Starting from the corrosion mechanism,this paper analyzes the characteristics of various types of stainless steel and selects the best performance composite plate composite plate stainless steel.Analyze and select the...Starting from the corrosion mechanism,this paper analyzes the characteristics of various types of stainless steel and selects the best performance composite plate composite plate stainless steel.Analyze and select the most suitable corrosion detection method based on specific practical multi working conditions,discuss the interference factors that affect metal corrosion during experimental simulation,and the advantages of newly developed sheet metal.The new development of composite board panels,with the substrate and composite materials applying their respective capabilities for MED,will bring breakthrough progress to the scientific research and engineering applica-tion of composite boards.展开更多
In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmeg...In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmega technologies in the experiment were 1 408 pieces per panel with four different patterns A, B, C and D and four resistance values of 25, 50, 75 and 100 fL Six panel per batch and four batches were performed totally. The testing was done for 960 pieces of integrated resistors randomly selected with the same size. The value distribution ranges and the relative standard deviation （RSD） show that the scatter degree of the resistance decreases with the resistor size increasing and/or with the resistance increasing. Patterns D with resistance of 75 and 100% for four patterns have the resistance value variances less than 10%. Patterns C and D with resistance of 100 Ω have the manufacturing tolerance less than 10%. The process capabilities are from about 0.6 to 1.6 for the designed testing patterns, which shows that the integrated resistors fabricated have the potential to be used in multilayer PCBs in the future.展开更多
作为有源相控阵天线阵面的核心部件,收发组件在整个有源天线阵面中的成本占比最高,因此如何降低收发组件的成本是设计天线阵面需要着重考虑的问题。与多芯片收发组件中常用的低温共烧陶瓷(Low Temperature Co-fired Ceramic,LTCC)多层...作为有源相控阵天线阵面的核心部件,收发组件在整个有源天线阵面中的成本占比最高,因此如何降低收发组件的成本是设计天线阵面需要着重考虑的问题。与多芯片收发组件中常用的低温共烧陶瓷(Low Temperature Co-fired Ceramic,LTCC)多层基板相比,多层印制板在成本方面具有很大优势。文中利用混压多层印制板,结合铝合金封装壳体,研制了一款Ku波段四通道低成本收发组件。该收发组件在工作频带内可以实现6位移相和6位幅度衰减,其通道接收增益≥20 dB,通道发射功率≥10 W。文中针对混压多层印制板热膨胀系数高、布线密度低、金丝键合可靠性差等问题,优化了基板叠层方案,研究了高密度互联通孔制作、基板镀层高可靠键合、低成本气密封装等关键工艺技术,有效提升了产品的可靠性,可为低成本混压多层印制板在多芯片组件中的工程化应用提供参考。展开更多
In this study,maize stalk tegument separated from the maize pith was crushed to obtain the fiber.The cross-linking maize starch adhesives considering four main factors(water content,gelatinization temperature,NaOH as ...In this study,maize stalk tegument separated from the maize pith was crushed to obtain the fiber.The cross-linking maize starch adhesives considering four main factors(water content,gelatinization temperature,NaOH as gelatinization agent and Na2B4O7·10H2O as cross-linking agent)with three levels were prepared based on an orthogonal test scheme L9(34)in order to increase the water-resisting property and the bonding strength of the common maize starch adhesives.The bonding properties of maize starch adhesives were characterized using shearing strength under compression loading.Physical models of fiber reinforced composites were established according to the microstructure analysis of the four species of insects’elytra including Protaetia orentalis,Copris ochus Motschulsky,Anoplophora chinensis and Cytister bengalensis Aube,which will provide the biomimetic models for the biomimetic laminated boards.The maize stalk fiber biomimetic laminated boards were prepared based on the structural models of the elytra material.The flexural strength and flexural elastic modulus of the biomimetic boards were examined.The results showed that the flexural strengths of the single layer jute fiber,-reinforced maize stalk fiber boards and the dual layer jute fiber reinforced maize stalk fiber boards are higher than those of the common maize stalk fiber boards and the other three groups of jute fiber hybrid reinforced stalk fiber boards because of the biomimetic laminated design.展开更多
文摘Starting from the corrosion mechanism,this paper analyzes the characteristics of various types of stainless steel and selects the best performance composite plate composite plate stainless steel.Analyze and select the most suitable corrosion detection method based on specific practical multi working conditions,discuss the interference factors that affect metal corrosion during experimental simulation,and the advantages of newly developed sheet metal.The new development of composite board panels,with the substrate and composite materials applying their respective capabilities for MED,will bring breakthrough progress to the scientific research and engineering applica-tion of composite boards.
基金Project(041010) supported by Start-Up Foundation of Northwest University,ChinaProject(UIT/39) supported by University-Industry Collaboration Program from the Innovation and Technology Fund of Hong Kong,China
文摘In order to utilize integrated passive technology in printed circuit boards （PCBs）, manufacturing processing for integrated resistors by lamination method was investigated. Integrated resistors fabricated from Ohmega technologies in the experiment were 1 408 pieces per panel with four different patterns A, B, C and D and four resistance values of 25, 50, 75 and 100 fL Six panel per batch and four batches were performed totally. The testing was done for 960 pieces of integrated resistors randomly selected with the same size. The value distribution ranges and the relative standard deviation （RSD） show that the scatter degree of the resistance decreases with the resistor size increasing and/or with the resistance increasing. Patterns D with resistance of 75 and 100% for four patterns have the resistance value variances less than 10%. Patterns C and D with resistance of 100 Ω have the manufacturing tolerance less than 10%. The process capabilities are from about 0.6 to 1.6 for the designed testing patterns, which shows that the integrated resistors fabricated have the potential to be used in multilayer PCBs in the future.
基金The project was supported by National Science Fund for Distinguished Young Scholars of China(Grant No.50025516)National Natural Science Foundation of China(Grant No.50675087,50673037,5030600131)+1 种基金“985 Project”of Jilin University,Natural Science Foundation of Henan Educational Committee(Grant No.2009B210006)Science Foundation(2008QN004)and Scientific Research Foundation for Ph.Doctor,Henan University of Science and Technology.
文摘In this study,maize stalk tegument separated from the maize pith was crushed to obtain the fiber.The cross-linking maize starch adhesives considering four main factors(water content,gelatinization temperature,NaOH as gelatinization agent and Na2B4O7·10H2O as cross-linking agent)with three levels were prepared based on an orthogonal test scheme L9(34)in order to increase the water-resisting property and the bonding strength of the common maize starch adhesives.The bonding properties of maize starch adhesives were characterized using shearing strength under compression loading.Physical models of fiber reinforced composites were established according to the microstructure analysis of the four species of insects’elytra including Protaetia orentalis,Copris ochus Motschulsky,Anoplophora chinensis and Cytister bengalensis Aube,which will provide the biomimetic models for the biomimetic laminated boards.The maize stalk fiber biomimetic laminated boards were prepared based on the structural models of the elytra material.The flexural strength and flexural elastic modulus of the biomimetic boards were examined.The results showed that the flexural strengths of the single layer jute fiber,-reinforced maize stalk fiber boards and the dual layer jute fiber reinforced maize stalk fiber boards are higher than those of the common maize stalk fiber boards and the other three groups of jute fiber hybrid reinforced stalk fiber boards because of the biomimetic laminated design.
