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Precipitation of μ Phase in Nickel-based Powder Metallurgy Superalloy FGH97 被引量:1
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作者 Li-ming TAN Yi-wen ZHANG +1 位作者 Jian JIA Shou-bo HAN 《Journal of Iron and Steel Research International》 SCIE EI CAS CSCD 2016年第8期851-856,共6页
The precipitation behavior of topological close-packed(TCP)μphase in powder metallurgy(P/M)nickelbased superalloy FGH97 was investigated.The results showed that proper addition of solution strengthening elements,... The precipitation behavior of topological close-packed(TCP)μphase in powder metallurgy(P/M)nickelbased superalloy FGH97 was investigated.The results showed that proper addition of solution strengthening elements,such as Co,Cr,W,Mo,improved tensile strength,while excessive addition of those elements facilitated the precipitation ofμphase,which seriously aggravated the plasticity of the P/M superalloy.For the heat-treated specimens,the relationship between critical aging time(whenμstarted to precipitate),aging temperature,and the average electron vacancy number ofγmatrix was established. 展开更多
关键词 superalloy precipitate tensile plasticity seriously Precipitation topological strengthening packed metallurgy
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Thermal Deformation Measurement and Stress Analysis of PQFP Assembly during Power Cycling
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作者 戴福隆 石玲 温秀梅 《Tsinghua Science and Technology》 SCIE EI CAS 1998年第2期25-31,共7页
The three dimensional displacements fields in a surface mounted plastic quad flat pack (PQFP) assembly are measured during power cycling using a combination of holographic interferometry and high sensitivity moire int... The three dimensional displacements fields in a surface mounted plastic quad flat pack (PQFP) assembly are measured during power cycling using a combination of holographic interferometry and high sensitivity moire interferometry. Detailed in plane and out of plane whole field displacement data of the top and bottom ends of the gull wing leads and their distributions along the edge of PQFP are provided. The maximum deformations of the gull wing leads occur at the four corners of the PQFP. The experimental results are used as displacement boundary condition in a linear elastic analysis of the thermal stresses of the corner lead and its solder joint using a 3 D finite element method (FEM). The highest stresses occur in the area connecting the lead and the solder joint. The results should be useful in the evaluation of thermal fatigue damage of surface mount assemblies. 展开更多
关键词 plastic quad flat pack (PQFP) holographic interferometry moire interferometry printed circuit boards (PCB) thermal deformation
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