Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints

Lap joints with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancemem 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the solder joints. The results indicate that the creep resistance of the composite solder joints is generally superior to that of the conventional 63Sn37Pb solder joints. At the same time, the creep rupture life of the composite solder joints is declined with increasing stress and drops faster than that of the 63Sn37Pb eutectic solder joints.

Creep behavior on Ag particle reinforced SnCu based composite solder joints

SnCu solder is one of the most promising substitutes of SnPb solder, but its creep resistance is worse than that of the other lead-free solders. Particle-reinforcement is a way to improve the creep resistance of solder alloys and cause much more attention than before. A novel Ag particles reinforced SnCu based composite solder is formed and the influence of stress on creep behavior of the composite solder is investigated. Results indicate that the creep resistance of solder joints is superior to that of the SnCu solder joints. Creep rupture lifetime of solder joints decreases gradually with stress increasing. And the creep rupture lifetime of the composite solder joints falls down faster than that of the matrix solder joints.

The influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered joints

Creep property of solder alloys is one of the important factors to affect the reliabdity of soldered joints in SMT （surface mount technology）. Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37 Pb based composite soldered joints and 63Sn37 Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37 Pb eutectic soldered joint.

Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder

The creep properties of solder alloys are an important factor affecting the reliability of soldered joints in surface mount technologies. Particle-enhancement is one way to improve the properties of solder alloys. The temperature of the solder joint is one of the primary factors affecting the solder joint creep properties. Single shear lap creep specimens with a 1 mm2 cross-sectional area were fabricated using Ag particle enhancement 99.3Sn0.7Cu based composite solder and 99.3Sn0.7Cu eutectic solder to examine the influence of temperature on the creep behavior of solder joints. The results show that the solder joint creep resistance of the composite solder joint was generally superior to that of the 99.3Sn0.7Cu solder joint. The creep rupture life of the composite solder joint was reduced by increasing temperatures at a faster rate than that of the 99.3Sn0.7Cu eutectic solder joint.

温度对Ag颗粒增强SnCu基复合钎料蠕变性能的影响

采用1 mm2微型单搭接钎焊接头,研究了恒定应力下温度对Ag颗粒增强SnCu基复合钎料钎焊接头蠕变寿命的影响,研究结果表明:增强颗粒Ag与基体会发生冶金反应,在Ag颗粒周围形成了一薄层Ag-Sn金属间化合物,使增强颗粒Ag与基体紧密结合,从而使复合钎料钎焊接头蠕变寿命优于基体SnCu钎料;温度对复合钎料钎焊接头蠕变寿命影响较SnCu钎料明显。

纳米Ag颗粒增强复合钎料蠕变性能的研究

制备纳米Ag颗粒增强的Sn-Cu基复合钎料。研究不同温度载荷下复合钎料钎焊接头的蠕变断裂寿命,并与Sn-0.7Cu基体钎料钎焊接头进行对比。此外,确定纳米Ag颗粒增强的Sn-Cu基复合钎料钎焊接头在不同温度和应力水平下的应力指数和蠕变激活能,建立复合钎料钎焊接头的稳态蠕变本构方程。结果表明,在不同的温度和应力下,与Sn-0.7Cu钎料钎焊接头相比,纳米Ag颗粒增强的Sn-Cu基复合钎料钎焊接头的蠕变断裂寿命均有所提高,且具有更高的蠕变激活能,说明复合钎料钎焊接头具有更优的抗蠕变性能。

Ag颗粒含量对SnCu基复合钎料性能的影响

利用颗粒增强原理研制了新型Ag颗粒增强SnCu基复合钎料,研究了Ag颗粒不同含量对复合钎料性能影响．结果表明:当Ag含量(体积分数)为5%时,复合钎料铺展面积最大,润湿角最小,钎焊接头蠕变寿命最长,比基体钎料提高23倍．

温度对Cu颗粒增强复合钎料蠕变性能的影响

蠕变性能是影响钎焊接头可靠性的重要指标之一.采用搭接面积为1mm2的单搭接钎焊接头,在恒定载荷下,测定了Cu颗粒增强锡铅基复合钎料钎焊接头的蠕变寿命,分析并讨论了温度对该复合钎料蠕变寿命的影响.结果表明:Cu颗粒增强的锡铅基复合钎料的蠕变抗力优于传统63Sn37Pb共晶钎料;钎焊接头蠕变寿命随温度的升高而降低,并且温度对复合钎料钎焊接头蠕变寿命的影响较传统63Sn37Pb钎料明显.

Ag颗粒增强复合钎料钎焊接头蠕变断裂及强化机理研究

测定了不同应力和温度下Ag颗粒增强复合钎料及基体钎料63Sn37Pb钎焊接头蠕变寿命,分析了Ag颗粒增强复合钎料及基体钎料钎焊接头蠕变断裂机理.表明:Ag颗粒增强复合钎料钎焊接头蠕变寿命优于基体钎料;Ag颗粒表面Ag-Sn金属间化合物形成及Ag颗粒对富Pb层阻碍作用是复合钎料钎焊接头蠕变性能提高的主要因素;钎焊接头Cu基板上一薄层富Pb相区形成是蠕变裂纹主要原因.

纳米银颗粒增强复合钎料的研究

研究了纳米银颗粒增强锡铅基复合钎料的物理性能、工艺性能、力学性能和蠕变性能。通过在Sn-37Pb中加入不同含量的纳米银颗粒,测定比较复合钎料的性能,从而选择最佳加入量。结果表明,φ(Ag)=3%的纳米银颗粒的复合钎料综合性能最好,与Sn-37Pb共晶钎料相比,所加入的纳米银颗粒对位错起到了钉扎作用,从而提高了钎焊接头的蠕变寿命,其断裂形貌特征为延性和脆性混合断裂。

铜颗粒增强对锡铅钎料蠕变寿命的影响

颗粒增强是提高合金性能的重要手段之一。增强体的不同含量对基体的性能会产生不同的影响。主要分析和讨论了铜的不同含量对铜颗粒增强的锡铅基复合钎料蠕变性能的影响。测定6种铜颗粒增强的锡铅基复合钎料的蠕变寿命。试验结果表明:在相同的条件下,复合钎料的蠕变寿命与锡铅钎料相比,均有不同程度的提高。当铜的质量分数约为1％时,复合钎料的蠕变性能最好,约为锡铅钎料的17倍。

Cu颗粒增强复合钎料钎焊接头的蠕变断裂及强化机理水

测定不同应力和温度下Cu颗粒增强复合钎料及基体钎料钎焊接头蠕变寿命,分析Cu颗粒增强复合钎料及其基体钎料63Sn37Pb钎焊接头蠕变断裂机理。结果表明:Cu颗粒增强复合钎料钎焊接头蠕变寿命优于基体钎料。Cu颗粒表面金属间化合物形成及Cu颗粒对富Pb层阻碍作用是复合钎料钎焊接头蠕变性能改善的主要因素。钎焊接头铜基板上一薄层富Pb相的形成是蠕变裂纹产生的根源。

含纳米铝颗粒SnAgCu钎料组织与性能

选择在SnAgCu钎料中添加纳米铝颗粒,改善无铅钎料的性能.结果表明,微量纳米铝颗粒可以增加SnAgCu钎料的润湿铺展面积,显著提高SnAgCu焊点的拉伸力和剪切力,添加过量时钎料的润湿性能会有一定程度的下降,经过优化分析发现纳米铝颗粒的最佳添加量应该控制在0.1%附近.对SnAgCu-xAl钎料的组织分析,发现纳米颗粒的添加,钎料组织得到明显的细化,树枝晶间距明显减小.对SnAgCu-xAl焊点进行蠕变拉伸测试,发现纳米铝颗粒可以显著提高SnAgCu焊点的蠕变断裂寿命,主要归因于纳米颗粒对位错的钉扎作用.

新型纳米结构颗粒增强无铅复合钎料性能

为了解决传统复合钎料制备中强化颗粒容易粗化的问题,提高无铅复合钎料的性能,选用共晶Sn-3.5Ag、Sn-3.0Ag-0.5Cu钎料作为基体,3种不同类型具有纳米结构的有机-无机笼型硅氧烷齐聚物(POSS)颗粒作为增强相而制成复合钎料。研究了复合钎料的铺展性能、钎焊接头的力学性能和抗蠕变性能。结果表明,复合钎料的润湿性能均优于基体钎料的润湿性能,复合钎料钎焊接头的剪切强度和蠕变断裂寿命均明显提高。在相同条件下,Sn-Ag-Cu基复合钎料钎焊接头的性能优于Sn-Ag基复合钎料钎焊接头。