采用常规射频等离子体增强化学气相沉积方法,以高氢稀释的Si H4为源气体和以PH3为掺杂剂,制备了磷掺杂的氢化纳米晶硅薄膜。结果表明,薄膜的生长速率随PH3/Si H4流量比（Cp）增加而显著减小。Raman谱的研究证实,随Cp增加,薄膜的晶化率...采用常规射频等离子体增强化学气相沉积方法,以高氢稀释的Si H4为源气体和以PH3为掺杂剂,制备了磷掺杂的氢化纳米晶硅薄膜。结果表明,薄膜的生长速率随PH3/Si H4流量比（Cp）增加而显著减小。Raman谱的研究证实,随Cp增加,薄膜的晶化率经历了先增大后减小的过程,当Cp=1.0%,晶化率达到最大值45.9%。傅里叶变换红外吸收谱测量结果显示,薄膜中的H含量在Cp=2.0%时达到最低值9.5%。光学测量结果表明,本征和掺P的氢化纳米晶硅薄膜在可见光谱范围呈现出良好的光吸收特性,在0.8~3.0 e V范围内,nc-Si（P）∶H薄膜的吸收系数显著大于c-Si。和α-Si∶H薄膜相比,虽然短波范围的吸收系数较低,但是在hν〈1.7 e V区域,nc-Si（P）∶H薄膜的吸收系数要高两到三个量级,显示出优良的红光响应。电学测量表明,适当掺P会显著提高氢化纳米晶硅薄膜的暗电导率,当Cp=0.5%时,薄膜的暗电导率可达5.4 S·cm-1。展开更多
Studies of nanoindentation were performed on nc-Si：H films to evaluate the effects of the fabrication processes on their mechanical properties. It is observed that with the decrease of the SiH4 contents, the grain si...Studies of nanoindentation were performed on nc-Si：H films to evaluate the effects of the fabrication processes on their mechanical properties. It is observed that with the decrease of the SiH4 contents, the grain size of the films increases gradually, and as does the crystalline volume fraction. The smaller the grains become, the more homogeneous the films, and the more even the hardness as well as the modulus will be. The hardness and the modulus will increase with the substrate＇s temperature rising. The hardness and the modulus of the nc-Si：H films on the Si substrate prove to be higher than those on the glass substrate given the same technology parameters. How- ever, the films on the glass substrate appear to be more homogeneous.展开更多
文摘采用常规射频等离子体增强化学气相沉积方法,以高氢稀释的Si H4为源气体和以PH3为掺杂剂,制备了磷掺杂的氢化纳米晶硅薄膜。结果表明,薄膜的生长速率随PH3/Si H4流量比（Cp）增加而显著减小。Raman谱的研究证实,随Cp增加,薄膜的晶化率经历了先增大后减小的过程,当Cp=1.0%,晶化率达到最大值45.9%。傅里叶变换红外吸收谱测量结果显示,薄膜中的H含量在Cp=2.0%时达到最低值9.5%。光学测量结果表明,本征和掺P的氢化纳米晶硅薄膜在可见光谱范围呈现出良好的光吸收特性,在0.8~3.0 e V范围内,nc-Si（P）∶H薄膜的吸收系数显著大于c-Si。和α-Si∶H薄膜相比,虽然短波范围的吸收系数较低,但是在hν〈1.7 e V区域,nc-Si（P）∶H薄膜的吸收系数要高两到三个量级,显示出优良的红光响应。电学测量表明,适当掺P会显著提高氢化纳米晶硅薄膜的暗电导率,当Cp=0.5%时,薄膜的暗电导率可达5.4 S·cm-1。
基金National Natural Science Foundation of China (Grants 10432050 and 90305026)
文摘Studies of nanoindentation were performed on nc-Si：H films to evaluate the effects of the fabrication processes on their mechanical properties. It is observed that with the decrease of the SiH4 contents, the grain size of the films increases gradually, and as does the crystalline volume fraction. The smaller the grains become, the more homogeneous the films, and the more even the hardness as well as the modulus will be. The hardness and the modulus will increase with the substrate＇s temperature rising. The hardness and the modulus of the nc-Si：H films on the Si substrate prove to be higher than those on the glass substrate given the same technology parameters. How- ever, the films on the glass substrate appear to be more homogeneous.
