Multidimensional integration and multifunctional com-ponent assembly have been greatly explored in recent years to extend Moore’s Law of modern microelectronics.However,this inevitably exac-erbates the inhomogeneity ...Multidimensional integration and multifunctional com-ponent assembly have been greatly explored in recent years to extend Moore’s Law of modern microelectronics.However,this inevitably exac-erbates the inhomogeneity of temperature distribution in microsystems,making precise temperature control for electronic components extremely challenging.Herein,we report an on-chip micro temperature controller including a pair of thermoelectric legs with a total area of 50×50μm^(2),which are fabricated from dense and flat freestanding Bi2Te3-based ther-moelectric nano films deposited on a newly developed nano graphene oxide membrane substrate.Its tunable equivalent thermal resistance is controlled by electrical currents to achieve energy-efficient temperature control for low-power electronics.A large cooling temperature difference of 44.5 K at 380 K is achieved with a power consumption of only 445μW,resulting in an ultrahigh temperature control capability over 100 K mW^(-1).Moreover,an ultra-fast cooling rate exceeding 2000 K s^(-1) and excellent reliability of up to 1 million cycles are observed.Our proposed on-chip temperature controller is expected to enable further miniaturization and multifunctional integration on a single chip for microelectronics.展开更多
Integrated photonic devices are essential for on-chip optical communication,optical-electronic systems,and quantum information sciences.To develop a high-fidelity interface between photonics in various frequency domai...Integrated photonic devices are essential for on-chip optical communication,optical-electronic systems,and quantum information sciences.To develop a high-fidelity interface between photonics in various frequency domains without disturbing their quantum properties,nonlinear frequency conversion,typically steered with the quadratic(χ2)process,should be considered.Furthermore,another degree of freedom in steering the spatial modes during theχ2 process,with unprecedent mode intensity is proposed here by modulating the lithium niobate(LN)waveguide-based inter-mode quasi-phasematching conditions with both temperature and wavelength parameters.Under high incident light intensities(25 and 27.8 dBm for the pump and the signal lights,respectively),mode conversion at the sum-frequency wavelength with sufficient high output power(−7–8 dBm)among the TM01,TM10,and TM00 modes is realized automatically with characterized broad temperature(ΔT≥8°C)and wavelength windows(Δλ≥1 nm),avoiding the previous efforts in carefully preparing the signal or pump modes.The results prove that high-intensity spatial modes can be prepared at arbitrary transparent wavelength of theχ2 media toward on-chip integration,which facilitates the development of chip-based communication and quantum information systems because spatial correlations can be applied to generate hyperentangled states and provide additional robustness in quantum error correction with the extended Hilbert space.展开更多
包分类技术作为网络交换业务的核心技术,在保证网络的高带宽和低延迟方面发挥着重要作用。在核心网与承载网领域,高性能网络对交换、路由、QoS(Quality of Service)等业务提出了更高的要求。目前高端交换芯片的主流技术仍以基于硬件的...包分类技术作为网络交换业务的核心技术,在保证网络的高带宽和低延迟方面发挥着重要作用。在核心网与承载网领域,高性能网络对交换、路由、QoS(Quality of Service)等业务提出了更高的要求。目前高端交换芯片的主流技术仍以基于硬件的包分类算法为主,其中又以TCAM技术的应用最为成熟。本文分析了当前TCAM算法应用现状和研究进展,系统性地介绍了TCAM中的范围匹配和多匹配两大核心问题及其解决方案,对比阐述了现有算法的优点和缺点,最后给出了未来TCAM包分类算法的研究趋势。展开更多
基金The authors thank D.Berger,D.Hofmann and C.Kupka in IFW Dresden for helpful technical support.H.R.acknowledges funding from the DFG(Deutsche Forschungsgemeinschaft)within grant number RE3973/1-1.Q.J.,H.R.and K.N.conceived the work.With the support from N.Y.and X.J.,Q.J.and T.G.fabricated the thermoelectric films and conducted the structural and compositional characterizations.Q.J.prepared microchips and fabricated the on-chip micro temperature controllers.Q.J.and N.P.carried out the temperature-dependent material and device performance measurements.Q.J.and H.R.performed the simulation and analytical calculations.Q.J.,H.R.and K.N.wrote the manuscript with input from the other coauthors.All the authors discussed the results and commented on the manuscript.
文摘Multidimensional integration and multifunctional com-ponent assembly have been greatly explored in recent years to extend Moore’s Law of modern microelectronics.However,this inevitably exac-erbates the inhomogeneity of temperature distribution in microsystems,making precise temperature control for electronic components extremely challenging.Herein,we report an on-chip micro temperature controller including a pair of thermoelectric legs with a total area of 50×50μm^(2),which are fabricated from dense and flat freestanding Bi2Te3-based ther-moelectric nano films deposited on a newly developed nano graphene oxide membrane substrate.Its tunable equivalent thermal resistance is controlled by electrical currents to achieve energy-efficient temperature control for low-power electronics.A large cooling temperature difference of 44.5 K at 380 K is achieved with a power consumption of only 445μW,resulting in an ultrahigh temperature control capability over 100 K mW^(-1).Moreover,an ultra-fast cooling rate exceeding 2000 K s^(-1) and excellent reliability of up to 1 million cycles are observed.Our proposed on-chip temperature controller is expected to enable further miniaturization and multifunctional integration on a single chip for microelectronics.
基金financial supports from National Key Research and Development Program of China(2021YFB3602500)Self-deployment Project of Fujian Science&Technology Innovation Laboratory for Optoelectronic Information of China(2021ZZ101)National Natural Science Foundation of China(Grant Nos.62275247 and 61905246).
文摘Integrated photonic devices are essential for on-chip optical communication,optical-electronic systems,and quantum information sciences.To develop a high-fidelity interface between photonics in various frequency domains without disturbing their quantum properties,nonlinear frequency conversion,typically steered with the quadratic(χ2)process,should be considered.Furthermore,another degree of freedom in steering the spatial modes during theχ2 process,with unprecedent mode intensity is proposed here by modulating the lithium niobate(LN)waveguide-based inter-mode quasi-phasematching conditions with both temperature and wavelength parameters.Under high incident light intensities(25 and 27.8 dBm for the pump and the signal lights,respectively),mode conversion at the sum-frequency wavelength with sufficient high output power(−7–8 dBm)among the TM01,TM10,and TM00 modes is realized automatically with characterized broad temperature(ΔT≥8°C)and wavelength windows(Δλ≥1 nm),avoiding the previous efforts in carefully preparing the signal or pump modes.The results prove that high-intensity spatial modes can be prepared at arbitrary transparent wavelength of theχ2 media toward on-chip integration,which facilitates the development of chip-based communication and quantum information systems because spatial correlations can be applied to generate hyperentangled states and provide additional robustness in quantum error correction with the extended Hilbert space.
文摘包分类技术作为网络交换业务的核心技术,在保证网络的高带宽和低延迟方面发挥着重要作用。在核心网与承载网领域,高性能网络对交换、路由、QoS(Quality of Service)等业务提出了更高的要求。目前高端交换芯片的主流技术仍以基于硬件的包分类算法为主,其中又以TCAM技术的应用最为成熟。本文分析了当前TCAM算法应用现状和研究进展,系统性地介绍了TCAM中的范围匹配和多匹配两大核心问题及其解决方案,对比阐述了现有算法的优点和缺点,最后给出了未来TCAM包分类算法的研究趋势。
