Cu(NO3)(2) and (NH4)(6)H(2)W(12)O(40)center dot 4H(2)O were used to prepare W/Cu nanosized composite powder by sol-gel technique. The influences of heat treatment process, pH value of the solution and the amount of an...Cu(NO3)(2) and (NH4)(6)H(2)W(12)O(40)center dot 4H(2)O were used to prepare W/Cu nanosized composite powder by sol-gel technique. The influences of heat treatment process, pH value of the solution and the amount of an addition agent on particle size were investigated by DSC, XRD and TEM. The results show that, at a certain heat treatment temperature, the W/Cu nanoparticle size increases with the pH value or the amount of the addition agent increasing.展开更多
A direct electroless copper （Cu） coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid （C2H203） as a reducing agent was reported. The effects of copper sul...A direct electroless copper （Cu） coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid （C2H203） as a reducing agent was reported. The effects of copper sulfate concentration and the pH of the plating solution on the properties of the prepared W@Cu composite powders were assessed. The content of Cu in the composite powders was controlled by adjusting the concentration of copper sulfate in the electroless plating solution. A uniform, dense, and consistent Cu coating was obtained under the established optimum conditions （flow rate of C2H203 = 5.01 mL/min, solution pH = 12.25 and reaction temperature 45.35℃） by using central composite design method. In addition, the crystalline Cu coating was evenly dispersed within the W@Cu composite powders and Cu element in the coating existed as Cu~. The formation mechanism for the W@Cu composite powders by electroless plating in the absence of surface treatment and stabilizing agent was also proposed.展开更多
基金This Project was financially supported by the National Natural Science Foundation of China (No. 50471033).
文摘Cu(NO3)(2) and (NH4)(6)H(2)W(12)O(40)center dot 4H(2)O were used to prepare W/Cu nanosized composite powder by sol-gel technique. The influences of heat treatment process, pH value of the solution and the amount of an addition agent on particle size were investigated by DSC, XRD and TEM. The results show that, at a certain heat treatment temperature, the W/Cu nanoparticle size increases with the pH value or the amount of the addition agent increasing.
基金Funded by the National Natural Science Foundation of China(Nos.51202175 and 11072228)the National 111 Project(No.B13035)
文摘A direct electroless copper （Cu） coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid （C2H203） as a reducing agent was reported. The effects of copper sulfate concentration and the pH of the plating solution on the properties of the prepared W@Cu composite powders were assessed. The content of Cu in the composite powders was controlled by adjusting the concentration of copper sulfate in the electroless plating solution. A uniform, dense, and consistent Cu coating was obtained under the established optimum conditions （flow rate of C2H203 = 5.01 mL/min, solution pH = 12.25 and reaction temperature 45.35℃） by using central composite design method. In addition, the crystalline Cu coating was evenly dispersed within the W@Cu composite powders and Cu element in the coating existed as Cu~. The formation mechanism for the W@Cu composite powders by electroless plating in the absence of surface treatment and stabilizing agent was also proposed.
