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High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology
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作者 Jing Liu Mingjin Wang +6 位作者 Yufei Wang Xuyan Zhou Ting Fu Aiyi Qi Hongwei Qu Xiaoxu Xing Wanhua Zheng 《Chinese Optics Letters》 SCIE EI CAS CSCD 2022年第7期30-35,共6页
A high peak power density and low mechanical stress photonic-band-crystal(PBC)diode laser array based on non-soldered packaging technology is demonstrated.The array consists of the PBC diode laser bars with small fast... A high peak power density and low mechanical stress photonic-band-crystal(PBC)diode laser array based on non-soldered packaging technology is demonstrated.The array consists of the PBC diode laser bars with small fast axis divergence angles.Meanwhile,we design the non-soldered array structure that realizes mechanical stacking of 10 bars in the vertical direction.In the experiment,the peak power density of the PBC array is about 1.75 times that of the conventional array when the same total power is obtained.The peak power of the non-soldered array is 292.2 W,and the“smile”effect is improved by adjusting the mechanical fixing force of the array. 展开更多
关键词 photonic-band-crystal non-soldered packaging low mechanical stress
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