As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans ...As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as vari- ous fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.展开更多
The correlations between thermal and physical properties were studied through thermal conductivity measurements, hardness tests, salt spray tests (AASS) among the surface treatment samples named K20, K40 with thicknes...The correlations between thermal and physical properties were studied through thermal conductivity measurements, hardness tests, salt spray tests (AASS) among the surface treatment samples named K20, K40 with thickness of 20, 40 μm respectively and raw sample named K00. In thermal conductivity measurements, there are little differences among the samples as K00, K20 and K40, they exhibit 153.39, 150.69 and 149.76 W/(m·K), respectively. According to hardness tests, K00, K20 and K40 exhibit 87.9, 259.7 and 344.8 in Vickers values. In the result of salt spray tests to examine the effects on corrosion resistance, K00, K20 and K40 exhibit the grade of 3?5, 2.0?9.8 and 10, respectively. The mutual relation of the above results was analyzed. It is found that the surface treatments do not affect the thermal conductivity of aluminum and result in the improvement of physical properties. As a result of the technology, the surface improvement of aluminum alloy specimen is achieved without thermal degradation. It validates the ability of the aluminum plate heat exchangers with surface treatment to enhance the corrosion resistance. Present work is performed as the first fundamental threshold in the process of aluminum plate heat exchangers development to check out its possibility, therefore the next step-experimental and numerical study of practical aluminum plate heat exchangers will be made.展开更多
In this study, integral operational methods are used to investigate the thermally induced transverse vibration of a thin elliptic annulus plate with elastic supports at both radial boundaries.The axisymmetric temperat...In this study, integral operational methods are used to investigate the thermally induced transverse vibration of a thin elliptic annulus plate with elastic supports at both radial boundaries.The axisymmetric temperature distribution is determined by the heat conduction differential equation and its corresponding boundary conditions by employing a unified integral transform technique by use of Mathieu functions and modified Mathieu functions. The solution of thermally induced vibration of the plate with both ends encased with elastic supports is obtained by employing an integral transform for double Laplace differential equation. The thermal moment is derived on the basis of temperature distribution, and its stresses are obtained based on resultant bending moments per unit width. The numerical calculations of the distributions of the transient temperature and its associated stress distributions are shown in the figures.展开更多
This paper deals with the determination of temperature distribution and thermal deflection function of a thin circular plate with the stated conditions. The transient heat conduction equation is solved by using Marchi...This paper deals with the determination of temperature distribution and thermal deflection function of a thin circular plate with the stated conditions. The transient heat conduction equation is solved by using Marchi-Zgrablich transform and Laplace transform simultaneously and the results of temperature distribution and thermal deflection function are obtained in terms of infinite series of Bessel function and it is solved for special case by using Mathcad 2007 software and represented graphically by using Microsoft excel 2007.展开更多
该文分析了膨胀石墨双极板(EGBPs)各向异性结构对燃料电池水热管理与输出性能的影响。建立了三维两相非等温数值模型,对比了4种典型复合材料结构下温度、电流密度、水含量等参数的分布特征,揭示了双极板传热特性与输出性能的耦合效应。...该文分析了膨胀石墨双极板(EGBPs)各向异性结构对燃料电池水热管理与输出性能的影响。建立了三维两相非等温数值模型,对比了4种典型复合材料结构下温度、电流密度、水含量等参数的分布特征,揭示了双极板传热特性与输出性能的耦合效应。结果表明:沿质子传递方向热导率(k_z)对燃料电池性能具有显著影响,在2.2 A cm^(-2)电流密度下,将k_z从常规结构的5 W·m^(-1)·K^(-1)提升至280 W·m^(-1)·K^(-1),可以使输出性能提高22 m V;沿流道气体流动方向的热导率(k_y)是影响散热能力的关键因素,将k_y与k_z提高至280 W·m^(-1)·K^(-1),或者实现各向同性结构(k_x=k_y=k_z=20 W·m^(-1)·K^(-1)),均能够使膜电极组件(MEA)核心区域的温度降低2℃左右。因此,提高k_y与k_z并实现各向同性结构是膨胀石墨双极板技术的未来发展目标之一。展开更多
Achieving high performances of high thermal conductivity and low thermal expansion remains a great challenge. In this study,we have designed and synthesized the ScF_(3)@Cu core-shell composites through a general elect...Achieving high performances of high thermal conductivity and low thermal expansion remains a great challenge. In this study,we have designed and synthesized the ScF_(3)@Cu core-shell composites through a general electroless plating method to coat Cu on the surface of negative thermal expansion particles of ScF_(3). A spatially continuous copper network structure is formed in the present core-shell structure composites to achieve high thermal conductivity and low thermal expansion simultaneously, which is different from the conventional mixed composites. Notably, a high thermal conductivity(136.3 W m^(-1) K^(-1)) has been achieved in the ScF_(3)@Cu-40 core-shell composite with a low thermal expansion property(4.3×10^(-6) K^(-1)). The mechanism of thermal property and microstructure of the present core-shell composites are systematically studied based on different models. Our proposed approach in this study can be widely applicable to numerous advanced materials, which should simultaneously control thermal conductivity and thermal expansion properties.展开更多
文摘As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as vari- ous fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.
文摘The correlations between thermal and physical properties were studied through thermal conductivity measurements, hardness tests, salt spray tests (AASS) among the surface treatment samples named K20, K40 with thickness of 20, 40 μm respectively and raw sample named K00. In thermal conductivity measurements, there are little differences among the samples as K00, K20 and K40, they exhibit 153.39, 150.69 and 149.76 W/(m·K), respectively. According to hardness tests, K00, K20 and K40 exhibit 87.9, 259.7 and 344.8 in Vickers values. In the result of salt spray tests to examine the effects on corrosion resistance, K00, K20 and K40 exhibit the grade of 3?5, 2.0?9.8 and 10, respectively. The mutual relation of the above results was analyzed. It is found that the surface treatments do not affect the thermal conductivity of aluminum and result in the improvement of physical properties. As a result of the technology, the surface improvement of aluminum alloy specimen is achieved without thermal degradation. It validates the ability of the aluminum plate heat exchangers with surface treatment to enhance the corrosion resistance. Present work is performed as the first fundamental threshold in the process of aluminum plate heat exchangers development to check out its possibility, therefore the next step-experimental and numerical study of practical aluminum plate heat exchangers will be made.
文摘In this study, integral operational methods are used to investigate the thermally induced transverse vibration of a thin elliptic annulus plate with elastic supports at both radial boundaries.The axisymmetric temperature distribution is determined by the heat conduction differential equation and its corresponding boundary conditions by employing a unified integral transform technique by use of Mathieu functions and modified Mathieu functions. The solution of thermally induced vibration of the plate with both ends encased with elastic supports is obtained by employing an integral transform for double Laplace differential equation. The thermal moment is derived on the basis of temperature distribution, and its stresses are obtained based on resultant bending moments per unit width. The numerical calculations of the distributions of the transient temperature and its associated stress distributions are shown in the figures.
文摘This paper deals with the determination of temperature distribution and thermal deflection function of a thin circular plate with the stated conditions. The transient heat conduction equation is solved by using Marchi-Zgrablich transform and Laplace transform simultaneously and the results of temperature distribution and thermal deflection function are obtained in terms of infinite series of Bessel function and it is solved for special case by using Mathcad 2007 software and represented graphically by using Microsoft excel 2007.
文摘该文分析了膨胀石墨双极板(EGBPs)各向异性结构对燃料电池水热管理与输出性能的影响。建立了三维两相非等温数值模型,对比了4种典型复合材料结构下温度、电流密度、水含量等参数的分布特征,揭示了双极板传热特性与输出性能的耦合效应。结果表明:沿质子传递方向热导率(k_z)对燃料电池性能具有显著影响,在2.2 A cm^(-2)电流密度下,将k_z从常规结构的5 W·m^(-1)·K^(-1)提升至280 W·m^(-1)·K^(-1),可以使输出性能提高22 m V;沿流道气体流动方向的热导率(k_y)是影响散热能力的关键因素,将k_y与k_z提高至280 W·m^(-1)·K^(-1),或者实现各向同性结构(k_x=k_y=k_z=20 W·m^(-1)·K^(-1)),均能够使膜电极组件(MEA)核心区域的温度降低2℃左右。因此,提高k_y与k_z并实现各向同性结构是膨胀石墨双极板技术的未来发展目标之一。
基金This work was supported by the National Natural Science Foundation of China(Grant Nos.21825102,12004032 and 22001014)the Fundamental Research Funds for the Central Universities,China(Grant Nos.FRF-TP-18-001C2 and FRF-MP-20-40)。
文摘Achieving high performances of high thermal conductivity and low thermal expansion remains a great challenge. In this study,we have designed and synthesized the ScF_(3)@Cu core-shell composites through a general electroless plating method to coat Cu on the surface of negative thermal expansion particles of ScF_(3). A spatially continuous copper network structure is formed in the present core-shell structure composites to achieve high thermal conductivity and low thermal expansion simultaneously, which is different from the conventional mixed composites. Notably, a high thermal conductivity(136.3 W m^(-1) K^(-1)) has been achieved in the ScF_(3)@Cu-40 core-shell composite with a low thermal expansion property(4.3×10^(-6) K^(-1)). The mechanism of thermal property and microstructure of the present core-shell composites are systematically studied based on different models. Our proposed approach in this study can be widely applicable to numerous advanced materials, which should simultaneously control thermal conductivity and thermal expansion properties.