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QUALITY CONTROL OF SEMICONDUCTOR PACKAGING BASED ON PRINCIPAL COMPONENTS ANALYSIS 被引量:2
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作者 HE Shuguang QI Ershi HE Zhen NIE Bin 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2007年第6期84-86,共3页
5 critical quality characteristics must be controlled in the surface mount and wire-bond process in semiconductor packaging. And these characteristics are correlated with each other. So the principal components analy... 5 critical quality characteristics must be controlled in the surface mount and wire-bond process in semiconductor packaging. And these characteristics are correlated with each other. So the principal components analysis(PCA) is used in the analysis of the sample data firstly. And then the process is controlled with hotelling T^2 control chart for the first several principal components which contain sufficient information. Furthermore, a software tool is developed for this kind of problems. And with sample data from a surface mounting device(SMD) process, it is demonstrated that the T^2 control chart with PCA gets the same conclusion as without PCA, but the problem is transformed from high-dimensional one to a lower dimensional one, i.e., from 5 to 2 in this demonstration. 展开更多
关键词 Semiconductor packaging Principal components analysis Quality control
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Main Components of the WB’s Reform Package
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《Beijing Review》 2010年第18期33-33,共1页
1. Financial Resources: ● an increase of $86.2 billion in capital for the International Bank for Reconstruction and Development (IBRD), and ● a $200-million increase in the capital of the International Finance Corp.... 1. Financial Resources: ● an increase of $86.2 billion in capital for the International Bank for Reconstruction and Development (IBRD), and ● a $200-million increase in the capital of the International Finance Corp. (IFC), the World Bank Group’s private sector arm. 2. Voting Power: ● a 3.13-percentage point increase in the voting power of Developing and Transition countries (DTCs) 展开更多
关键词 Main components of the WB’s Reform package
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