Application of face centred cubic TiB powder as conductive filler for electrically conductive adhesives

Face centred cubic（FCC） TiB ceramic powder synthesized by Ti-boronizing method was used as conductive filler to make ceramic electrically conductive adhesives（ECAs） with the polymer matrix.Electrically conductive properties of the ceramic ECAs were studied.The bulk electrical resistivity varied with the powder content of the FCC-TiB in ECAs.The FCC-TiB filled ECAs also showed the percolation behavior that usually occurred for the metal-filled ECAs,the percolation threshold was located at the content of 60%FCC-TiB.A minimum value of 0.1 Ω·cm was obtained at a content of 75%FCC-TiB.In order to check the reliability of mechanical property,tensile test was done to measure the shear strength,and the shear strength dropped with increasing the content of FCC-TiB powders.It is about 12.26 MPa at the content of 70%TiB powders.The Cu filled ECAs were also prepared for comparison.The properties of the oxidation resistance of the two ECAs were evaluated.The results show that the ceramic ECAs have excellent oxidation resistance and better stability compared with the Cu filled ECAs.

A Prediction Model of Effective Thermal Conductivity for Metal Powder Bed in Additive Manufacturing

In current research,many researchers propose analytical expressions for calculating the packing structure of spherical particles such as DN Model,Compact Model and NLS criterion et al.However,there is still a question that has not been well explained yet.That is:What is the core factors affecting the thermal conductivity of particles?In this paper,based on the coupled discrete element-finite difference(DE-FD)method and spherical aluminum powder,the relationship between the parameters and the thermal conductivity of the powder(ETC_(p))is studied.It is found that the key factor that can described the change trend of ETC_(p) more accurately is not the materials of the powder but the average contact area between particles(a_(ave))which also have a close nonlinear relationship with the average particle size d_(50).Based on this results,the expression for calculating the ETC_(p) of the sphere metal powder is successfully reduced to only one main parameter d_(50)and an efficient calculation model is proposed which can applicate both in room and high temperature and the corresponding error is less than 20.9%in room temperature.Therefore,in this study,based on the core factors analyzation,a fast calculation model of ETC_(p) is proposed,which has a certain guiding significance in the field of thermal field simulation.

Preparation of PbTiO_3 Conductive Powders and Coatings

La2O3 and Ce2O3 were penetrated into PbTiO3 to obtain conductive powders, and then they were mixed with polyurethane and butyl acetate to prepare conductive coatings. The results showed that the electric property of modified PbTiO3 powders was improved by penetration of La2O3 and Ce2O3. XRD patterns showed that some new compounds such as La2Ti6O15, CeTi21O38 and Pb0.634La0.209Ti0.948O2.284 were formed, which led to the rapid increase of conductivity. The resistivity of modified PbTiO3 powders decreased to 3.88 Ω·m. The coatings using modified PbTiO3 powders as fillings also had a good conductivity. When the PbTiO3 powders were 10% and antisettle agent (bentonite) content was 0.50%, and mass ratio between polyurethane and butyl acetate was 1.05, the surface resistivity of the coatings fell down to 1.3×108 Ω·m. This kind of conductive coatings could be used in electromagnetic shielding.

Preparation of rare-earth-modified medical stone powders and their application as conductive fillers

Traditional metal conductive fillers are expensive and prone to oxidation. Thus, the development of new conductive powders as fillers is urgently needed. A novel gaseous penetration technology was adopted to prepare La-doped medical stone powders(La-MSPs), which are inexpensive mesoporous materials, as a new kind of conductive filler material. The prepared La-MSPs attained a resistivity of 450 ?·m and were used as a filler to prepare conductive coatings with epoxy resin as the resin matrix. The influence of the La-MSPs dosage on the resistance and hardness of the coatings was also determined. The resistance and the hardness both decreased with increasing filler dosage. Finally, the optimum recipe of the conductive coatings with the most suitable fillers dosage(55 wt%) was obtained. The hardness and resistance of the coatings with 55 wt% La-MSPs were HV 4 and 5.5 × 10~7 ?, respectively.

Effect of Curing Procedure on the Properties of Copper-Powder-Filled Conductive Adhesives

By means of testing the shear strength with single lap joint, measuring electrical resistivity for cured products and the curing strain with strain gauges, the effect of cure parameters on the properties of HT1012 conductive adhesive filled with copper powder was investigated, and the residual stress in the conductive adhesives was also estimated. The experimental results show that the properties such as shear strength of the adhesives, electrical resistivity of products as well as the residual stress of cured HT 1012 copperfitted conductive adhesive were evidently affected by curing temperature and time. The diagrams of scanning electron microscopy （SEM） and Fourier transform infrared （FT-IR） were also used to determine the properties. The higher mechanical property was achieved under the condition of curing the adhesive 3 h at 60 ℃ as the density of the hydrogen links or linkages existed in the adhesive was relatively higher and the lower electrical resistivity occurred at 80 ℃.

Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives

The electrochemical migration (ECM) behavior of the electrically conductive adhesives (ECAs) filled with pure Ag powder or Ag-plated Cu composite powder with varied Ag:Cu ratios was investigated under the condition of applying constant voltage and distilled water environment.ECM resistance was determined from the current-time curves.The microstructure and composition of ECM dendrite products were analyzed by SEM/EDS and XRD.It was found that the ECM resistance of Ag-plated Cu composite powder-filled ECAs was evidently higher than that of pure Ag powder-filled ECAs.The Ag:Cu ratio of composite powder in ECAs had notable influence on ECM resistance,which was enhanced with the decrease of Ag:Cu ratios.The composition of dendrites formed between cathode and anode during ECM process was not uniform for Ag-plated Cu-filled ECAs.An ECM inhibiting mechanism of Ag-plated Cu composite powder was proposed according to analysis of the electrochemical impedance spectroscopy,Tafel plot and dendrite composition.

碳纤维和EPS颗粒对RPC性能的影响

研究了不同掺量(0、0.2%、0.3%、0.4%、0.5%、1.0%)的碳纤维(CF)全取代钢纤维(SF)对活性粉末混凝土(RPC)工作性的影响,优选出了适宜CF掺量;在此基础上,研究了EPS颗粒掺量(10%、20%、30%、40%、50%)对掺CF的RPC(CF-RPC)工作性、力学性能、干表观密度和导热系数的影响,并与同EPS颗粒掺量条件下掺SF的RPC(SF-RPC)性能进行了对比。结果表明:CF的适宜掺量为0.3%;随着EPS颗粒掺量的增加,CF-RPC试件的扩展度先增大后减小,抗压强度、抗折强度、干表观密度和导热系数均降低,韧性提升;与掺EPS的SF-RPC试件相比,掺EPS的CF-RPC试件的抗压强度较低,但韧性较好,干表观密度和导热系数均较低。

直流电下导电沥青混凝土非线性导电行为研究

导电沥青混凝土中非线性导电行为的导电机制尚不明确。基于实验室制备的碳纤维(CF)–碳纤维粉(CFP)导电沥青混凝土,通过测试外力场对导电沥青混凝土电阻率的关系,结合线性随机电阻网络模型、动态随机电阻网络模型和非线性随机动态电阻器模型,研究导电沥青混凝土非线性导电行为,明确非线性导电行为的导电机制。结果表明:随着碳纤维掺量、油石比和压力的增加,电阻率呈现明显且相似的非线性下降趋势,其中,碳纤维粉掺量的增加导致电阻率先下降后上升;不同掺量的导电沥青混凝土伏安特性曲线均呈现非线性特征;在强电场作用下,导电相材料本身的非线性导电行为和绝缘态部分载流子通道导通引起的非线性导电行为共同导致了碳纤维–碳纤维粉导电沥青混凝土的非线性导电行为,并证明在电场作用下导电沥青混凝土存在隧道效应。

ATO-TiO_(2)浅色导电粉体的可控制备及性能研究

浅色导电材料因其较低的电阻率,优异的装饰特质迅速发展,运用在传感、电子信息、机械制造、通讯、电磁屏蔽等诸多领域。锑掺杂二氧化锡和二氧化钛(ATO-TiO_(2))纳米复合材料不仅具有半导体性质,并且颜色浅、可染性好,同时具有优异的化学稳定性和热稳定性。然而其制备过程中容易团聚,导致导电性能较差。因此,制备过程中均匀分散,同时兼具优异的导电性能是目前研究需要迫切解决的科学问题。采用共沉淀的方法,制备了ATO-TiO_(2)浅色导电材料,分析了包覆复合过程中不同改性剂、Sb_(x)Sn_(1-x)O_(2)∶TiO_(2)复合比和干燥方式对ATO-TiO_(2)浅色导电材料的物相组成、微观形貌、电学性能等微观结构形貌及宏观理化性能的影响,实现了可控制备并得到了最佳制备的工艺路线。

基于骨架结构设计的高性能W10Cu材料制备及表征

用商用不规则W粉和球形W粉压制W骨架坯,经1800~2000℃真空烧结制备W骨架,在H_(2)气氛1350℃下熔渗Cu获得高致密W10Cu复合材料。结果表明:等离子球化W粉团聚消失,流动性更好,松装密度提升82%,相同压力下压坯密度提升15%。用球形W粉制备的W骨架可保持低的W-W连接度及良好的通孔率,为熔渗提供高品质骨架材料。W骨架经熔渗4h后获得W10Cu块体材料,其室温拉伸强度为680MPa,电导率为1.856S/m,比商用W10Cu的拉伸强度、电导率分别提升了41%、28%,可归因于低W-W连接度、Cu相良好的网状结构、Cu对W颗粒的包覆协同作用结果。本研究中新型低W-W连接度骨架结构设计可为高比重W、高通孔率W-Cu材料设计与开发提供思路。

俄歇电子能谱测试中非导电粉末样品的荷电效应及消除方法

俄歇电子能谱在分析绝缘样品时,要得到正确的谱图,荷电效应是一个重要的影响因素。本文选取Al_(2)0_(3)粉末为例,提出了俄歇电子能谱分析Al_(2)0_(3)粉末样品的制样方法,通过对比几种减少荷电效应的实验,选取了以覆盖铝导电膜的方法进行实验。此方法流程简便、高效,降低了因荷电效应的影响,通过对Al203的标准摩尔比进行匹配,得到了比较好的匹配度。此方法检测结果较好。

再生砂粉基发泡混凝土性能研究

利用筑垃圾破碎后筛分出的再生砂粉细骨料制备设计密度等级为A11的发泡混凝土,研究了再生砂粉及泡沫掺量等因素对发泡混凝土力学性能、干密度及导热系数等性能的影响规律。研究结果表明,随着再生砂粉掺量的增加,发泡混凝土干密度在1086.1~1172.3 kg/m^(3),抗压强度等级从FC5下降到FC2,导热系数均≤0.27 W/(m·K);再生砂粉基发泡混凝土的抗压强度、干密度和导热系数随泡沫掺量的增加均呈现下降趋势。其中干密度等级从A13减小到A9,当泡沫掺量在7%时,抗压强度仅为0.6 MPa;对比分析再生砂粉取代率和泡沫掺量对发泡混凝土吸水率的影响规律,其吸水率均随着两者掺量的增加而增大,但泡沫掺量对其影响更为显著;此外,通过强度-成本比率,确定密度等级为A11的再生砂粉基发泡混凝土,即再生砂粉取代率为20%时,单位成本下获得的RSPFC抗压强度最高。

高功率半导体用纳米银焊膏的研究现状

第3代半导体作为核心部件,使得更紧凑、高频率、高功率的电子器件在射频和微波电子、能源转换与储存、雷达和通信等领域展现出广泛的应用潜力。然而,高性能电子器件对其封装材料的导电性、导热性以及连接处的机械性能提出了更为严格的要求。纳米银焊膏因其卓越的低温烧结性能和在高温环境下的出色表现引起了广泛关注。然而,国内银粉和银焊膏产品的质量相对较低,且研发过程缺乏理论指导,必须依赖进口材料。基于高功率半导体用纳米银焊膏,综述了通过液相化学还原法合成纳米银粉的研究进展,以及纳米银焊膏的烧结机理、影响其性能的因素和控制方法,有望为国内纳米银焊膏的研发和生产提供有益的指导和支持。

石化储罐水性导静电防腐涂料制备及性能研究

为解决石化储罐在储存、运输过程可能由于积聚电荷产生的安全隐患,以及水性导静电涂料耐腐蚀性差的问题,以环氧类乳液及导电云母粉为主要原料制备导静电涂层,通过水热法制备了碳纳米点,将其以不同比例添加,增强涂层的防腐性能。并对涂层进行耐化学浸泡实验、耐盐雾实验以及力学性能测试。结果表明选用浙江安邦新材料发展有限公司的环氧乳液A与固化剂A作为成膜物,导电云母粉质量含量为15%,碳纳米点质量含量为1%的涂层表现最为良好。

镍粉/碳纤维复合导电沥青胶浆的电热性能

基于电阻率、升温速率、车辙因子和劲度模量等指标优选出镍粉/碳纤维复合导电沥青胶浆Ni-CF-2,研究了其电性能和热性能,并根据其内导电材料微观分布研究其导电机理。结果表明,Ni-CF-2在交流电下的电流值显著大于直流电,但非线性伏安特性离散性较大,且同时存在温敏效应和压敏效应;10 mm厚Ni-CF-2的导热系数比基质沥青高18.8%,通电时热量呈现层状的均匀分布,20 min内升温幅度达50℃以上,并具有良好切缝愈合能力;Ni-CF-2试样由导电颗粒的接触或电子跃迁形成导电通路。

一种无溶剂型电子封装用导电胶的研制

为了解决导电胶黏剂因综合性能不足而导致大规模应用的受限,本文以酚醛环氧、多官能环氧为导电胶树脂基体,选用了4,4′-二氨基二苯砜(DDS)作为固化剂,片状银粉作为导电填料,通过调节银粉和固化剂的用量,制备了有良好流变性、导电性、力学性能的导电胶。通过分析测试,得到导电胶的黏度为32 800 mPa·s,触变指数为4.0,体积电阻率为4.34×10^(-4)Ω·cm,剪切强度为17 MPa,热导率为3.96 W/(m·K),Cl^(-)、Na^(+)和K^(+)分别仅为6.79×10^(-5)、6.31×10^(-5)和<10^(-5)。该导电胶综合性能优异,可应用于电子元器件及其他导电导热功能性材料的粘接。

化学还原法制备银粉及其在导电胶中的应用

研究化学还原法制备银粉过程中Ag~+浓度、还原液滴加方式、分散体系对银粉形貌的影响机理,获得一款适合用于导电胶制备的银粉。采用硝酸银为银源,分别以明胶、阿拉伯树胶以及聚乙烯吡咯烷酮(简称PVP)和明胶混合体系作为分散剂,研究不同分散体系对银粉形貌及粒径等性能。结果表明银粉粒径随着溶液中Ag~+浓度升高呈现变大趋势;不同分散体系制备的银粉形貌差别较大,而粒径差别不大。以明胶为分散剂制备的银粉为规则的球状,以阿拉伯树胶为分散剂制备的银粉为规则的片簇状,以PVP和明胶混合体系作为分散剂制备的银粉形貌为球状与片状的混合。还原液加入方式对银粉粒径也有较大影响,以一次加入方式制备的银粉粒径分布范围较大。此外,银粉粒径随反应温度升高呈现逐渐变大的趋势。通过对比发现最适合用于导电胶制备的银粉为用以阿拉伯明胶单分散体系制备的球状银粉。化学还原法制备银粉过程中,溶液中Ag^(+)浓度、还原液滴加方式以及分散体系均对银粉形貌和粒径有不同程度的影响,用不同形貌的银粉制备导电胶时的体积电阻率有差别。

Nb元素对铜-金刚石复合材料界面改性的研究

采用粉末冶金法制备铜/金刚石复合材料,研究不同含量活性元素Nb对铜界面改性的影响机制以及对铜/金刚石复合材料的热导率的影响,利用XRD、SEM、EDS和导热系数测定仪分析复合材料的界面和热导率。结果表明,随着Nb含量的添加,能够在烧结过程中形成碳化物界面层,铜和金刚石界面缺陷逐渐减少,界面结合逐渐转好。在1%的含量时,复合材料的热导率达到370.3 W/(m·K),相比纯铜/金刚石复合材料提高1.34倍,但当含量超过1 vol.%,碳化铌中间层变厚,由于碳化铌自身热导率较低,导致复合材料的热导率降低。

氮化硼、贝壳粉对聚乳酸材料结晶性能与导热性能的影响

以聚乳酸(PLA)为原料,选用氮化硼(boron nitride,BN)与贝壳粉作为提高PLA导热性能的功能粉体,采用熔融共混的方法制备具有高导热性能的BN/PLA和贝壳粉/PLA复合材料,研究功能粉体质量分数为0.5%、1.0%、1.5%时复合材料的结晶性能与导热性能的变化。利用差示扫描量热仪(DSC)分析了复合材料的结晶度和在不同结晶条件下的半结晶时间(t_(1/2));通过万能拉伸机测试复合材料的力学性能;通过扫描电子显微镜观察拉伸断面的形貌特征;使用导热系数测试仪测试添加不同质量分数无机粉体的复合材料的导热系数。结果表明:在加入BN与贝壳粉后,试样的结晶度分别提高至18.8%和15.3%;在温度为105℃的条件下,添加质量分数为1.5%的BN与贝壳粉分别能使BN/PLA和贝壳粉/PLA的t_(1/2)降低到0.33和0.39 min;随着功能粉体质量分数的增加,复合材料的导热系数逐渐上升,并且相对于单一功能粉体,BN与贝壳粉的复配粉体对PLA导热性能的提高效果更加显著,由0.177 W/(m·K)最高升至0.319 W/(m·K)。研究结果为后续制备凉感纤维提供参考。

粉体还原对硒化亚铜热电性能的影响

硒化亚铜(Cu_(2)Se)作为一种典型的类液体热电材料,不仅拥有较好的电传输性能,而且具有较低的晶格热导率。纳米工程是实现热电材料高热电性能的有效手段,然而在合成纳米级Cu_(2)Se颗粒时,材料极其容易被氧化,从而影响其热电性能。为了研究粉体还原对Cu_(2)Se热电性能的影响,本文用水热法合成了纳米尺度的Cu_(2)Se粉体,分别采用氢氩混合气(氢气体积分数为5%)和纯氩气吹扫粉体,并结合放电等离子烧结技术制备了致密度95%以上的Cu_(2)Se块体材料。结果表明,粉体还原后,Cu_(2)Se块体中的氧含量明显降低,并且在800 K时热导率降低了41%,ZT值提高了16%。