DBC substrates are the standard circuit boardsfor power modules. Using the DBC technologythick copper foils (0.125mm - 0.Tmm) arecladded to Alumina or Aluminum Nitride,The strong adhesion of the copper to ceramicbond ...DBC substrates are the standard circuit boardsfor power modules. Using the DBC technologythick copper foils (0.125mm - 0.Tmm) arecladded to Alumina or Aluminum Nitride,The strong adhesion of the copper to ceramicbond reduces the thermal expansion coefficientin horizontal direction only slightly above theTEC of the ceramic itself. This allows directsilicon attach of large dies without using TECcontrolling layers.As DBC technology is using copper foils,integralleads overhanging the ceramic can be realized...展开更多
The direct deposition of diamond films on copper substrate has been suffered fromadhesion problems due to the mismatch of the thermal expansion coefficients of diamond andcopper. In this paper nuclei with valuable den...The direct deposition of diamond films on copper substrate has been suffered fromadhesion problems due to the mismatch of the thermal expansion coefficients of diamond andcopper. In this paper nuclei with valuable density were directly introduced thirough a submicrondiamond powder layer. The diamond grits partially were buried in the copper substrate leadingto better adhesion. Another method with nickel intermediate layer for enhancing the adhesionwas studied here in detail. It was suggested that Cu-Ni eutectic between the copper substrate andNi interlayer might contribute to the adhesion improvement. The quality of the diamond filmsdeposited wlth rnckel interlayer was investigated by scanning electron microscopy and Ramanspectroscopy.展开更多
It was reported that hemispheric corrosion occurred in copper tubes in an acetic acid environment. When hemispheric corrosion occurred, corrosion could easily progress if water then flowed into the copper pipe, and co...It was reported that hemispheric corrosion occurred in copper tubes in an acetic acid environment. When hemispheric corrosion occurred, corrosion could easily progress if water then flowed into the copper pipe, and countermeasures were needed. Therefore, we studied the copper corrosion caused by acetic acid. The present work investigated the relationship between the corrosion form of copper and acetic acid concentration using phosphorous-deoxidized copper, and reported that hemispherical corrosion was observed at acetic acid concentrations of 0.01 to 1 vol.% (0.002 to 0.2 mol·L<sup>-1</sup>) in the immersion test. In this study, the effects of acetic acid and phosphate on copper corrosion were examined using oxygen-free copper in immersion tests. The results suggested that different concentrations of phosphate in acetic acid solutions and the presence or absence of acetic acid and phosphate affected the corrosion of copper, resulting in different corrosion forms and corrosion progress.展开更多
Purpose Niobium sputtered on copper has been a popular alternative approach for superconducting radio frequency(SRF)community in the last few decades.Comparing to bulk materials of a few millimeters,high-purity niobiu...Purpose Niobium sputtered on copper has been a popular alternative approach for superconducting radio frequency(SRF)community in the last few decades.Comparing to bulk materials of a few millimeters,high-purity niobium of merely a few microns is sufficient to realize superconductivity on the coated surface.Being niobium thin film,it has been widely acknowledged that surface quality of the substrate plays a vital role in obtaining a superior niobium coating with excellent SRF performance.Therefore,proper chemical treatment of the substrate before coating is crucial and the ultimate goal is to create a smooth and defect-free surface.Prior to the design of a cavity etching system,the mechanism of SUBU as well as two industry-used solutions is studied in detail on samples.Methods Copper samples were first pre-treated by mechanical grinding to remove fabrication damages,obvious defects and visible impurities.Two chemical solutions widely used in industries were subsequently chosen to etch the samples.Finally,the established SUBU solution was used independently on these pre-treated samples for comparison.Surface morphology and etching rate were measured accordingly.Results and conclusions Mirror-like copper surface was created by using the SUBU solution thus qualified for subsequent niobium sputtering,while the other two solutions used in industries were less effective with nonideal surface morphology.The chemical reactions,the experimental requisites and the involved processes are extensively elucidated for all three solutions.Limitations for SUBU were examined,and the optimum ratio of the chemical bath volume to sample surface area was also determined.These investigations will serve as an important guidance for the development of a chemical etching system for elliptical copper cavities.展开更多
文摘DBC substrates are the standard circuit boardsfor power modules. Using the DBC technologythick copper foils (0.125mm - 0.Tmm) arecladded to Alumina or Aluminum Nitride,The strong adhesion of the copper to ceramicbond reduces the thermal expansion coefficientin horizontal direction only slightly above theTEC of the ceramic itself. This allows directsilicon attach of large dies without using TECcontrolling layers.As DBC technology is using copper foils,integralleads overhanging the ceramic can be realized...
文摘The direct deposition of diamond films on copper substrate has been suffered fromadhesion problems due to the mismatch of the thermal expansion coefficients of diamond andcopper. In this paper nuclei with valuable density were directly introduced thirough a submicrondiamond powder layer. The diamond grits partially were buried in the copper substrate leadingto better adhesion. Another method with nickel intermediate layer for enhancing the adhesionwas studied here in detail. It was suggested that Cu-Ni eutectic between the copper substrate andNi interlayer might contribute to the adhesion improvement. The quality of the diamond filmsdeposited wlth rnckel interlayer was investigated by scanning electron microscopy and Ramanspectroscopy.
文摘It was reported that hemispheric corrosion occurred in copper tubes in an acetic acid environment. When hemispheric corrosion occurred, corrosion could easily progress if water then flowed into the copper pipe, and countermeasures were needed. Therefore, we studied the copper corrosion caused by acetic acid. The present work investigated the relationship between the corrosion form of copper and acetic acid concentration using phosphorous-deoxidized copper, and reported that hemispherical corrosion was observed at acetic acid concentrations of 0.01 to 1 vol.% (0.002 to 0.2 mol·L<sup>-1</sup>) in the immersion test. In this study, the effects of acetic acid and phosphate on copper corrosion were examined using oxygen-free copper in immersion tests. The results suggested that different concentrations of phosphate in acetic acid solutions and the presence or absence of acetic acid and phosphate affected the corrosion of copper, resulting in different corrosion forms and corrosion progress.
基金Wewould like to thank Dr.ChaoDong for helping with sample characterizations.We are especially grateful to LNER-team at IHEP for providing the laboratory and necessary facilities for chemical experiments.This work has been supported by the Platform for Advanced Photon Source Technology(PAPS)project and Pioneer“Hundred Talents Program”of Chinese Academy of Sciences.
文摘Purpose Niobium sputtered on copper has been a popular alternative approach for superconducting radio frequency(SRF)community in the last few decades.Comparing to bulk materials of a few millimeters,high-purity niobium of merely a few microns is sufficient to realize superconductivity on the coated surface.Being niobium thin film,it has been widely acknowledged that surface quality of the substrate plays a vital role in obtaining a superior niobium coating with excellent SRF performance.Therefore,proper chemical treatment of the substrate before coating is crucial and the ultimate goal is to create a smooth and defect-free surface.Prior to the design of a cavity etching system,the mechanism of SUBU as well as two industry-used solutions is studied in detail on samples.Methods Copper samples were first pre-treated by mechanical grinding to remove fabrication damages,obvious defects and visible impurities.Two chemical solutions widely used in industries were subsequently chosen to etch the samples.Finally,the established SUBU solution was used independently on these pre-treated samples for comparison.Surface morphology and etching rate were measured accordingly.Results and conclusions Mirror-like copper surface was created by using the SUBU solution thus qualified for subsequent niobium sputtering,while the other two solutions used in industries were less effective with nonideal surface morphology.The chemical reactions,the experimental requisites and the involved processes are extensively elucidated for all three solutions.Limitations for SUBU were examined,and the optimum ratio of the chemical bath volume to sample surface area was also determined.These investigations will serve as an important guidance for the development of a chemical etching system for elliptical copper cavities.
