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A substrate-free optical readout focal plane array with a heat sink structure 被引量:1
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作者 刘瑞文 孔延梅 +6 位作者 焦斌斌 李志刚 尚海平 卢狄克 高超群 陈大鹏 张青川 《Journal of Semiconductors》 EI CAS CSCD 2013年第2期46-51,共6页
A substrate-ffee optical readout focal plane array (FPA) operating in 8-12 um with a heat sink structure (HSS) was fabricated and its performance was tested. The temperature distribution of the FPA with an HSS inv... A substrate-ffee optical readout focal plane array (FPA) operating in 8-12 um with a heat sink structure (HSS) was fabricated and its performance was tested. The temperature distribution of the FPA with an HSS investigated by using a commercial FLIR IR camera shows excellent uniformity. The thermal cross-talk effect existing in traditional substrate-free FPAs was eliminated effectively. The heat sink is fabricated successfully by electroplating copper, which provides high thermal capacity and high thermal conductivity, on the frame of substrate-free FPA. The FPA was tested in the optical-readout system, the results show that the response and NETD are 13.6 grey/K (F / # = 0.8) and 588 inK, respectively. 展开更多
关键词 infrared focal plane array substrate-free optical readout heat sink structure
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Thermal analysis of LED lighting system with different fin heat sinks 被引量:2
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作者 侯峰泽 杨道国 张国旗 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2011年第1期50-52,共3页
This paper designs a 3 × 3 light emitting diode (LED) array with a total power of 9 W, presents a thermal analysis of plate fin, in-line and staggered pin fin heat sinks for a high power LED lighting system, an... This paper designs a 3 × 3 light emitting diode (LED) array with a total power of 9 W, presents a thermal analysis of plate fin, in-line and staggered pin fin heat sinks for a high power LED lighting system, and develops a 3D one-fourth finite element (FE) model to predict the system temperature distribution. Three kinds of heat sinks are compared under the same conditions. It is found that LED chip junction temperature is 48.978℃ when the fins of heat sink are aligned alternately. 展开更多
关键词 LED thermal design LED array heat sink
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Improving shipboard electronics cooling system by optimizing the heat sinks configuration
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作者 Hamid Maleki Mohammad Reza Safaei +2 位作者 Arturo S.Leon Taseer Muhammad Truong Khang Nguyen 《Journal of Ocean Engineering and Science》 SCIE 2022年第5期498-508,共11页
With the increase of high-power electrical components in modern ships,especially fully electric ships with electric propulsion drive(EPD),the cooling of EPD electrical components has become particularly important.Prov... With the increase of high-power electrical components in modern ships,especially fully electric ships with electric propulsion drive(EPD),the cooling of EPD electrical components has become particularly important.Providing optimal configurations for heat sinks with high thermal efficiency plays an essential role in this regard.A new technique for improving the efficiency of heat sinks is the utilization of perforated fins.This study examined the effects of perforation geometry(shape and size)on laminar airflow flow and heat transfer characteristics over a perforated plate-fin heat sink.Three-dimensional simulations were conducted using the finite-volume scheme based on the SIMPLE algorithm.In this research,the effects of perforation shape and size on various parameters,e.g.,total drag force,average Nusselt number,perforated fin efficiency(PFE),heat transfer performance enhancement(HTPE),and fin optimization factor(η)were evaluated.The results confirmed that at a specific heat transfer surface area for perforated fins,the highest efficiency is achieved by circular perforations.In contrast,the square perforations due to geometric similarity to rectangular fins could reach the maximum size.Consequently,fins with square perforations could achieve the most optimal configuration.Also,results showed that for a constant perforations size,change in perforations shape improves HTPE,PFE,andηby more than 40%,45%,and 110%,respectively.Also,by modifying perforations size for a specified shape,an increment of more than 35%,40%,and 150%is observed in HTPE,PFE,andη,respectively. 展开更多
关键词 Forced convection Laminar flow Perforated fin plate-fin heat sink Nusselt number
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