The high deposition of microcrystalline silicon thin film by very high frequency plasma enhanced chemical vapour deposition and the fabrication of solar cells

This paper reports that the intrinsic microcrystalline silicon （μc-Si：H） films are prepared with plasma enhanced chemical vapour deposition from silane/hydrogen mixtures at 200℃ with the aim to increase the deposition rate. An increase of the deposition rate to 0.88 nm/s is obtained by using a plasma excitation frequency of 75 MHz. This increase is obtained by the combination of a higher deposition pressure, an increased silane concentration, and higher discharge powers. In addition, the transient behaviour, which can decrease the film crystallinity, could be prevented by filling the background gas with H2 prior to plasma ignition, and selecting proper discharging time after silane flow injection. Material prepared under these conditions at a deposition rate of 0.78nm/s maintains higher crystallinity and fine electronic properties. By H-plasma treatment before i-layer deposition, single junction μc-Si：H solar cells with 5.5% efficiency are fabricated.

Influence of ignition condition on the growth of silicon thin films using plasma enhanced chemical vapour deposition

The influences of the plasma ignition condition in plasma enhanced chemical vapour deposition （PECVD） on the interfaces and the microstructures of hydrogenated microcrystalline Si （μc-Si：H） thin films are investigated. The plasma ignition condition is modified by varying the ratio of Sill4 to H2 （RH）. For plasma ignited with a constant gas ratio, the time-resolved optical emission spectroscopy presents a low value of the emission intensity ratio of Ha to Sill＊ （Iuα//SiH＊） at the initial stage, which leads to a thick amorphous incubation layer. For the ignition condition with a profiling RH, the higher IHα/ISiH＊ values are realized. By optimizing the RN modulation, a uniform crystallinity along the growth direction and a denser αc-Si：H film can be obtained. However, an excessively high IRα/ISIH＊ may damage the interface properties, which is indicated by capacitance-voltage （C-V） measurements. Well controlling the ignition condition is critically important for the applications of Si thin films.

Influence of oxygen on the growth of cubic boron nitride thin films by plasma-enhanced chemical vapour deposition

Cubic boron nitride thin films were deposited on silicon substrates by low-pressure inductively coupled plasmaenhanced chemical vapour deposition. It was found that the introduction of 02 into the deposition system suppresses both nucleation and growth of cubic boron nitride. At a B2H6 concentration of 2.5% during film deposition, the critical O2 concentration allowed for the nucleation of cubic boron nitride was found to be less than 1.4%, while that for the growth of cubic boron nitride was higher than 2.1%. Moreover, the infrared absorption peak observed at around 1230- 1280 cm^-1, frequently detected for cubic boron nitride films prepared using non-ultrahigh vacuum systems, appears to be due to the absorption of boron oxide, a contaminant formed as a result of the oxygen impurity. Therefore, the existence of trace oxygen contamination in boron nitride films can be evaluated qualitatively by this infrared absorption peak.

Microstructure evolution and mechanical properties of Ti-B-N coatings deposited by plasma-enhanced chemical vapor deposition

Ternary Ti-B-N coatings were synthesized on AISI 304 and Si wafer by plasma-enhanced chemical vapor deposition (PECVD) technique using a gaseous mixture of TiCl4,BCl3,H2,N2,and Ar.By virtue of X-ray diffraction analysis,X-ray photoelectron spectroscopy,scanning electron microscope,and high-resolution transmission electron microscope,the influences of B content on the microstructure and properties of Ti B N coatings were investigated systematically.The results indicated that the microstructure and mechanical properties of Ti-B-N coatings largely depend on the transformation from FCC-TiN phase to HCP-TiB2 phase.With increasing B content and decreasing N content in the coatings,the coating microstructure evolves gradually from FCC-TiN/a-BN to HCP-TiB2 /a-BN via FCC-TiN+HCP-TiB2/a-BN.The highest microhardness of about 34 GPa is achieved,which corresponds to the nanocomposite Ti-63%B-N (mole fraction) coating consisting of the HCP-TiB2 nano-crystallites and amorphous BN phase.The lowest friction-coefficient was observed for the nanocomposite Ti-41%B-N (mole fraction) coating consisting of the FCC-TiN nanocrystallites and amorphous BN

Effective parameters on diameter of carbon nanotubes by plasma enhanced chemical vapor deposition

The effective parameters on the diameter of carbon nanotubes (CNTs) by plasma enhanced chemical vapor deposition (PECVD) were presented.Among lots of influential parameters,the effects of the catalytic film thickness and the pretreatment plasma power on the growth of CNTs were investigated.The results show that the size of catalytic islands increases by increasing the thickness of catalytic layer,but the density of CNTs decreases.The pretreatment duration time of 30 s is the optimal condition for growing CNTs with about 50 nm in diameter.By increasing the pretreatment plasma power,the diameter of CNTs decreases gradually.However,the diameter of CNTs does not change drastically from 80 to 120 W.The uniformly grown CNTs with the diameter of 50 nm are obtained at the pretreatment plasma power of 100 W.

Characteristics and Electrical Properties of SiNx:H Films Fabricated by Plasma-Enhanced Chemical Vapor Deposition

SiNx：H films with different N/Si ratios are synthesized by plasma-enhanced chemical vapor deposition （PECVD）. Composition and structure characteristics are detected by Fourier transform infrared spectroscopy （FTIR） and X-ray photoelectron spectroscopy （XPS）. It indicates that Si-N bonds increase with increased NH3/SiH4 ratio. Electrical property investigations by I-V measurements show that the prepared films offer higher resistivity and less leakage current with increased N/Si ratio and exhibit entirely insulating properties when N/Si ratio reaches 0.9, which is ascribed to increased Si-N bonds achieved.

Structural evolution and optical characterization in argon diluted Si:H thin films obtained by plasma enhanced chemical vapor deposition

The structural evolution and optical characterization of hydrogenated silicon(Si:H) thin films obtained by conventional radio frequency(RF) plasma enhanced chemical vapor deposition(PECVD) through decomposition of silane diluted with argon were studied by X-ray diffractometry(XRD),Fourier transform infrared(FTIR) spectroscopy,Raman spectroscopy,transmission electron microscopy(TEM),and ultraviolet and visible(UV-vis) spectroscopy,respectively.The influence of argon dilution on the optical properties of the thin films was also studied.It is found that argon as dilution gas plays a significant role in the growth of nano-crystal grains and amorphous network in Si:H thin films.The structural evolution of the thin films with different argon dilution ratios is observed and it is suggested that argon plasma leads to the nanocrystallization in the thin films during the deposition process.The nanocrystallization initiating at a relatively low dilution ratio is also observed.With the increase of argon portion in the mixed precursor gases,nano-crystal grains in the thin films evolve regularly.The structural evolution is explained by a proposed model based on the energy exchange between the argon plasma constituted with Ar* and Ar+ radicals and the growth regions of the thin films.It is observed that both the absorption of UV-vis light and the optical gap decrease with the increase of dilution ratio.

Electron field emission characteristics of nano-catkin carbon films deposited by electron cyclotron resonance microwave plasma chemical vapour deposition

This paper reported that the nano-catkin carbon films were prepared on Si substrates by means of electron cyclotron resonance microwave plasma chemical vapour deposition in a hydrogen and methane mixture. The surface morphology and the structure of the fabricated films were characterized by using scanning electron microscopes and Raman spectroscopy, respectively. The stable field emission properties with a low threshold field of 5V/μm corresponding to a current density of about 1μA/cm^2 and a current density of 3.2mA/cm^2 at an electric field of 10V/μm were obtained from the carbon film deposited at CH4 concentration of 8%. The mechanism that the threshold field decreased with the increase of the CH4 concentration and the high emission current appeared at the high CH4 concentration was explained by using the Fowler-Nordheim theory.

Field emission characteristics of nano-sheet carbon films deposited by quartz-tube microwave plasma chemical vapour deposition

Nano-sheet carbon films are prepared on Si wafers by means of quartz-tube microwave plasma chemical vapour deposition （MPCVD） in a gas mixture of hydrogen and methane. The structure of the fabricated films is investigated by using field emission scanning electron microscope （FESEM） and Raman spectroscopy. These nano^carbon films are possessed of good field emission （FE） characteristics with a low threshold field of 2.6 V/μm and a high current density of 12.6 mA/cm^2 at an electric field of 9 V/μm. As the FE currents tend to be saturated in a high E region, no simple Fowler-Nordheim （F-N） model is applicable. A modified F N model considering statistic effects of FE tip structures and a space-charge-limited-current （SCLC） effect is applied successfully to explaining the FE data observed at low and high electric fields, respectively.

Structural Evolution of SiC Films During Plasma-Assisted Chemical Vapour Deposition

Evolution of chemical bonding configurations for the films deposited from hexam- ethyldisiloxane （HMDSO） diluted with H2 during plasma assisted chemical vapour deposition is investigated. In the experiment a small amount of CH4 was added to adjust the plasma environment and modify the structure of the deposited films. The measurements of Raman spectroscopy and X-ray diffraction （XRD） revealed the production of 6H-SiC embedded in the amorphous matrix without the input of CH4. As CH4 was introduced into the deposition reaction, the transition of 6H-SiC to cubic SiC in the films took place, and also the film surfaces changed from a structure of ellipsoids to cauliflower-like shapes. With a further increase of CH4 in the flow ratio, the obtained films varied from Si-C bonding dominant to a sp^2/sp^3 carbon-rich composition.

Preparation of TiO2/MCM-41 by plasma enhanced chemical vapor deposition method and its photocatalytic activity

Titanium dioxide is coated on the surface of MCM-41 wafer through the plasma enhanced chemical vapor deposition （PECVD） method using titanium isopropoxide （TTIP） as a precursor. Annealing temperature is a key factor affecting crystal phase of titanium dioxide. It will transform an amorphous structure to a polycrystalline structure by increasing temperature. The optimum anatase phase of TiO2 which can acquire the best methanol conversion under UV-light irradiation is obtained under an annealing temperature of 700℃ for 2 h, substrate tem- perature of 500~C, 70 mL. min1 of oxygen flow rate, and 100W of plasma power. In addition, the films are composed of an anatase-rutile mixed phase, and the ratio of anatase to rutile varies with substrate temperature and oxygen flow rate. The particle sizes of titanium dioxide are between 30.3 nm and 59.9nm by the calculation of Scherrer equation. Under the reaction conditions of ll6.8mg.L-1 methanol, 2.9mg.L-1 moisture, and 75~C of reaction temperature, the best conversion of methanol with UV-light is 48.2% by using the anatase-rutile （91.3/ 8.7） mixed phase TiO2 in a batch reactor for 60 min. While under fluorescent light irradiation, the best photoactivity appears by using the anatase-rutile （55.4/44.6） mixed phase TiO2 with a conversion of 40.0%.

High rate deposition of microcrystalline silicon films by high-pressure radio frequency plasma enhanced chemical vapor deposition (PECVD)

Hydrogenated microcrystalline silicon (μc-Si:H) thin films were prepared by high- pressure radio-frequency (13.56 MHz) plasma enhanced chemical vapor deposition (rf-PECVD) with a screened plasma. The deposition rate and crystallinity varying with the deposition pressure, rf power, hydrogen dilution ratio and electrodes distance were systematically studied. By optimizing the deposition parameters the device quality μc-Si:H films have been achieved with a high deposition rate of 7.8 /s at a high pressure. The Voc of 560 mV and the FF of 0.70 have been achieved for a single-junction μc-Si:H p-i-n solar cell at a deposition rate of 7.8 /s.

Enhanced field emission characteristics of thin-Au-coated nano-sheet carbon films

This paper reports that the nano-sheet carbon films （NSCFs） were fabricated on Si wafer chips with hydrogen- methane gas mixture by means of quartz-tube-type microwave plasma chemical vapour deposition （MWPCVD）. In order to further improve the field emission （FE） characteristics, a 5-nm Au film was prepared on the samples by using electron beam evaporation. The FE properties were obviously improved due to depositing Au thin film on NSCFs. The FE current density at a macroscopic electric field, E, of 9 V/μm was increased from 12.4 mA/cm2 to 27.2 mA/cm2 and the threshold field was decreased from 2.6 V/μm to 2.0 V/μm for Au-coated carbon films. A modified F-N model considering statistic effects of FE tip structures in the low E region and a space-chavge-limited-current effect in the high E region were applied successfully to explain the FE data of the Au-coated NSCF.

Synthesis of ZnO films with a special texture and enhanced field emission properties

ZnO films with special textures ave fabricated on Mo-coated Al2O3 ceramic substrates by the catalyst-free electron beam evaporation method, and the as-deposited films are treated by hydrogen plasma. It is found that the surface morphologies of the films are changed significantly after hydrogen plasma treatment and that the films consist of vertically standing and intersecting nanosheets. A lower turn-on field of 1.2 V/μm and an enhanced current density -0.11 mA/cm2 at 2.47 V/μm are achieved. The low threshold field and the high emission current density are attributed primarily to the unique shape and smaller resistivity of the ZnO nanosheet films.

PCVD TiN膜的界面制备及性能

用TiCl4作为反应气体制备PCVDTiN镀层，对降低界面的氧含量，改善PCVDTiN镀层的界面性能进行了研究。在镀层制备过程中增加了界面制备过程，即采用氩离子轰击以及氢的反应使界面的氯含量降低，膜基界面得到改善。结果表明，与常规PCVD制备的TiN镀层相比，膜层的结合强度有大幅度的提高，耐磨性和耐蚀性均有改善，特别是其耐蚀性达到甚至超过奥氏体不锈钢的水平。

烧结NdFeB磁体表面Zn-Al/T8超疏水复合涂层的显微组织及耐蚀性

为提升烧结NdFeB磁体的耐蚀性,采用旋涂法和等离子体增强化学气相沉积技术在其表面制备Zn-Al/T8(2-全氟辛基乙基丙烯酸酯)超疏水复合涂层。结果表明,Zn-Al涂层主要由片层状的Zn和Al相组成,厚度大约为28μm。Zn-Al/T8复合涂层的接触角达到151.78°,而滚动角仅为5.13°,说明Zn-Al/T8复合涂层可提供一个超疏水表面。Zn-Al涂层和Zn-Al/T8复合涂层对烧结NdFeB的磁性能均无显著影响。Zn-Al涂层通过牺牲阳极来提高NdFeB磁体的耐蚀性,而Zn-Al/T8复合涂层通过超疏水表面进一步提升耐蚀性。Zn-Al/T8复合涂层较Zn-Al涂层具有更好的耐盐雾性能。Zn-Al/T8超疏水复合涂层是一种非常有前途的烧结NdFeB磁体保护涂层。

PCVD技术在模具强化中的应用与进展

介绍了等离子化学气相沉积技术的基本原理,对此技术用于模具强化进行了探讨,并具体阐述了该技术在冷作模具、热作模具、结构复杂塑料模上的应用状况,指出正确运用PCVD技术是提高模具使用寿命的一个有效途径。

DC-PCVD法快速制备Si_3N_4薄膜

采用ＤＣＰＣＶＤ方法，控制工艺参数，在ＧＣｒ１５钢试样上获得４０μｍ厚的、以Ｓｉ３Ｎ４为主要成分的非晶态绝缘薄膜，沉积速率约为３７／ｓ。讨论了沉积速率高的原因。

偏压加强MPCVD法Ir(100)/MgO(100)基片上金刚石异质外延形核

利用自行研制的可调谐圆柱谐振腔式微波等离子体化学气相沉积（MPCVD）装置的结构优势,设计了电极可调节的偏压加强MPCVD装置。采用脉冲激光沉积（PLD）法制备了Ir（100）/MgO（100）基片。采用偏压加强MPCVD装置进行了金刚石异质外延形核的探索,在Ir（100）/MgO（100）基片上实现了金刚石异质外延形核。扫描电镜结果显示,[100]取向的金字塔状外延金刚石晶粒的形核密度达108~109cm-2。