermetallic compound. The results are presented using the density of states (DOS) and one-electron properties, such as relative binding tendency between the atom and the model cluster, and hybrid bonding tendency between the alloying element and the host atoms. By comparing the four models of Ti4Al14X cluster, the effect of the Fe, Ni or Cu atom on the physical properties of Al3Ti-based L12 intermetallic compounds is analyzed. The results indicate that the addition of the Fe, Ni or Cu atom intensifies the relative binding tendency between Ti atom and Ti4Al14X cluster. It was found that the Fermi level (EF) lies in a maximum in the DOS for Ti4Al14Al cluster; on the contrary, the EF comes near a minimum tn the DOS for Ti4Al14X (X=Fe, Ni and Cu) cluster. Thus the L12 crystal structure for binary Al3Ti alloy is unstable, and the addition of the Fe, Ni or Cu atom to Al3Ti is benefical to stabilize L12 crystal structure. The calculation also shows that the Fe, Ni or Cu atom strengthens the hybrid bonding tendency between the central atom and the host atoms for Ti4Al14X cluster and thereby may lead to the constriction of the lattice of Al3Ti-base intermetallic compounds.