For manufacturing low-formaldehyde emission particleboard from wheat straw and urea-formaldehyde （UF） resins using urea treatment for indoor environments, we investigated the influence of urea treatment on the forma...For manufacturing low-formaldehyde emission particleboard from wheat straw and urea-formaldehyde （UF） resins using urea treatment for indoor environments, we investigated the influence of urea treatment on the formaldehyde emission, physical and mechanical properties of the manufactured particleboard. Wheat straws were treated at three levels of urea concentration （5%, 10%, 15%） and 95℃ as holding temperature. Wheat straw particleboards were manufactured using hot press at 180℃ and 3 MPa with two types of UF adhesive （UF-45, UF-91）. Then the formaldehyde emission values, physical properties and mechanical properties were considered. The results show that the for- maldehyde emission value was decreased by increasing urea concentration. Furthermore, the results indicate that the specimens under urea treatment have better mechanical and physical properties compared with control specimens. Also specimens under urea treatment at 10% concentration and UF-91 type adhesive have the most optimum physical and mechanical strength.展开更多
We studied formaldehyde emission from uncoated particleboard with 16-mm thickness using the large chamber and the desiccator method. A chamber of 28.4 m3 was installed to simulate a mobile home. The formaldehyde off-g...We studied formaldehyde emission from uncoated particleboard with 16-mm thickness using the large chamber and the desiccator method. A chamber of 28.4 m3 was installed to simulate a mobile home. The formaldehyde off-gassing properties of particleboard were evaluated using the chamber. The relationship between the concentration obtained by the chamber and the values by the desiccator test was discussed in this study under different conditions of conditioning day, air exchange, and loading ratio. These two methods were compared and discussed regarding the formaldehyde emission level. Three loading ratios, 0.429 m2/m3, 0.264 m2/m3, and 0.132 m2/m3, were chosen to represent different applications of particleboard products. There was strong correlation between emissions and air exchange rates at equal product-loading ratios in the large chamber, the related coefficient R 2 exceeded 0.90. There was also an indication of a generic correlation between the large chamber and the two-hour desiccator test with a single product designated loading ratio, air exchange rate, and climatic conditions.展开更多
Urea-formaldehyde （UF） adhesive is the main source of formaldehyde emission from UF-bonded boards. The components in waste tea leaves can react with formaldehyde to serve as a raw material in the production of low f...Urea-formaldehyde （UF） adhesive is the main source of formaldehyde emission from UF-bonded boards. The components in waste tea leaves can react with formaldehyde to serve as a raw material in the production of low formaldehyde emission boards. In our study, waste tea leaves and UF adhesive were employed in the preparation of waste tea leaves particleboard （WTLB）. An orthogonal experimental method was applied to investigate the effects of process parameters on formaldehyde emission and mechanical properties of WTLB. The results indicated that： 1） waste tea leaves had the ability to abate formaldehyde emission from boards; and 2） density of the WTLB was a significant factor affecting its modulus of rupture （MOR）, modulus of elasticity （MOE） and internal bonding （IB）.展开更多
文摘For manufacturing low-formaldehyde emission particleboard from wheat straw and urea-formaldehyde （UF） resins using urea treatment for indoor environments, we investigated the influence of urea treatment on the formaldehyde emission, physical and mechanical properties of the manufactured particleboard. Wheat straws were treated at three levels of urea concentration （5%, 10%, 15%） and 95℃ as holding temperature. Wheat straw particleboards were manufactured using hot press at 180℃ and 3 MPa with two types of UF adhesive （UF-45, UF-91）. Then the formaldehyde emission values, physical properties and mechanical properties were considered. The results show that the for- maldehyde emission value was decreased by increasing urea concentration. Furthermore, the results indicate that the specimens under urea treatment have better mechanical and physical properties compared with control specimens. Also specimens under urea treatment at 10% concentration and UF-91 type adhesive have the most optimum physical and mechanical strength.
基金supported by the Special Fund of key discipline-Wood Science and Technology Zhejiang A & FUniversity (Project 201203)Jiangsu Overseas Research & Training Program for University Prominent Young & Middle-aged Teachers and Presidents
文摘We studied formaldehyde emission from uncoated particleboard with 16-mm thickness using the large chamber and the desiccator method. A chamber of 28.4 m3 was installed to simulate a mobile home. The formaldehyde off-gassing properties of particleboard were evaluated using the chamber. The relationship between the concentration obtained by the chamber and the values by the desiccator test was discussed in this study under different conditions of conditioning day, air exchange, and loading ratio. These two methods were compared and discussed regarding the formaldehyde emission level. Three loading ratios, 0.429 m2/m3, 0.264 m2/m3, and 0.132 m2/m3, were chosen to represent different applications of particleboard products. There was strong correlation between emissions and air exchange rates at equal product-loading ratios in the large chamber, the related coefficient R 2 exceeded 0.90. There was also an indication of a generic correlation between the large chamber and the two-hour desiccator test with a single product designated loading ratio, air exchange rate, and climatic conditions.
文摘Urea-formaldehyde （UF） adhesive is the main source of formaldehyde emission from UF-bonded boards. The components in waste tea leaves can react with formaldehyde to serve as a raw material in the production of low formaldehyde emission boards. In our study, waste tea leaves and UF adhesive were employed in the preparation of waste tea leaves particleboard （WTLB）. An orthogonal experimental method was applied to investigate the effects of process parameters on formaldehyde emission and mechanical properties of WTLB. The results indicated that： 1） waste tea leaves had the ability to abate formaldehyde emission from boards; and 2） density of the WTLB was a significant factor affecting its modulus of rupture （MOR）, modulus of elasticity （MOE） and internal bonding （IB）.
