Immersing Treatment of Steel Plate Surface in Steel-Aluminum Solid to Liquid Bonding

The interfacial status of the steel-aluminum solid to liquid bonding plates (their steel plate surfaces were or were not immersed in flux aqueous solution) were measured by using SEM (Scanning Electron Microscope) and X-ray diffraction . The results showed that the layer of flux (the minimum thickness was 15 μm on the steel plate surface) could protect the steel plate surface from oxidizing effectively at high temperature in solid to liquid bonding. The melt temperatUre of the flux should be lower than 580 ℃ so that it could be melted and removed completely. No. 1 flux (patent product made by the author) made up of halogeindes could also force liquid aluminum to infiltrate into steel plate surface and thus the interfacial shear strength of the bonding plate was rather large.

Influence of aluminum solid fraction on property of steel-mushy aluminum bonding plate

The interfacial shear property of steel-mushy aluminum bonding plate was studied, and the relationship between aluminum solid fraction and the interfacial shear strength of bonding plate was determined. The results showed that when aluminum solid fraction is 34.3 %, the maximum interfacial shear strength of bonding plate is 71 .0 MPa.

Semi-solid Processing of Steel-Al-7 Graphite Binding Plate

The bonding of steel plate to Al 7graphite slurry was studied for the first time. The relationship model about preheat temperature of steel plate,solid fraction of Al 7graphite slurry, rolling speed and interfacial shear strength of bonding plate could be established by artificial neural networks perfectly.This model could be optimized with a genetic algorithm.The optimum bonding parameters are:516℃ for preheat temperature of steel plate,32.5% for solid fraction of Al 7graphite slurry and 12mm/s for rolling speed,and the largest interfacial shear strength of bonding plate is 70.6MPa.

The Bonding Properties of Solid Steel to Liquid Aluminum

The bonding of solid steel plate to liquid al uminum was studied using rapid solidification. The relationship models of interf acial shear strength and thickness of interfacial layer of bonding plate vs bond ing parameters (such as preheat temperature of steel plate, temperature of alumi num liquid and bonding time) were respectively established by artificial neural networks perfectly.The bonding parameters for the largest interfacial shear stre ngth were optimized with genetic algorithm successfully. They are 226℃ for preh eating temperature of steel plate, 723℃ for temperature of aluminum liquid and 15.8s for bonding time, and the largest interfacial shear strength of bonding pl ate is 71.6 MPa . Under these conditions, the corresponding reasonable thickne ss of interfacial layer (10.8μm) is gotten using the relationship model establi shed by artificial neural networks.

Thickness of compound layer in steel-aluminum solid to liquid bonding

The bonding of solid steel plate to liquid aluminum was studied using rapidsolidification. The surface of solid steel plate was defatted, descaled, immersed (in K_2ZrF_6 fluxaqueous solution) and stoved. In order to determine the thickness of Fe-Al compound layer at theinterface of steel-aluminum solid to liquid bonding under rapid solidification, the interface ofbonding plate was investigated by SEM (Scanning Electron Microscope) experiment. The relationshipbetween bonding parameters (such as preheat temperature of steel plate, temperature of aluminumliquid and bonding time) and thickness of Fe-Al compound layer at the interface was established byartificial neural networks (ANN) perfectly. The maximum of relative error between the output and thedesired output of the ANN is only 5.4%. From the bonding parameters for the largest interfacialshear strength of bonding plate (226℃ for preheat temperature of steel plate, 723℃ for temperatureof aluminum liquid and 15.8 s for bonding time), the reasonable thickness of Fe-Al compound layer10.8 μm was got.

Propagation of guided waves in a bonded plate:Antiplane shear modes

The displacement and stress as well as the dispersion equation for the guided waves of antiplane shear (SH) modes in a bonded plate are presented explicitly. The spring model is used to account for the interface rigidity between the layers of the bonded plate. It is found that the dispersion equation is composed of the terms pertinent with the welded and the cracked or slip boundary conditions with the compliance sT of the spring model as the sum-coefficients. Numerical results for an adhesive plate of aluminum and steel whose wave velocities are very close to each other of equal thickness indicate that the modes of odd order are more sensitive than the even ones to the variations of the bond quality, and so are the higher modes than the lower ones for this special layered plate. The phenomena of the cut-off frequency-shift and the phase velocity decrease resulting from the degradation of the bond quality are found to the modes of odd order, which may be used to evaluate the bond states of the adhesive plate. Numerical results for an adhesive plate of rubber and steel whose wave velocities are very different to each other of equal thickness are presented and discussed as well.

Lower limit law of welding windows for explosive welding of dissimilar metals

The influence of explosive charge thickness on the quality of explosive welding of dissimilar metals was investigated.The lower limit law should be followed in the course of explosive welding.Three welding experiments of stainless steel（410S）and steel（Q345R）were carried out in three different kinds of explosive charge thicknesses,namely 15,25and 35mm.Interfaces of morphology and mechanical properties of three samples were observed and tested.It was found that micro and small wavy bonding is mainly formed for charge thickness of 15mm whose strength is the highest with minor deformation and few defects in the interface;small and middle wavy bonding are mainly formed for charge thickness of 25 mm whose strength is comparatively mediocre;big wavy bonding is mainly formed for charge thickness of 35 mm whose strength is the lowest.The cause of high bonding strength of the micro and small wavy interface was analyzed and verified on the basis of the results of Electron Probe Micro-Analyzer（EPMA）tests of three selected samples.