Design of patterned sapphire substrates for GaN-based light-emitting diodes

A new method for patterned sapphire substrate （PSS） design is developed and proven to be reliable and cost-effective. As progress is made with LEDs＇ luminous efficiency, the pattern units of PSS become more complicated, and the effect of complicated geometrical features is almost impossible to study systematically by experiments only. By employing our new method, the influence of pattern parameters can be systematically studied, and various novel patterns are designed and optimized within a reasonable time span, with great improvement in LEDs＇ light extraction efficiency （LEE）. Clearly, PSS pattern design with such a method deserves particular attention. We foresee that GaN-based LEDs on these newly designed PSSs will achieve more progress in the coming years.

Improving InGaN-LED performance by optimizing the patterned sapphire substrate shape

The epitaxial growths of GaN films and GaN-based LEDs on various patterned sapphire substrates （PSSes） with different values of fill factor （f） and slanted angle （0） are investigated in detail. The threading dislocation （TD） density is lower in the film grown on the PSS with a smaller fill factor, resulting in a higher internal quantum efficiency （IQE）. Also the ability of the LED to withstand the electrostatic discharge （ESD） increases as the fill factor decreases. The illumination output power of the LED is affected by both 0 and f. It is found that the illumination output power of the LED grown on the PSS with a lower production of tan 0 and f is higher than that with a higher production of tan 0 and f.

Enhancement of InGaN-Based Light Emitting Diodes Performance Grown on Cone-Shaped Pattern Sapphire Substrates

To enhance light extraction effciency, high-quality InGaN-based light emitting diodes (LED) was grown on cone-shaped patterned sapphire (CPSS) by using metal organic chemical vapor deposition (MOCVD). From the transmission electron microscopy (TEM) observation, the CPSS was confirmed to be an efficient way to reduce the threading dislocation density in the GaN epilayer. A sharp and high intensity Photoluminescence (PL) for LED on CPSS at 457 nm compared to LED on unpattern planar sapphire substrates (USS) indicates that the crystalline quality was improved significantly and the internal reflection on the cones of the substrate was enhanced. The output power of the LED on CPSS is higher than that of LED on USS. The achieved improvement of the output power is not only due to the improvement of the internal quantum efficiency upon decreasing the dislocation density, but also due to the enhancement of the extraction efficiency using the CPSS.

Increased effective reflection and transmission at the GaN-sapphire interface of LEDs grown on patterned sapphire substrates

The effect of patterned sapphire substrate（PSS） on the top-surface（P-Ga N-surface） and the bottomsurface（sapphire-surface） of the light output power（LOP） of Ga N-based LEDs was investigated, in order to study the changes in reflection and transmission of the Ga N-sapphire interface. Experimental research and computer simulations were combined to reveal a great enhancement in LOP from either the top or bottom surface of Ga N-based LEDs, which are prepared on patterned sapphire substrates（PSS-LEDs）. Furthermore, the results were compared to those of the conventional LEDs prepared on the planar sapphire substrates（CSS-LEDs）. A detailed theoretical analysis was also presented to further support the explanation for the increase in both the effective reflection and transmission of PSS-Ga N interface layers and to explain the causes of increased LOP values. Moreover, the bottom-surface of the PSS-LED chip shows slightly increased light output performance when compared to that of the top-surface. Therefore, the light extraction efficiency（LEE） can be further enhanced by integrating the method of PSS and flip-chip structure design.

Low threading dislocation density in GaN films grown on patterned sapphire substrates

The growth process of three-dimensional growth mode（3D） switching to two-dimensional growth mode （2D） is investigated when GaN films are grown on cone-shaped patterned sapphire substrates by metal-organic chemical vapor deposition.The growth condition of the 3D-2D growth process is optimized to reduce the threading dislocation density（TDD）.It is found that the condition of the 3D layer is critical.The 3D layer keeps growing under the conditions of lowⅤ/Ⅲratio,low temperature,and high pressure until its thickness is comparable to the height of the cone-shaped patterns.Then the 3D layer surrounds the cone-shaped patterns and has inclined side facets and a top（0001） plane.In the following 2D-growth process,inclined side facets coalesce quickly and the interaction of TDs with the side facets causes the TDs to bend over.As a result,the TDD of GaN films can decrease to 1×10~8 cm^（-2）,giving full-width at half maximum values of 211 and 219 arcsec for（002） and（102） omega scans, respectively.

Threading dislocation density comparison between GaN grown on the patterned and conventional sapphire substrate by high resolution X-ray diffraction

GaN epifilms are grown on the patterned sapphire substrates (PSS) (0001) and the conventional sapphire substrates (CSS) (0001) by metal-organic chemical vapor deposition (MOCVD) using a novel two-step growth. High resolution X-ray diffraction (HR-XRD) is used to investigate the threading dislocation (TD) density of the GaN epifilms. The TD density is calculated from the ω-scans full width at half maximum (FWHM) results of HR-XRD. The edge dislocation destiny of GaN grown on the PSS is 2.7×108 cm-2, which is less than on the CSS. This is confirmed by the results of atomic force microscopy (AFM) measurement. The lower TD destiny indicates that the crystalline quality of the GaN epifilms grown on the PSS is improved compared to GaN epifilms grown on the CSS. The residual strains of GaN grown on the PSS and CSS are compared by Raman Scattering spectra. It is clearly seen that the residual strain in the GaN grown on PSS is lower than on the CSS.

Selective Growth of GaN on Slope Cone-shaped Patterned Sapphire Substrate

Cone-shaped patterned sapphire substrate was prepared by inductively coupled plasma etching and GaN nucleation layer was grown on it by metal-organic chemical vapor deposition.A selective growth of GaN nucleation layer was found on the slope of the cone-shaped patterned sapphire substrat,and the distribution morphology of GaN had significantly changed after it was recrystallized.GaN selective growth and redistribution were analyzed by investigating the distribution of crystallographic planes on the cone surface and the atom array of specific planes at atom level.

Formation mechanism of subtrenches on cone-shaped patterned sapphire substrate

In this paper, the cone-shaped patterned sapphire substrates (PSS) were etched by an inductively couple plasma with BCl 3 as the reacting gas. The influence of the operating pressure and the RF bias power on subtrenches of the cone-shaped PSS and the formation mechanism of subtrenches were investigated. The profiles of patterns were characterized by FESEM (field emission scanning electron microscope). It showed that the subtrench size varied with the operating pressure and the RF bias power. As the operating pressure increased from 0.2 Pa to 0.9 Pa, the subtrenches changed from narrow and deep to wide and shallow; then to narrower and shallower. When the RF bias power varied from 200 W to 600 W, the subtrenches gradually became noticeable. The FESEM results also indicated that the subtrenches were formed due to the ion scattering effect which was caused by tapered sidewalls and charges accumulation. It is discovered that the scattering effect is closely related with the operating pressure and RF bias power.

基于PSS刻蚀平台的真空微气压控制研究

针对当前图形化蓝宝石衬底ICP干法工艺刻蚀流程,对工艺腔室真空环境微气压调节非线性特征进行了动态监测,本文提出了一种基于自适应模糊PID的微气压控制算法。该算法利用质量流量计MFC及真空泵组减压阀的参数调节,实现真空环境微气压调节。通过Matlab仿真及刻蚀流程气压控制测试表明,工艺腔室的真空微气压自适应模糊PID控制基本符合仿真结果。在气压为0.13～20Pa的真空环境下,工艺腔室气压动态控制效果良好,具有鲁棒性强、超调量小、过渡时间短等特点,满足工艺刻蚀流程中正常刻蚀速率、选择比及均匀性等指标。

PSS侧壁弧度优化及对GaN基LED出光效率的影响

为进一步提高基于图形化蓝宝石衬底(PSS)技术的氮化镓(GaN)基LED的出光效率,针对PSS微结构的侧壁弧度进行了优化设计。研究实验采用感应耦合等离子体(ICP)干法刻蚀技术,通过优化三氟甲烷(CHF3)和三氯化硼(BCl3)气体体积流量比,实现了对微结构侧壁弧度的有效调控。此外,对各种类型GaN基LED芯片的光学特性进行了测试表征,并结合蒙特卡罗光线追迹方法模拟了PSS微结构的侧壁弧度变化对LED轴向、侧面和总出光效率的影响。实验和理论模拟结果表明,微结构的侧壁弧度对LED出光效率有显著影响,当微结构侧壁中心到内接圆锥侧壁中心的距离为(150±10)nm时,LED的出光效率将进一步提高8.9%。

全自动湿法刻蚀系统在PSS制程中的应用

介绍了图形化蓝宝石衬底的工艺制程,以及湿法刻蚀的工作原理,针对图形化蓝宝石衬底湿法刻蚀过程中的难点,最大程度上提高全自动湿法刻蚀系统的温度控制以及安全防护功能,使得全自动湿法刻蚀系统在图形化蓝宝石衬底的制备过程中发挥最大优势。

The growth and characterization of GaN films on cone-shaped patterned sapphire by MOCVD

GaN films are grown on cone-shaped patterned sapphire substrates （CPSSs） by metal-organic chemical vapor deposition, and the influence of the temperature during the middle stage of GaN growth on the threading dislocation （TD） density of GaN is investigated. High-resolution X-ray diffraction （XRD） and cathodeluminescence （CL） were used to characterize the GaN films. The XRD results showed that the edge-type dislocation density of GaN grown on CPSS is remarkably reduced compared to that of GaN grown on conventional sapphire substrates （CSSs）. Furthermore, when the growth temperature in the middle stage of GaN grown on CPSS decreases, the full width at half maximum of the asymmetry （102） plane of GaN is reduced. This reduction is attributed to the enhancement of vertical growth in the middle stage with a more triangular-like shape and the bending of TDs. The CL intensity spatial mapping results also showed the superior optical properties of GaN grown on CPSS to those of GaN on CSS, and that the density of dark spots of GaN grown on CPSS induced by nonradiative recombination is reduced when the growth temperature in the middle stage decreases.

生长在图形化蓝宝石衬底上的GaN薄膜光学性质研究

图形化蓝宝石衬底(PSS)技术作为提高LED发光效率的方法之一,一直备受关注。研究了PSS上生长的GaN薄膜的表面形貌、吸收光谱、红外光谱、拉曼散射(Raman)和太赫兹光谱等,并与常规蓝宝石衬底上的GaN外延薄膜进行对比。结果表明,PSS上生长的GaN外延薄膜的表面形貌、光提取效率(LEE)得到明显改善。此研究成果对进一步提高GaN基短波(蓝/紫光)发光二极管(LED)的发光效率具有一定的借鉴意义,为进一步拓展PSS器件的太赫兹响应提供了依据。

纳米压印技术在光电领域的应用

当前,一种新型纳米压印技术被提出并开始逐步用于后续替代光刻机,纳米压印的基础原理为将硅胶覆盖在一个图形基板上,待硅胶完全与基板贴合后固化,然后剥离掉硅胶,最后将硅胶压到匀胶好的晶片表面进行紫外光照射及加热,从而实现把硅胶表面的图形转移到光刻胶上。纳米压印技术已经广泛应用到图形化蓝宝石衬底上,一种与图形化蓝宝石衬底相接近的新型图形化蓝宝石复合衬底已经被提出并开始商业化,该产品主要采用的依然是原始的光刻方法进行图形化转移,主要论述纳米压印技术在图形化蓝宝石复合衬底为主的光电领域应用的可行性。

图形化蓝宝石衬底工艺研究进展

图形化蓝宝石衬底(PSS)技术是一种提高LED亮度的新技术。结合光刻和刻蚀工艺制作图形化蓝宝石衬底。有关图形化蓝宝石衬底的研究主要集中在对光刻和刻蚀工艺的研究,以及图形化蓝宝石衬底提高LED亮度的机理。目前微米级图形化蓝宝石衬底已经得到普遍的应用,与基于平坦蓝宝石衬底的LED相比,PSS-LED的发光功率提高了30%左右。图形化蓝宝石衬底技术的发展经历了从早期的条纹状图形到目前应用较广的半球形和锥形图形,从湿法刻蚀到干法刻蚀,从微米级到纳米级图形的演变。由于能够显著提高LED亮度,纳米级图形化蓝宝石必将得到广泛的运用。

用于GaN基发光二极管的蓝宝石图形衬底制备进展

近几年,图形化蓝宝石衬底因其作为GaN基发光二极管外延衬底,不仅能降低GaN外延薄膜的线位错密度,还能提高LED的光提取效率而引起国内外许多科研机构的广泛研究兴趣.本文综述了图形化蓝宝石衬底提高GaN基发光二极管性能的作用机理,重点评述了目前图形化蓝宝石衬底的制备方法(湿法刻蚀、干法刻蚀、固相反应)和图形尺寸(微米图形化、纳米图形化),分析比较了不同制备方法和图形尺寸制备蓝宝石图形衬底对GaN基发光二极管性能改善,最后针对蓝宝石图形衬底制备存在的问题对其今后的发展方向做出了展望.

图形化蓝宝石衬底GaN基LED的研究进展

蓝宝石衬底作为发光二极管最常用的衬底,经过不断发展,在克服其与GaN间晶格失配和热膨胀失配问题上,研究人员不断提出解决方案。近期发展起来的图形化衬底技术,除了能减少生长在蓝宝石衬底上GaN之间的差排缺陷,提高磊晶质量以解决失配问题,更能提高LED的出光效率。从衬底图形的形状、尺寸、制备工艺出发,回顾了图形化蓝宝石衬底GaN基LED的研究进展,详细介绍了近年来关于图形化衬底技术与其他技术在提高LED性能方面的结合,总结了图形化蓝宝石衬底应用于大尺寸芯片的优势,并对其未来在大功率照明市场的应用进行了展望。

腐蚀时间对蓝宝石衬底上外延生长GaN质量的影响

使用熔融的KOH在高温下对c面蓝宝石衬底进行不同时间的腐蚀,借助扫描电镜、原子力显微镜对衬底表面进行了表征,然后利用金属有机物化学气相沉积设备在不同腐蚀时间的衬底样品上进行了GaN材料的外延生长。通过X射线衍射结果比较了两组衬底上外延材料的质量,利用原子力显微镜结果对外延层表面形貌进行了分析,最后论述了腐蚀时间的调整对蓝宝石衬底上外延生长氮化镓质量的影响机理。

腔室状态对图形化蓝宝石衬底刻蚀工艺的影响

图形化蓝宝石衬底是近年来针对高度发光二极管的应用要求发展起来的一种新技术。通过利用自主研制的工业化感性耦合等离子体刻蚀机对图形化蓝宝石衬底的刻蚀工艺进行了研究。采用光学发射光谱仪和扫描电镜研究了PSS生产过程中腔室状态的变化对蓝宝石的刻蚀速率、选择比和图形形貌的影响。研究结果表明:随着反应腔累积放电时间的增加,刻蚀速率呈现下降趋势,选择比呈先上升然后下降的趋势。该趋势由反应腔室内表面上的沉积物所引起。

高温预生长对图形化蓝宝石衬底GaN薄膜质量的提高

在图形化蓝宝石衬底生长低温缓冲层之前,通入少量三甲基镓(TMGa)和大量氨气进行短时间的高温预生长,通过改变TMGa流量制备了4个蓝光LED样品。MOCVD外延生长时使用激光干涉仪实时监测薄膜反射率,外延片使用高分辨率X射线衍射(002)面和(102)面摇摆曲线估算位错密度,并使用光致发光谱表征发光性能,制备成芯片后测试了正向电压和输出光功率。结果表明,高温预生长可促进薄膜的横向外延,使得三维岛状GaN晶粒在较小的薄膜厚度内实现岛间合并,有利于降低位错密度,提高外延薄膜质量,LED芯片的输出光功率的增强幅度达29.1%,而电学性能无恶化迹象;但高温预生长工艺中TMGa的流量应适当控制,过量的TMGa导致GaN晶粒过大,将延长岛间合并时间,降低晶体质量。