Silicon-based optoelectronic heterogeneous integration for optical interconnection

The performance of optical interconnection has improved dramatically in recent years.Silicon-based optoelectronic heterogeneous integration is the key enabler to achieve high performance optical interconnection,which not only provides the optical gain which is absent from native Si substrates and enables complete photonic functionalities on chip,but also improves the system performance through advanced heterogeneous integrated packaging.This paper reviews recent progress of silicon-based optoelectronic heterogeneous integration in high performance optical interconnection.The research status,development trend and application of ultra-low loss optical waveguides,high-speed detectors,high-speed modulators,lasers and 2D,2.5D,3D and monolithic integration are focused on.

A Single Mode Hybrid Ⅲ-Ⅴ/Silicon On-Chip Laser Based on Flip-Chip Bonding Technology for Optical Interconnection

A single mode hybrid Ⅲ-Ⅴ/silicon on-chip laser based on the flip-chip bonding technology for on-chip optical interconnection is demonstrated. A single mode Fabry-Perot laser structure with micro-structures on an InP ridge waveguide is designed and fabricated on an InP/AIGaInAs multiple quantum well epitaxial layer structure wafer by using i-line lithography. Then, a silicon waveguide platform including a laser mounting stage is designed and fabricated on a silicon-on-insulator substrate. The single mode laser is flip-chip bonded on the laser mounting stage. The lasing light is butt-coupling to the silicon waveguide. The laser power output from a silicon waveguide is 1.3roW, and the threshold is 37mA at room temperature and continuous wave operation.

Waveguide-integrated optical modulators with two-dimensional materials

Waveguide-integrated optical modulators are indispensable for on-chip optical interconnects and optical computing.To cope with the ever-increasing amount of data being generated and consumed,ultrafast waveguide-integrated optical modulators with low energy consumption are highly demanded.In recent years,two-dimensional(2D)materials have attracted a lot of attention and have provided tremendous opportunities for the development of high-performance waveguide-integrated optical modulators because of their extraordinary optoelectronic properties and versatile compatibility.This paper reviews the state-of-the-art waveguide-integrated optical modulators with 2D materials,providing researchers with the developing trends in the field and allowing them to identify existing challenges and promising potential solutions.First,the concept and fundamental mechanisms of optical modulation with 2D materials are summarized.Second,a review of waveguide-integrated optical modulators employing electro-optic,all-optic,and thermo-optic effects is provided.Finally,the challenges and perspectives of waveguide-integrated modulators with 2D materials are discussed.

Sixteen-element Ge-on-SOI PIN photo-detector arrays for parallel optical interconnects

We describe the structure and testing of one-dimensional array parallel-optics photo-detectors with 16 photodiodes of which each diode operates up to 8 Gb/s. The single element is vertical and top illuminated 30μm-diameter silicon on insulator （Ge-on-SOI） PIN photodetector. High-quality Ge absorption layer is epitaxially grown on SO1 substrate by the ultra-high vacuum chemical vapor deposition （UHV-CVD）. The photodiode exhibits a good responsivity of 0.20 A/W at a wavelength of 1550 nm. The dark current is as low as 0.36/aA at a reverse bias of 1 V, and the corresponding current density is about 51 mA/cm2. The detector with a diameter of 30 t.trn is measured at an incident light of 1.55 μm and 0.5 mW, and the 3-dB bandwidth is 7.39 GHz without bias and 13.9 GHz at a reverse bias of 3 V. The 16 devices show a good consistency.

The 8×10 GHz Receiver Optical Subassembly Based on Silica Hybrid Integration Technology for Data Center Interconnection

An 8×10 GHz receiver optical sub-assembly （ROSA） consisting of an 8-channel arrayed waveguide grating （AWG） and an 8-channel PIN photodetector （PD） array is designed and fabricated based on silica hybrid integration technology. Multimode output waveguides in the silica AWG with 2% refractive index difference are used to obtain fiat-top spectra. The output waveguide facet is polished to 45° bevel to change the light propagation direction into the mesa-type PIN PD, which simplifies the packaging process. The experimentM results show that the single channel I dB bandwidth of AWG ranges from 2.12nm to 3.06nm, the ROSA responsivity ranges from 0.097 A/W to 0.158A/W, and the 3dB bandwidth is up to 11 GHz. It is promising to be applied in the eight-lane WDM transmission system in data center interconnection.

Strict non-blocking four-port optical router for mesh photonic network-on-chip

We report a strict non-blocking four-port optical router that is used for a mesh photonic network-on-chip on a silicon-on-insulator platform.The router consists of eight silicon microring switches that are tuned by the thermo-optic effect.For each tested rousting state,the signal-to-noise ratio of the optical router is larger than 13.8 dB at the working wavelength.The routing functionality of the device is verified.We perform 40 Gbps nonreturn to zero code data transmission on its 12 optical links.Meanwhile,data transmission using wavelength division multiplexing on eight channels in the C band(from 1525 to 1565 nm)has been adopted to increase the communication capacity.The optical router’s average energy efficiency is 25.52 fJ/bit.The rising times(10%to 90%)of the eight optical switch elements are less than 10μs and the falling times(90%-10%)are less than 20μs.

Short-Range Optical Wireless Communications for Indoor and Interconnects Applications

Optical wireless communications have been widely studied during the past decade in short-range applications, such as indoor highspeed wireless networks and interconnects in data centers and high-performance computing. In this paper, recent developments in high-speed short-range optical wireless communications are reviewed, including visible light communications （VLCs）, infrared indoor communication systems, and reconfigurable optical interconnects. The general architecture of indoor high-speed optical wireless communications is described, and the advantages and limitations of both visible and infrared based solutions are discussed. The concept of reconfigurable optical interconnects is presented, and key results are summarized. In addition, the challenges and potential future directions of short-range optical wireless communications are discussed.

On-Chip Capillary Electrophoresis (Chip-CE) with Optical On-Chip Leaky-Waveguide-Based Detection

Capillary electrophoresis (CE) suffers from a relatively small sensitivity—at least in case of optical detection transversely to the capillary axis due to the small capillary inner diameters in the range of 50 - 100 μm. Different concepts like bubble, U-, or Z-cells have been used to tackle that problem already in the nineties of the last century. But the U- and Z-cells have typically been extra cells with larger inner channel diameters and no optimization for optical waveguiding and the bubble cell per se did not allow for optical waveguiding. In the case of on-chip capillary electrophoresis (chip-CE) a U-cell can be implemented quite easily on the chip. Here we show how leaky optical waveguiding can be employed to improve optical detection. Proper U-channel design and preparation by wet-chemical etching of the fused silica sub- and superstrate, making the U-channel bend a part of the optical input lens system, can help to achieve high coupling efficiency with loss coefficients around 2 dB and low waveguiding loss.

MSONoC: a non-blocking optical interconnection network for inter cluster communication

Electric router is widely used for multi-core system to interconnect each other. However, with the increasing number of processor cores, the probability of communication conflict between processor cores increases, and the data delay increases dramatically. With the advent of optical router, the traditional electrical interconnection mode has changed to optical interconnection mode. In the packet switched optical interconnection network, the data communication mechanism consists of 3 processes: link establishment, data transmission and link termination, but the circuit-switched data transmission method greatly limits the utilization of resources. The number of micro-ring resonators in the on-chip large-scale optical interconnect network is an important parameter affecting the insertion loss. The proposed λ-route, GWOR, Crossbar structure has a large overall network insertion loss due to the use of many micro-ring resonators. How to use the least micro-ring resonator to realize non-blocking communication between multiple cores has been a research hotspot. In order to improve bandwidth and reduce access latency, an optical interconnection structure called multilevel switching optical network on chip(MSONoC) is proposed in this paper. The broadband micro-ring resonators(BMRs) are employed to reduce the number of micro-ring resonators(MRs) in the network, and the structure can provide the service of non-blocking point to point communication with the wavelength division multiplexing(WDM) technology. The results show that compared to λ-route, GWOR, Crossbar and the new topology structure, the number of micro-ring resonators of MSONoC are reduced by 95.5%, 95.5%, 87.5%, and 60% respectively. The insertion loss of the minimum link of new topology, mesh and MSONoC structure is 0.73 dB, 0.725 dB and 0.38 dB.

Parallel Optical Interconnect Technology: Combination of Higher Performance and Lower Energy Consumption

This paper analyzes the physical potential, computing performance benefi t and power consumption of optical interconnects. Compared with electrical interconnections, optical ones show undoubted advantages based on physical factor analysis. At the same time, since the recent developments drive us to think about whether these optical interconnect technologies with higher bandwidth but higher cost are worthy to be deployed, the computing performance comparison is performed. To meet the increasing demand of large-scale parallel or multi-processor computing tasks, an analytic method to evaluate parallel computing performance ofinterconnect systems is proposed in this paper. Both bandwidth-limit model and full-bandwidth model are under our investigation. Speedup and effi ciency are selected to represent the parallel performance of an interconnect system. Deploying the proposed models, we depict the performance gap between the optical and electrically interconnected systems. Another investigation on power consumption of commercial products showed that if the parallel interconnections are deployed, the unit power consumption will be reduced. Therefore, from the analysis of computing influence and power dissipation, we found that parallel optical interconnect is valuable combination of high performance and low energy consumption. Considering the possible data center under construction, huge power could be saved if parallel optical interconnects technologies are used.

Review of the Low-Latency Optical Interconnect Technologies for Peta-Scale Computing

This paper reviews the recently developed optical interconnect technologies designed for scalable, low latency and high-throughput communications within datacenters or high performance computers. The three typical architectures including the broadcast-and-select based Optical Shared Memory Supercomputer Interconnect System (OSMOSIS) switch, the defection routing based Data Vortex switch and the arrayed waveguide grating based Low-latency Interconnect Optical Network Switch (LIONS) switch are discussed in detail. In particular, we investigate the various loopback buffering technologies in LIONS and present a proof of principle testbed demonstration showing feasibility of LIONS architecture. Moreover, the performance of LIONS, Data Vortex and OSMOSIS with traditional state-of-the-art electrical switching network based on the Flattened-ButterFly (FBF) architecture in terms of throughput and latency are compared. The simulation based performance study shows that the latency of LIONS is almost independent of the number of input ports and does not saturate even at very high input load.

Adaptive and Intelligent Digital Signal Processing for Improved Optical Interconnection

In recent years, explosively increasing data traffic has been boosting the con?tinuous demand of high speed optical interconnection inside or among data centers, high performance computers and even consumer electronics. To pursue the improved intercon?nection performance of capacity, energy efficiency and simplicity, effective approaches are demonstrated including particularly advanced digital signal processing (DSP) meth?ods. In this paper, we present a review about the enabling adaptive DSP methods for opti?cal interconnection applications, and a detailed summary of our recent and ongoing works in this field. In brief, our works focus on dealing with the specific issues for short-reach interconnection scenarios with adaptive operation, including signal-to-noise-ratio (SNR) limitation, level nonlinearity distortion, energy efficiency consideration and the de?cision precision.

Influence on Multimode Rectangular Optical Waveguide Propagation Loss by Surface Roughness

Optical scattering loss coefficient of muhimode rectangular waveguide is analyzed in this work. First, the effective refrac tive index and the mode field distribution of waveguide modes are obtained using the Marcatili method. The influence on scattering loss coefficient by waveguide surface roughness is then analyzed. Finally, the mode coupling efficiency for the SMFOpticalWaveguide （SOW） structure and MMFOptical Waveguide （MOW） structure are presented. The total scatter ing loss coefficient depends on modes scattering loss coeffi cients and the mode coupling efficiency between fiber and waveguide. The simulation results show that the total scatter ing loss coefficient for the MOW structure is affected more strongly by surface roughness than that for the SOW struc ture. The total scattering loss coefficient of waveguide decreas es from 3.97 x 10^-2 dB/cm to 2.96 x 10^-4 dB/cm for the SOW structure and from 5.24 - 10^-2 dB/cm to 4.7 x 10^-4 dB/ cm for the MOW structure when surface roughness is from 300nm to 20nm and waveguide length is 100cm.

Ferroelectric Liquid Crystal Gates and Optical Computing

The surface stabilized ferroelectric liquid crystal device configuration and ferroelectric liquid crystal gates are described.The liquid crystal electrooptical gates have numerous applications,including optical computation,optodigital circuits,and optical communication networks.

基于深度神经网络的数据中心光互连网络资源分配方法

在人工智能环境下为了提高数据中心光互联网络组件和软件的安全性,需要构建优化的资源分配模型,提出基于深度神经网络的数据中心光互连网络资源分配方法。采用用户关联和功率谱分配联合优化方法构建数据中心光互连网络资源调度模型,结合对网络资源粒度的服务请求QoS资源配置实现对不同种类资源的融合和聚类处理,提取数据中心光互连网络资源的空间、时间、频谱等多维网格抽象模型参数,通过深度神经网络学习方法实现对网络资源分配过程中的多种资源粒度融合和收敛性寻优控制,建立用户之间分配数据中心光互连网络资源的信道模型,通过传输链路均衡配置方案实现对网络资源的优化分配和均衡配置。仿真结果表明,本方法的资源分配传输比特率为18 bit/s,延时较小,资源分配阻塞率低,为0.05%,且资源持有度较高,可始终维持在100%,说明本方法具有对较强的资源均衡配置能力。

Tailoring light on three-dimensional photonic chips: a platform for versatile OAM mode optical interconnects

Explosive growth in demand for data traffic has prompted exploration of the spatial dimension of lightwaves, which provides a degree of freedom to expand data transmission capacity. Various techniques basedon bulky optical devices have been proposed to tailor light waves in the spatial dimension. However, theirinherent large size, extra loss, and precise alignment requirements make these techniques relativelydifficult to implement in a compact and flexible way. In contrast, three-dimensional (3D) photonic chips withcompact size and low loss provide a promising miniaturized candidate for tailoring light in the spatialdimension. Significantly, they are attractive for chip-assisted short-distance spatial mode optical interconnectsthat are challenging to bulky optics. Here, we propose and fabricate femtosecond laser-inscribed 3D photonicchips to tailor orbital angular momentum (OAM) modes in the spatial dimension. Various functions on theplatform of 3D photonic chips are experimentally demonstrated, including the generation, (de)multiplexing,and exchange of OAM modes. Moreover, chip-chip and chip–fiber–chip short-distance optical interconnectsusing OAM modes are demonstrated in the experiment with favorable performance. This work paves the wayto flexibly tailor light waves on 3D photonic chips and offers a compact solution for versatile opticalinterconnects and other emerging applications with spatial modes.

Chiplet技术:拓展芯片设计的新边界

芯粒(Chiplet)是一种将多个小型芯片集成为一个完整的系统芯片的技术,旨在实现芯片的重用、异构集成、性能提升和成本降低等目标。该技术的发展重点主要包括异构集成、新型互连和新型封装。其中,接口互连是Chiplet技术的关键。接口互连包括物理层接口和数据传输协议,接口和协议的设计需要考虑工艺技术、封装技术、功耗限制和上层应用程序的要求等,串行互连和并行互连是芯片到芯片实体层接口的两种选择。此外,对于不同的传播介质,应运而生出一些新型的互连技术,如光互连和无线互连,它们可以提供更高的带宽、更低的功耗和更灵活的互连拓扑。未来,Chiplet技术有望为电子领域带来重大的突破和发展,促使更加高效、灵活和富有创新性的芯片设计和制造。

硅基集成光开关阵列的高速驱动控制电路设计

通过分析光开关单元的物理结构,提出等效电学模型,用于模拟光开关单元的瞬态响应.基于该模型,针对光开关阵列设计高速驱动控制电路,结合仿真探究电压尖峰对光开关单元瞬态响应的影响.系统测试结果表明,驱动电路施加的电压信号的上升/下降时间为1.7/1.6 ns,能够满足高速光开关纳秒级切换速度的需求.在该驱动电路的配合下,光开关阵列的切换时间为2.1~5.9 ns,实现了较先进的高速光交换系统.

数据中心互联开放光传输系统设计

介绍了云计算互联网络的结构以及数据中心互联开放光传输系统的演进和当前主流的光传输系统方案。结合数据中心互联的场景和业务特点,分析和介绍了开放光传输设备的硬件设计和软件设计。在系统设计方面,介绍了统一网管、高速保护系统、故障定位和止损系统。针对网络智能化需求,讨论了系统性能估计、故障预测以及数字孪生网络等技术。

高精度倒装焊机的光学对位系统

红外焦平面探测器芯片的像元阵列规模不断扩大,像元尺寸不断减小,与读出电路基板的精确互连变得愈加困难,对用于互连工艺核心设备倒装焊机提出了更高的要求。为实现探测器芯片与读出电路基板的精确互连,通过分析倒装焊接工艺的流程,得出芯片与基板的调平和对准是关键环节。介绍了倒装焊机光学对位系统的组成,并对其准直光路系统、显微成像系统、激光测距系统进行了研究。