STUDY ON THE SURFACE OF TITANIUM CARBIDE PARTICLE PACKAGED NICKEL

Two kinds of packaged processes by nickel on the surface of titanium carbide particle are studied in this work. One is the chemical nickel-plating, the other is the organometallic compound decomposition. The composition, structure and morphology of the packaged powder were analyzed with XRD, DAT/TGA, SEM, EPMA etc. It has been shown that nickel was even dispersed on the surface of titanium carbide particle by the. two kinds of processes, deposited nickel exists as spherical particles of about 0.1 μm in diameter. The merits and demerits of the two kinds of processes have been compared, the organometallic copmound decomposition among them is a kind of hopeful method, which is not used by other researchers.

Real-Time Anomaly Detection in Packaged Food X-Ray Images Using Supervised Learning

Physical contamination of food occurs when it comes into contact with foreign objects.Foreign objects can be introduced to food at any time during food delivery and packaging and can cause serious concerns such as broken teeth or choking.Therefore,a preventive method that can detect and remove foreign objects in advance is required.Several studies have attempted to detect defective products using deep learning networks.Because it is difficult to obtain foreign object-containing food data from industry,most studies on industrial anomaly detection have used unsupervised learning methods.This paper proposes a new method for real-time anomaly detection in packaged food products using a supervised learning network.In this study,a realistic X-ray image training dataset was constructed by augmenting foreign objects with normal product images in a cut-paste manner.Based on the augmented training dataset,we trained YOLOv4,a real-time object detection network,and detected foreign objects in the test data.We evaluated this method on images of pasta,snacks,pistachios,and red beans under the same conditions.The results show that the normal and defective products were classified with an accuracy of at least 94%for all packaged foods.For detecting foreign objects that are typically difficult to detect using the unsupervised learning and traditional methods,the proposed method achieved high-performance realtime anomaly detection.In addition,to eliminate the loss in high-resolution X-ray images,the false positive rate and accuracy could be lowered to 5%with patch-based training and a new post-processing algorithm.

Hazard Identification and Risk Assessment-Based Water Safety Plan for Packaged Water Production Companies in Abeokuta, South West Nigeria

Provision of quality drinking water is paramount for sustaining good public health in urban residents. Packaged water produced and consumed across cities in Nigeria lacks integrity in protecting Health. Water safety plan based on hazard identification and risk assessment in each component of the water production system is essential in providing quality water by packaged water producing companies in Nigeria. This study aims at developing water safety plan for selected packaged water manufacturing companies in Abeokuta, Ogun State, Nigeria. Hazard identification and risk assessment were carried out based on site inspection studies, key informant interview, questionnaire survey and water sample analysis, and risk analysis using semi-quantitative risk matrix approach. The results revealed a total of 26 possible hazardous events which may compromise water quality such as on-site septic tanks and effluents discharged at source water and improper maintenance and hygiene practices within the system. Based on these, appropriate mitigation and monitoring plans were drawn for action. The research found that water safety plan is feasible for the packaged water systems, and therefore calls on the relevant stakeholders for urgent implementation towards ensuring clean drinking water and protecting public health as more and more people are opting for packaged waters due to uncertain public water safety.

Meta to the Rescue—Augmented Metamodels for Better Deployment of Pre-Packaged Applications

Recent estimates indicate that more than half the software market belongs to enterprise applications. One of the greatest challenges in these is in conducting the complex process of adaptation of pre-packaged applications, such as Oracle or SAP, to the organization needs. Although very detailed, structured and well documented methods govern this process, the consulting team implementing the method must spend much manual effort in making sure that the guidelines of the method are followed as intended by the method author. The problem is exacerbated by the diversity of skills and roles of team members, and the many sorts of communications of collaboration that methods prescribe. By enhancing the metamodel in which the methods are defined, we automatically produce a CASE tool (so to speak) for the applications of these methods. Our results are successfully employed in a number of large, ongoing projects with demonstrable, non-meager saving.

The Design Secret of the Cosmetics Packaged Marketing

The cosmetics industry has entered the era of professional marketing, advanced promotion, refined service, and scientific design of customer order marketing. The previous era of one lipstick or one mascara marketing, or one BB cream to be performed as the terminal strategy has gone. Consumers have been through ignorant to rational and to today’s professional consumption era. As brand owners and agents, as well as store operators, it is a must to possess industry knowledge and professionalism to better serve customers. Sometimes customers are more professional than the sellers, under this situation, there will be no way out for the old service style.

Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser diodes

Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method.The microstructures of Au80Sn20 solder were then investigated to understand the reason for the difference in thermal resistance.It was found that the microstructure with a higher content of Au-rich phase in the center of the solder and a lower content of(Au,Ni)Sn phase at the interface of the solder/heat sink resulted in lower thermal resistance.This is attributed to the lower thermal resistance of Au-rich phase and higher thermal resistance of(Au,Ni)Sn phase.

Aged Vacuum Packaged Lamb Cuts Are Less Brown than Fresh Muscle Cuts under Simulated Retail Display

Fifty four, seven month old lambs, that had grazed perennial or annual pasture, were slaughtered and at 24 h post mortem m. longissimus lumborum samples were collected. Half of the fresh muscle section was sliced into three pieces and overwrapped with 15 micron polyvinyl chloride film and displayed under light (Lux = 1500) at 3℃ - 4℃. The remainder of the muscle section was vacuum packaged and aged for 4 weeks at 3℃, before slicing and display. Surface brownness and redness were measured over 3 days of simulated retail display. Aging in vacuum packs led to substantially less brownness and greater redness compared with fresh meat, over the entire three days of display. It was concluded that aging in vacuum packs could be a useful strategy for improving consumer acceptability of retail lamb in local markets, even where there is no logistical or transport need to extend the life of the meat.

Co‑packaged optics(CPO):status,challenges,and solutions

Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology.

A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module

Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint.

Sustainable, thermoplastic and hydrophobic coating from natural cellulose and cinnamon to fabricate eco-friendly catering packaging

Non-degradable polymers cause serious environmental pollution problem,such as the widely-used while unrecyclable coatings which significantly affect the overall degradation performance of products.It is imperative and attractive to develop biodegradable functional coatings.Herein,we proposed a novel strategy to successfully prepare biodegradable,thermoplastic and hydrophobic coatings with high transparence and biosafety by weakening the interchain interactions between cellulose chain.The natural cellulose and cinnamic acid were as raw materials.Via reducing the degree of polymerization(DP)of cellulose and regulating the degree of substitution(DS)of cinnamate moiety,the obtained cellulose cinnamate(CC)exhibited not only the thermalflow behavior but also good biodegradability,which solves the conflict between the thermoplasticity and biodegradability in cellulose-based materials.The glass transition temperature(T_(g))and thermalflow temperature(T_(f))of the CC could be adjusted in a range of 150–200℃ and 180–210℃,respectively.The CC with DS<1.2 and DP≤100 degraded more than 60%after an enzyme treatment for 7 days,and degraded more than 80%after a composting treatment for 42 days.Furthermore,CC had no toxicity to human epidermal cells even at a high concentration(0.5 mg mL^(-1)).In addition,CC could be easily fabricated into multifunctional coating with high hydrophobicity,thermal adhesion and high transparence.Therefore,after combining with cellophane and paperboard,CC coating with low DP and DS could be used to prepare fully-biodegradable heat-sealing packaging,art paper,paper cups,paper straws and food packaging boxes.

Silicon-based optoelectronic heterogeneous integration for optical interconnection

The performance of optical interconnection has improved dramatically in recent years.Silicon-based optoelectronic heterogeneous integration is the key enabler to achieve high performance optical interconnection,which not only provides the optical gain which is absent from native Si substrates and enables complete photonic functionalities on chip,but also improves the system performance through advanced heterogeneous integrated packaging.This paper reviews recent progress of silicon-based optoelectronic heterogeneous integration in high performance optical interconnection.The research status,development trend and application of ultra-low loss optical waveguides,high-speed detectors,high-speed modulators,lasers and 2D,2.5D,3D and monolithic integration are focused on.

Effects of diamond particle size on microstructure and properties of diamond/Al-12Si composites prepared by vacuum-assisted pressure infiltration

Diamond/aluminium composites have attracted attention in the field of thermal management of electronic packaging for their excellent properties.In order to solve the interfacial problem between diamond and aluminium,a novel process combining pressure infiltration with vacuum-assisted technology was proposed to prepare diamond/aluminum composites.The effect of diamond particle size on the microstructure and properties of the diamond/Al-12Si composites was investigated.The results show that the diamond/Al-12Si composites exhibit high relative density and a uniform microstructure.Both thermal conductivity and coefficient of thermal expansion increase with increasing particle size,while the bending strength exhibits the opposite trend.When the average diamond particle size increases from 45μm to 425μm,the thermal conductivity of the composites increases from 455 W·m^(-1)·K^(-1)to 713 W·m^(-1)·K^(-1)and the coefficient of thermal expansion increases from 4.97×10^(-6)K^(-1)to 6.72×10^(-6)K^(-1),while the bending strength decreases from 353 MPa to 246 MPa.This research demonstrates that high-quality composites can be prepared by the vacuum-assisted pressure infiltration process and the thermal conductivity of the composites can be effectively improved by increasing the diamond particle size.

Analysis of quality-related proteins in golden pompano(Trachinotus ovatus)fillets with modified atmosphere packaging under superchilling storage

Here,we aimed to study the changes in proteome of golden pompano fillets during post-mortem storage.Tandem mass tags(TMT)-labeled quantitative proteomic strategy was applied to investigate the relationships between protein changes and quality characteristics of modified atmosphere packaging(MAP)fillets during superchilling(-3°C)storage.Scanning electron microscopy was used to show that the muscle histology microstructure of fillets was damaged to varying degrees,and low-field nuclear magnetic resonance was used to find that the immobilized water and free water in the muscle of fillets changed significantly.Total sulfhydryl content,TCA-soluble peptides and Ca2+-ATPase activity also showed that the fillet protein had a deterioration by oxidation and denaturation.The Fresh(FS),MAP,and air packaging(AP)groups were set.Total of 150 proteins were identified as differential abundant proteins(DAPs)in MAP/FS,while 209 DAPs were in AP/FS group.The KEGG pathway analysis indicated that most DAPs were involved in binding proteins and protein turnover.Correlation analysis found that 52 DAPs were correlated with quality traits.Among them,8 highly correlated DAPs are expected to be used as potential quality markers for protein oxidation and water-holding capacity.These results provide a further understanding of the muscle deterioration mechanism of packaging golden pompano fillets during superchilling.

Synergism of Zinc Oxide/Organoclay-Loaded Poly(lactic acid) Hybrid Nanocomposite Plasticized by Triacetin for Sustainable Active Food Packaging

The synergistic effect of organoclay(OC)and zinc oxide(ZnO)nanoparticles on the crucial properties of poly(lactic acid)(PLA)nanocompositefilms was systematically investigated herein.After their incorporation into PLA via the solvent casting technique,the water vapor barrier property of the PLA/OC/ZnOfilm improved by a maximum of 86%compared to the neat PLAfilm without the deterioration of Young’s modulus or the tensile strength.Moreover,thefilm’s self-antibacterial activity against foodborne pathogens,including gram-negative(Escherichia coli,E.coli)and gram-positive(Staphylococcus aureus,S.aureus)bacteria,was enhanced by a max-imum of approximately 98–99%compared to the neat PLAfilm.Furthermore,SEM images revealed the homo-geneous dispersion of both nano-fillers in the PLA matrix.However,the thermal stability of thefilm decreased slightly after the addition of the OC and ZnO.Thefilm exhibited notable light barrier properties in the UV-Vis range.Moreover,the incorporation of a suitable biodegradable plasticizer significantly decreased the Tg and notably enhanced theflexibility of the nanocompositefilm by increasing the elongation at break approxi-mately 1.5-fold compared to that of the neat PLAfilm.This contributes to its feasibility as an active food packa-ging material.

Modified Atmospheric Packaging and Its Effect on Postharvest Cannabis Quality

Cannabis sativa L. is used as fiber, food, and medicine in several countries. Though it is illegal for recreational use in most of the world, there are some countries that have legalized production and sale. There is a lot of research on production of cannabis, but less so on storage technologies. Cannabis contains several high value compounds, such as cannabinoids and terpenoids, that are susceptible to degradation via light, temperature, and oxygen. Several studies have explored temperature and light, and industry has adjusted accordingly. However, less is known about oxygen-induced degradation. Biochemical studies have demonstrated oxidative degradation of high value compounds, and many producers use some form of modified atmospheric packaging (MAP) for storage. However, the efficacy of MAP is unclear. The objective of this paper is to review our current understanding of MAP in postharvest cannabis storage and identify avenues where additional research is needed.

Study on the Influence of Food Packaging on the Psychology of Different Groups of Consumers

With the vigorous development of consumer culture in today’s society,various types of food packaging also appear in front of consumers in different forms.There are very big differences in food packaging in terms of shape,color,style and other aspects of information transmission,which have the most direct impact on the audience’s food consumption needs.Driven by the consumption-oriented society,food packaging has shown very obvious comprehensive characteristics,is significantly interdisciplinary,and has close connections with other disciplines.This article will analyze and sort out the impact of food packaging on consumer psychology from different perspectives.

Research on Silicon Carbide Dispersion-Reinforced Hypereutectic Aluminum-Silicon Electronic Packaging Materials

The objective of this study is to improve the mechanical properties and machining performance of high thermal conductivity and low expansion silicon carbide dispersion-strengthened hypereutectic aluminum-silicon electronic packaging materials to meet the needs of aviation,aerospace,and electronic packaging fields.We used the powder metallurgy method and high-temperature hot pressing technology to prepare SiC/Al-Si composite materials with different SiC contents(5vol%,10vol%,15vol%,and 20vol%).The results showed that as the SiC content increased,the tensile strength of the composite material first increased and then decreased.The tensile strength was the highest when the SiC content was 15%;the sintering temperature significantly affected the composite material’s structural density and mechanical properties.Findings indicated 700℃was the optimal sintering and the optimal SiC content of SiC/Al-Si composite materials was between 10%and 15%.Besides,the sintering temperature should be strictly controlled to improve the material’s structural density and mechanical properties.

Long-term performance of packaged fiber Bragg grating sensors for strain monitoring inside creep medium

To investigate the long-term performance of the packaged fiber Bragg grating(FBG)sensors embedded in civil infrastructure for strain monitoring,in this paper,the influence of host matrix’s creep effect on the behavior of the FBG sensors was systematically studied through theoretical,numerical,and experimental analysis.A theoretical strain transfer analysis between the optic fiber,packaging layer,and host matrix to consider the creep effect of the host matrix was performed accordingly for long-term strain monitoring.Parametric studies were carried out using numerical analysis for FBG sensors packaged with glass fiber reinforced plastic(GFRP),also known as FBG-GFRP sensors in concrete,as an example.The results show that embedded in a creep medium,an acceptable long-term performance of packaged FBG sensors requires the packaging layer to have a minimum length and maximum thickness.Laboratory long-term creep tests using epoxy resin and concrete as host matrix for FBG-GFRP sensors also clearly demonstrated that the influence of creep effect cannot be ignored for strain measurements if the host matrix has a creep potential and the developed correction model performed well to reduce measurement errors of such sensors in creep medium.

Regulation of thermoelastic properties of concave-packaged DNA adsorption films and its relevant microcantilever detection signals

The packing patterns have close correlation with the thermoelastic properties of DNA adsorption films and the relevant detection signals of microcantilevers.In this paper,we investigate the influence of packing patterns on the thermoelastic properties of DNA adsorption films,the detection signals of microcantilevers and their temperature dependence.First,the Parsegian's empirical potential based on a mesoscopic liquid crystal theory is employed to describe the interaction energy among coarse-grained DNA cylinders;then,the thought experiment method and the force balance method of nonlinear elastic network nodes are combined to characterize the elastic modulus,prestress and thermal expansion coefficient of DNA adsorption films;finally,based on an effective macroscopic continuum model for DNA microbeam deformation,we study the microcantilever resonance frequency shifts caused by DNA adsorptions and the temperature effect on the microcantilever static deflections,respectively.Results show that,compared with the convex-packaged,the re-entrant honeycomb packing pattern endows DNA adsorption films with a larger adjustable range of the elastic modulus and prestress,so as to make DNA-microcantilevers having an enhanced dynamic detection signal whereas a weaker response to temperature variation.These results are expected to provide a new option for the regulation design of DNA composite materials and microbeam sensors.

Micro packaged MEMS pressure sensor for intracranial pressure measurement

This paper presents a micro packaged MEMS pressure sensor for intracranial pressure measurement which belongs to BioMEMS. It can be used in lumbar puncture surgery to measure intracranial pressure. Minia- turization is key for lumbar puncture surgery because the sensor must be small enough to allow it be placed in the reagent chamber of the lumbar puncture needle. The size of the sensor is decided by the size of the sensor chip and package. Our sensor chip is based on silicon piezoresistive effect and the size is 400 × 400 μm2. It is much smaller than the reported polymer intracranial pressure sensors such as liquid crystal polymer sensors. In terms of package, the traditional dual in-line package obviously could not match the size need, the minimal size of recently reported MEMS-based intracranial pressure sensors after packaging is 10 × 10 mm2. In this work, we are the first to introduce a quad flat no-lead package as the package form of piezoresistive intracranial pressure sensors, the whole size of the sensor is minimized to only 3 × 3 mm2. Considering the liquid measurement environment, the sensor is gummed and waterproof performance is tested; the sensitivity of the sensor is 0.9 × 10-2 mV/kPa.