Face centred cubic(FCC) TiB ceramic powder synthesized by Ti-boronizing method was used as conductive filler to make ceramic electrically conductive adhesives(ECAs) with the polymer matrix.Electrically conductive ...Face centred cubic(FCC) TiB ceramic powder synthesized by Ti-boronizing method was used as conductive filler to make ceramic electrically conductive adhesives(ECAs) with the polymer matrix.Electrically conductive properties of the ceramic ECAs were studied.The bulk electrical resistivity varied with the powder content of the FCC-TiB in ECAs.The FCC-TiB filled ECAs also showed the percolation behavior that usually occurred for the metal-filled ECAs,the percolation threshold was located at the content of 60%FCC-TiB.A minimum value of 0.1 Ω·cm was obtained at a content of 75%FCC-TiB.In order to check the reliability of mechanical property,tensile test was done to measure the shear strength,and the shear strength dropped with increasing the content of FCC-TiB powders.It is about 12.26 MPa at the content of 70%TiB powders.The Cu filled ECAs were also prepared for comparison.The properties of the oxidation resistance of the two ECAs were evaluated.The results show that the ceramic ECAs have excellent oxidation resistance and better stability compared with the Cu filled ECAs.展开更多
In current research,many researchers propose analytical expressions for calculating the packing structure of spherical particles such as DN Model,Compact Model and NLS criterion et al.However,there is still a question...In current research,many researchers propose analytical expressions for calculating the packing structure of spherical particles such as DN Model,Compact Model and NLS criterion et al.However,there is still a question that has not been well explained yet.That is:What is the core factors affecting the thermal conductivity of particles?In this paper,based on the coupled discrete element-finite difference(DE-FD)method and spherical aluminum powder,the relationship between the parameters and the thermal conductivity of the powder(ETC_(p))is studied.It is found that the key factor that can described the change trend of ETC_(p) more accurately is not the materials of the powder but the average contact area between particles(a_(ave))which also have a close nonlinear relationship with the average particle size d_(50).Based on this results,the expression for calculating the ETC_(p) of the sphere metal powder is successfully reduced to only one main parameter d_(50)and an efficient calculation model is proposed which can applicate both in room and high temperature and the corresponding error is less than 20.9%in room temperature.Therefore,in this study,based on the core factors analyzation,a fast calculation model of ETC_(p) is proposed,which has a certain guiding significance in the field of thermal field simulation.展开更多
La2O3 and Ce2O3 were penetrated into PbTiO3 to obtain conductive powders, and then they were mixed with polyurethane and butyl acetate to prepare conductive coatings. The results showed that the electric property of m...La2O3 and Ce2O3 were penetrated into PbTiO3 to obtain conductive powders, and then they were mixed with polyurethane and butyl acetate to prepare conductive coatings. The results showed that the electric property of modified PbTiO3 powders was improved by penetration of La2O3 and Ce2O3. XRD patterns showed that some new compounds such as La2Ti6O15, CeTi21O38 and Pb0.634La0.209Ti0.948O2.284 were formed, which led to the rapid increase of conductivity. The resistivity of modified PbTiO3 powders decreased to 3.88 Ω·m. The coatings using modified PbTiO3 powders as fillings also had a good conductivity. When the PbTiO3 powders were 10% and antisettle agent (bentonite) content was 0.50%, and mass ratio between polyurethane and butyl acetate was 1.05, the surface resistivity of the coatings fell down to 1.3×108 Ω·m. This kind of conductive coatings could be used in electromagnetic shielding.展开更多
Traditional metal conductive fillers are expensive and prone to oxidation. Thus, the development of new conductive powders as fillers is urgently needed. A novel gaseous penetration technology was adopted to prepare L...Traditional metal conductive fillers are expensive and prone to oxidation. Thus, the development of new conductive powders as fillers is urgently needed. A novel gaseous penetration technology was adopted to prepare La-doped medical stone powders(La-MSPs), which are inexpensive mesoporous materials, as a new kind of conductive filler material. The prepared La-MSPs attained a resistivity of 450 ?·m and were used as a filler to prepare conductive coatings with epoxy resin as the resin matrix. The influence of the La-MSPs dosage on the resistance and hardness of the coatings was also determined. The resistance and the hardness both decreased with increasing filler dosage. Finally, the optimum recipe of the conductive coatings with the most suitable fillers dosage(55 wt%) was obtained. The hardness and resistance of the coatings with 55 wt% La-MSPs were HV 4 and 5.5 × 10~7 ?, respectively.展开更多
By means of testing the shear strength with single lap joint, measuring electrical resistivity for cured products and the curing strain with strain gauges, the effect of cure parameters on the properties of HT1012 con...By means of testing the shear strength with single lap joint, measuring electrical resistivity for cured products and the curing strain with strain gauges, the effect of cure parameters on the properties of HT1012 conductive adhesive filled with copper powder was investigated, and the residual stress in the conductive adhesives was also estimated. The experimental results show that the properties such as shear strength of the adhesives, electrical resistivity of products as well as the residual stress of cured HT 1012 copperfitted conductive adhesive were evidently affected by curing temperature and time. The diagrams of scanning electron microscopy (SEM) and Fourier transform infrared (FT-IR) were also used to determine the properties. The higher mechanical property was achieved under the condition of curing the adhesive 3 h at 60 ℃ as the density of the hydrogen links or linkages existed in the adhesive was relatively higher and the lower electrical resistivity occurred at 80 ℃.展开更多
The electrochemical migration (ECM) behavior of the electrically conductive adhesives (ECAs) filled with pure Ag powder or Ag-plated Cu composite powder with varied Ag:Cu ratios was investigated under the condition of...The electrochemical migration (ECM) behavior of the electrically conductive adhesives (ECAs) filled with pure Ag powder or Ag-plated Cu composite powder with varied Ag:Cu ratios was investigated under the condition of applying constant voltage and distilled water environment.ECM resistance was determined from the current-time curves.The microstructure and composition of ECM dendrite products were analyzed by SEM/EDS and XRD.It was found that the ECM resistance of Ag-plated Cu composite powder-filled ECAs was evidently higher than that of pure Ag powder-filled ECAs.The Ag:Cu ratio of composite powder in ECAs had notable influence on ECM resistance,which was enhanced with the decrease of Ag:Cu ratios.The composition of dendrites formed between cathode and anode during ECM process was not uniform for Ag-plated Cu-filled ECAs.An ECM inhibiting mechanism of Ag-plated Cu composite powder was proposed according to analysis of the electrochemical impedance spectroscopy,Tafel plot and dendrite composition.展开更多
基金Project (51172088) supported by the National Natural Science Foundation of China
文摘Face centred cubic(FCC) TiB ceramic powder synthesized by Ti-boronizing method was used as conductive filler to make ceramic electrically conductive adhesives(ECAs) with the polymer matrix.Electrically conductive properties of the ceramic ECAs were studied.The bulk electrical resistivity varied with the powder content of the FCC-TiB in ECAs.The FCC-TiB filled ECAs also showed the percolation behavior that usually occurred for the metal-filled ECAs,the percolation threshold was located at the content of 60%FCC-TiB.A minimum value of 0.1 Ω·cm was obtained at a content of 75%FCC-TiB.In order to check the reliability of mechanical property,tensile test was done to measure the shear strength,and the shear strength dropped with increasing the content of FCC-TiB powders.It is about 12.26 MPa at the content of 70%TiB powders.The Cu filled ECAs were also prepared for comparison.The properties of the oxidation resistance of the two ECAs were evaluated.The results show that the ceramic ECAs have excellent oxidation resistance and better stability compared with the Cu filled ECAs.
基金Supported by National Natural Science Foundation of China (Grant No.51975459)Shaanxi Provincial Natural Science Foundation of China (Grant No.2017JM5046)。
文摘In current research,many researchers propose analytical expressions for calculating the packing structure of spherical particles such as DN Model,Compact Model and NLS criterion et al.However,there is still a question that has not been well explained yet.That is:What is the core factors affecting the thermal conductivity of particles?In this paper,based on the coupled discrete element-finite difference(DE-FD)method and spherical aluminum powder,the relationship between the parameters and the thermal conductivity of the powder(ETC_(p))is studied.It is found that the key factor that can described the change trend of ETC_(p) more accurately is not the materials of the powder but the average contact area between particles(a_(ave))which also have a close nonlinear relationship with the average particle size d_(50).Based on this results,the expression for calculating the ETC_(p) of the sphere metal powder is successfully reduced to only one main parameter d_(50)and an efficient calculation model is proposed which can applicate both in room and high temperature and the corresponding error is less than 20.9%in room temperature.Therefore,in this study,based on the core factors analyzation,a fast calculation model of ETC_(p) is proposed,which has a certain guiding significance in the field of thermal field simulation.
基金the National Natural Science Foundation of China (20571020)
文摘La2O3 and Ce2O3 were penetrated into PbTiO3 to obtain conductive powders, and then they were mixed with polyurethane and butyl acetate to prepare conductive coatings. The results showed that the electric property of modified PbTiO3 powders was improved by penetration of La2O3 and Ce2O3. XRD patterns showed that some new compounds such as La2Ti6O15, CeTi21O38 and Pb0.634La0.209Ti0.948O2.284 were formed, which led to the rapid increase of conductivity. The resistivity of modified PbTiO3 powders decreased to 3.88 Ω·m. The coatings using modified PbTiO3 powders as fillings also had a good conductivity. When the PbTiO3 powders were 10% and antisettle agent (bentonite) content was 0.50%, and mass ratio between polyurethane and butyl acetate was 1.05, the surface resistivity of the coatings fell down to 1.3×108 Ω·m. This kind of conductive coatings could be used in electromagnetic shielding.
基金financially supported by the Projects of Application Technology and Development of Harbin (No. 2016RAXXJ024)
文摘Traditional metal conductive fillers are expensive and prone to oxidation. Thus, the development of new conductive powders as fillers is urgently needed. A novel gaseous penetration technology was adopted to prepare La-doped medical stone powders(La-MSPs), which are inexpensive mesoporous materials, as a new kind of conductive filler material. The prepared La-MSPs attained a resistivity of 450 ?·m and were used as a filler to prepare conductive coatings with epoxy resin as the resin matrix. The influence of the La-MSPs dosage on the resistance and hardness of the coatings was also determined. The resistance and the hardness both decreased with increasing filler dosage. Finally, the optimum recipe of the conductive coatings with the most suitable fillers dosage(55 wt%) was obtained. The hardness and resistance of the coatings with 55 wt% La-MSPs were HV 4 and 5.5 × 10~7 ?, respectively.
基金Founded by the Major Research Programs(No.2003Z001)of ScienceTechnology of Hubei Provincial Department of Education,China
文摘By means of testing the shear strength with single lap joint, measuring electrical resistivity for cured products and the curing strain with strain gauges, the effect of cure parameters on the properties of HT1012 conductive adhesive filled with copper powder was investigated, and the residual stress in the conductive adhesives was also estimated. The experimental results show that the properties such as shear strength of the adhesives, electrical resistivity of products as well as the residual stress of cured HT 1012 copperfitted conductive adhesive were evidently affected by curing temperature and time. The diagrams of scanning electron microscopy (SEM) and Fourier transform infrared (FT-IR) were also used to determine the properties. The higher mechanical property was achieved under the condition of curing the adhesive 3 h at 60 ℃ as the density of the hydrogen links or linkages existed in the adhesive was relatively higher and the lower electrical resistivity occurred at 80 ℃.
基金financially supported by the Special Funds of National Ministry of Finance for the Transformation of Industrial Technology Achievements (No.CJ2007-475)
文摘The electrochemical migration (ECM) behavior of the electrically conductive adhesives (ECAs) filled with pure Ag powder or Ag-plated Cu composite powder with varied Ag:Cu ratios was investigated under the condition of applying constant voltage and distilled water environment.ECM resistance was determined from the current-time curves.The microstructure and composition of ECM dendrite products were analyzed by SEM/EDS and XRD.It was found that the ECM resistance of Ag-plated Cu composite powder-filled ECAs was evidently higher than that of pure Ag powder-filled ECAs.The Ag:Cu ratio of composite powder in ECAs had notable influence on ECM resistance,which was enhanced with the decrease of Ag:Cu ratios.The composition of dendrites formed between cathode and anode during ECM process was not uniform for Ag-plated Cu-filled ECAs.An ECM inhibiting mechanism of Ag-plated Cu composite powder was proposed according to analysis of the electrochemical impedance spectroscopy,Tafel plot and dendrite composition.